| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/07/2007 | WO2007099138A1 Solar cell marking method, and solar cell |
| 09/07/2007 | WO2007098820A1 Method for manufacturing and making planar contact with an electronic apparatus, and correspondingly manufactured apparatus |
| 09/07/2007 | WO2007079122A3 Strip for integrated circuit packages having a maximized usable area |
| 09/07/2007 | WO2007071674A3 On-chip interconnect-stack cooling using sacrificial interconnect segments |
| 09/07/2007 | WO2007067860A3 Low- resistance void-free contacts for eeprom devices |
| 09/07/2007 | WO2007053606A3 Multiple die integrated circuit package |
| 09/06/2007 | US20070208247 Analyte Monitoring Device and Methods of Use |
| 09/06/2007 | US20070207613 Methods for selective removal of material from wafer alignment marks |
| 09/06/2007 | US20070207610 Semiconductor device, semiconductor wafer, and methods of producing same device and wafer |
| 09/06/2007 | US20070207557 Semiconductor chip mounting substrate, a method of producing the same, and a method of mounting a semiconductor chip |
| 09/06/2007 | US20070206366 Method for embedding a component in a base |
| 09/06/2007 | US20070206363 Voltage regulator with welded lead frame connectors and method of making |
| 09/06/2007 | US20070206358 Semiconductor Device |
| 09/06/2007 | US20070206191 Optical Targets |
| 09/06/2007 | US20070205521 Encapsulation of Semiconductor Components |
| 09/06/2007 | US20070205520 Chip package and method for fabricating the same |
| 09/06/2007 | US20070205519 Stacked semiconductor device and device stacking method |
| 09/06/2007 | US20070205518 Layer Between Interfaces of Different Components in Semiconductor Devices |
| 09/06/2007 | US20070205517 Semiconductor Devices and Method for Fabricating the Same |
| 09/06/2007 | US20070205516 Low-k dielectric layer, semiconductor device, and method for fabricating the same |
| 09/06/2007 | US20070205515 Device having a redundant structure |
| 09/06/2007 | US20070205514 Multilayer capacitor and method of manufacturing same |
| 09/06/2007 | US20070205513 Composite board with semiconductor chips and plastic housing composition and method |
| 09/06/2007 | US20070205512 Solder bump structure for flip chip package and method for manufacturing the same |
| 09/06/2007 | US20070205511 Pad part of semiconductor device having optimal capacitance between pins |
| 09/06/2007 | US20070205509 Semiconductor device with battery |
| 09/06/2007 | US20070205508 Bond pad structure for wire bonding |
| 09/06/2007 | US20070205507 Carbon and nitrogen based cap materials for metal hard mask scheme |
| 09/06/2007 | US20070205506 Rf power transistor device with metal electromigration design and method thereof |
| 09/06/2007 | US20070205505 Semiconductor device having capacitors for reducing power source noise |
| 09/06/2007 | US20070205504 Multichip device |
| 09/06/2007 | US20070205503 Package and package assembly of power device |
| 09/06/2007 | US20070205502 Methods and apparatus for thermal isolation in vertically-integrated semiconductor devices |
| 09/06/2007 | US20070205501 Package warpage control |
| 09/06/2007 | US20070205500 Power Semiconductor Module |
| 09/06/2007 | US20070205499 Microelectromechanical microphone packaging system |
| 09/06/2007 | US20070205498 Signal Routing in a Multilayered Printed Circuit Board |
| 09/06/2007 | US20070205497 Lead(Pb)-free electronic component attachment |
| 09/06/2007 | US20070205496 Microelectronic packages and methods therefor |
| 09/06/2007 | US20070205495 Electronic Component With Stacked Semiconductor Chips And Heat Dissipating Means |
| 09/06/2007 | US20070205494 Chip-size package structure and method of the same |
| 09/06/2007 | US20070205493 Semiconductor package structure and method for manufacturing the same |
| 09/06/2007 | US20070205492 MEMS microphone with a stacked PCB package and method of producing the same |
| 09/06/2007 | US20070205491 Insulating material |
| 09/06/2007 | US20070205480 Semiconductor Device |
| 09/06/2007 | US20070205466 Semiconductor device |
| 09/06/2007 | US20070205465 Semiconductor device and fabrication method thereof |
| 09/06/2007 | US20070205450 Semiconductor device and method of manufacturing the same |
| 09/06/2007 | US20070205413 Semiconductor device and manufacturing method thereof |
| 09/06/2007 | US20070205018 Multilayer printed board, electronic apparatus, and packaging method |
| 09/06/2007 | US20070204724 Aerosol method and apparatus, particulate products, and electronic devices made therefrom |
| 09/06/2007 | DE202007009699U1 Überspannungs-Schutzvorrichtung sowie zugehörige Schutzschaltung Surge protection device and associated protection circuit |
| 09/06/2007 | DE202007008148U1 Kühlvorrichtung für eine Grafikkarte Cooling device for a graphics card |
| 09/06/2007 | DE19723202B4 Herstellungsverfahren eines rißfesten Halbleiterbauteils und Herstellungsgerät hierfür Process for manufacturing a rupture resistant semiconductor device and manufacturing apparatus therefor |
| 09/06/2007 | DE112005002353T5 Verfahren zur Herstellung von Sammelleitungen aus Kupfer Process for the preparation of collecting lines of copper |
| 09/06/2007 | DE102007009731A1 Steuerschaltung für eine Halbleitervorrichtung mit Überhitzungsschutzfunktion Control circuit for a semiconductor device having overheating protection function |
| 09/06/2007 | DE102007005920A1 Leiterplatte mit einem eingebetteten Nacktchip und Verfahren derselben Circuit board with an embedded bare chip and method thereof |
| 09/06/2007 | DE102006034964B3 Arrangement has power semiconductor element in power semiconductor module or disc cell, where shaped body is arranged with one cut above element, where contact device is for auxiliary or control connection contact of element |
| 09/06/2007 | DE102006013812A1 Dünnfilmkondensator und Verfahren zur Herstellung desselben, elektronische Anordnung und Leiterplatte Thin film capacitor and methods of manufacturing the same, electronic device and printed circuit board |
| 09/06/2007 | DE102006010463A1 Chip stack arrangement for use in semiconductor field, has two chips with upper and lower sides, and electrically non-conductive supporting units arranged between lower side of one chip and upper side of substrate and made of epoxy resin |
| 09/06/2007 | DE102006009696A1 Bauteil für die Nano- und Molekularelektronik Component for the nano and molecular electronics |
| 09/06/2007 | DE102006008807A1 Power semiconductor module and cooling assembly combination for insulated gate bipolar transistor inverter application, has module with frame-like housing, which stays away from outer edge section of main surface of substrate |
| 09/06/2007 | DE102006008033A1 Kühlkörper mit von Kühlmittel durchströmtem Rohr Heatsink with perfused coolant pipe |
| 09/06/2007 | DE102006005420A1 Stapelbares Halbleiterbauteil und Verfahren zur Herstellung desselben A stackable semiconductor device and method of manufacturing the same |
| 09/06/2007 | DE102006002481B3 Kombinierter Widerstandstemperatursensor Combined resistance temperature sensor |
| 09/06/2007 | DE102005063403A1 Kleber oder Bondmaterial Adhesive or bonding material |
| 09/06/2007 | DE102005047856B4 Halbleiterbauteil mit in Kunststoffgehäusemasse eingebetteten Halbleiterbauteilkomponenten, Systemträger zur Aufnahme der Halbleiterbauteilkomponenten und Verfahren zur Herstellung des Systemträgers und von Halbleiterbauteilen Semiconductor device having embedded in plastic housing compound semiconductor device components, system unit for receiving the semiconductor device components and methods of making the system carrier and semiconductor devices |
| 09/06/2007 | DE102005009164B4 Kontaktanschlussfläche mit Heizerstruktur und Verfahren zum Herstellen oder Betreiben derselben Contact pad with heater structure and method for manufacturing or operating the same |
| 09/06/2007 | DE102004055815B4 Montageplatte für elektronische Bauteile Mounting plate for electronic components |
| 09/06/2007 | DE10137184B4 Verfahren zur Herstellung eines elektronischen Bauteils mit einem Kuststoffgehäuse und elektronisches Bauteil A method of manufacturing an electronic component and electronic component with a Kuststoffgehäuse |
| 09/05/2007 | EP1830614A1 Method for producing substrate having through hole filled with conductive material |
| 09/05/2007 | EP1830414A1 Element mounting substrate and method for manufacturing same |
| 09/05/2007 | EP1830406A1 Power module, method for producing same and air conditioner |
| 09/05/2007 | EP1830405A1 Semiconductor device |
| 09/05/2007 | EP1830404A2 Power semiconductor module and its method of manufacturing |
| 09/05/2007 | EP1830403A2 A heat sink with a centrifugal fan |
| 09/05/2007 | EP1830402A2 A spiral inductor formed in a semiconductor substrate and a method for forming the inductor |
| 09/05/2007 | EP1830398A1 Au BONDING WIRE FOR SEMICONDUCTOR ELEMENT |
| 09/05/2007 | EP1829441A1 Cooling system and method |
| 09/05/2007 | EP1829106A2 Body-biased pmos protection against electrotatic discharge |
| 09/05/2007 | EP1829105A1 Microwave miniature casing and method for producing this casing |
| 09/05/2007 | EP1230678B1 Self-aligned metal caps for interlevel metal connections |
| 09/05/2007 | CN200944725Y 散热器结构 Radiator structure |
| 09/05/2007 | CN200944724Y Radiating fin structure |
| 09/05/2007 | CN200944723Y Heat abstractor |
| 09/05/2007 | CN200944722Y 改进的散热器结构 Improved heat sink structure |
| 09/05/2007 | CN200944717Y Assembling units and heat radiation module having the same |
| 09/05/2007 | CN200944403Y Infrared remote control receiving amplifier of outer shielding structure |
| 09/05/2007 | CN200944402Y Carrier tape for integrated circuit package |
| 09/05/2007 | CN200944401Y Radiating fin structure |
| 09/05/2007 | CN101032024A Gate stacks |
| 09/05/2007 | CN101032023A 半导体装置 Semiconductor device |
| 09/05/2007 | CN101032022A Cu-Mo substrate and method for producing same |
| 09/05/2007 | CN101032021A Low profile, chip-scale package and method of fabrication |
| 09/05/2007 | CN101032007A Method for forming copper wiring |
| 09/05/2007 | CN101031784A 半导体集成电路 The semiconductor integrated circuit |
| 09/05/2007 | CN101031751A High power led electro-optic assembly |
| 09/05/2007 | CN101031616A Semiconductor-sealing epoxy resin composition and semiconductor device sealed therewith |
| 09/05/2007 | CN101031612A Underfill material to reduce ball limiting metallurgy delamination and cracking potential in semiconductor devices |
| 09/05/2007 | CN101031602A Epoxy resin composition for sealing optical semiconductor |