| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 09/05/2007 | CN101031519A Method of forming a coating on a substrate, and a coating thus formed |
| 09/05/2007 | CN101031518A Glass for semiconductor sealing, sheath tube for semiconductor sealing and semiconductor electronic part |
| 09/05/2007 | CN101031426A 集成电路和制造方法 Integrated circuits and manufacturing methods |
| 09/05/2007 | CN101031384A Silver-coated ball and method for manufacturing same |
| 09/05/2007 | CN101031195A A heat sink with a centrifugal fan |
| 09/05/2007 | CN101030613A Crystal-coated light-emitting diodes packing structure and method |
| 09/05/2007 | CN101030612A Packing structure and method |
| 09/05/2007 | CN101030594A 电光装置 Electro-optical device |
| 09/05/2007 | CN101030592A A magnetic memory element |
| 09/05/2007 | CN101030591A Telescopic-lattice chip for silicon-based tellurium-cadmium mercury device |
| 09/05/2007 | CN101030588A Array base plate and its production |
| 09/05/2007 | CN101030587A Pixel structure and its production |
| 09/05/2007 | CN101030583A Thin-film transistor array and its repairing method |
| 09/05/2007 | CN101030578A Semiconductor integrated circuit apparatus and method of designing the same |
| 09/05/2007 | CN101030577A Electronic substrate, semiconductor device, and electronic device |
| 09/05/2007 | CN101030576A Electronic substrate, semiconductor device, and electronic device |
| 09/05/2007 | CN101030574A High-voltage tolerant power-rail electrostatic discharge protection circuit for mixed-voltage i/o interface |
| 09/05/2007 | CN101030573A Semiconductor chip, semiconductor device and method for manufacturing semiconductor device |
| 09/05/2007 | CN101030571A Commutating diode device and its production |
| 09/05/2007 | CN101030570A 半导体装置 Semiconductor device |
| 09/05/2007 | CN101030569A Packing component for decreasing electromagnetic-wave disturbance |
| 09/05/2007 | CN101030568A 半导体器件和金属互连 Semiconductor devices and metal interconnects |
| 09/05/2007 | CN101030567A Construction of rear-channel connected medium stacked layer |
| 09/05/2007 | CN101030566A 半导体结构及其形成方法 And method of forming a semiconductor structure |
| 09/05/2007 | CN101030565A High-frequency IC circuit packing structure and its production |
| 09/05/2007 | CN101030564A Multi-row lead frame |
| 09/05/2007 | CN101030563A Electron device |
| 09/05/2007 | CN101030562A Heat sink for semiconductor package |
| 09/05/2007 | CN101030561A Semiconductor device and method of fabricating the same |
| 09/05/2007 | CN101030557A Semiconductor device and process for producing the same |
| 09/05/2007 | CN101030555A Pixel structure and its production |
| 09/05/2007 | CN101030547A Testing circuit and testing method for semiconductor device and semiconductor chip |
| 09/05/2007 | CN101030545A Method for producing image-pickup assembly and camera module |
| 09/05/2007 | CN101030544A Method for packing photoelectric device |
| 09/05/2007 | CN101030091A Radiator of notebook computer |
| 09/05/2007 | CN101029165A Epoxy-resin mould plastic for packing IC circuit and its production |
| 09/05/2007 | CN100336426C Multilayer printed wiring board and method ofr producing multilayer printed wiring board |
| 09/05/2007 | CN100336425C Hybrid integrated circuit device |
| 09/05/2007 | CN100336230C Multi finger-like transistor |
| 09/05/2007 | CN100336226C 半导体器件 Semiconductor devices |
| 09/05/2007 | CN100336225C 电子电路装置 Electronic circuit means |
| 09/05/2007 | CN100336223C 半导体装置 Semiconductor device |
| 09/05/2007 | CN100336221C Modularized device of stackable semiconductor package and preparing method |
| 09/05/2007 | CN100336220C Integrated core microelectronic package and its mfg. method |
| 09/05/2007 | CN100336219C Structure comprising a barrier layer of a tungsten alloy and manufacturing method thereof |
| 09/05/2007 | CN100336218C High-frequency IC multi-bus knot tying structure and method |
| 09/05/2007 | CN100336217C Lead wire, resin closed semiconductor device and its mfg. method |
| 09/05/2007 | CN100336216C Thin thermally enhanced flip chip in a leaded molded package and package method thereof |
| 09/05/2007 | CN100336215C Micron level chip packing structure |
| 09/05/2007 | CN100336214C Semiconductor device |
| 09/05/2007 | CN100336213C Controlled impedance transmission lines in a redistribution layer |
| 09/05/2007 | CN100336212C Heat radiating module |
| 09/05/2007 | CN100336211C Radiating assembly of integrated circuit for portable computer |
| 09/05/2007 | CN100336210C Barrier layer made of a curable resin containing polymeric polyol |
| 09/05/2007 | CN100336209C Hybrid integrated circuit device and manufacturing method of the same |
| 09/05/2007 | CN100336208C 半导体装置 Semiconductor device |
| 09/05/2007 | CN100336207C Semiconductor device and its manufacturing method |
| 09/05/2007 | CN100336206C Electronic circuit apparaus |
| 09/05/2007 | CN100336198C Semiconductor device and producing method thereof |
| 09/05/2007 | CN100336190C Method for producing semiconductor and semiconductor device |
| 09/05/2007 | CN100336186C Method for forming nickel silicide and semiconductor device |
| 09/05/2007 | CN100336183C Method for production of dielectric layers using polyfunctional carbosilanes |
| 09/05/2007 | CN100336177C Method and device for cutting wire formed on semiconductor substrate |
| 09/05/2007 | CN100336164C Method for producing semiconductor device |
| 09/05/2007 | CN100336063C System and method for product yield prediction |
| 09/05/2007 | CN100335969C Method of treatment of porous dielectric films to reduce damage during cleaning |
| 09/05/2007 | CN100335950C Chip-mounted film package |
| 09/05/2007 | CN100335586C Wiring-connecting material and process for producing circuit board with the same |
| 09/05/2007 | CN100335585C Wiring-connecting material and process for producing circuit board with the same |
| 09/05/2007 | CN100335584C Wiring-connecting material and process for producing circuit board with the same |
| 09/05/2007 | CN100335541C Method for preparing composition of epoxy resin for packaging semiconductor |
| 09/05/2007 | CN100335523C Process for producing high-purity epoxy resin and epoxy resin composition |
| 09/04/2007 | US7265995 Array capacitors with voids to enable a full-grid socket |
| 09/04/2007 | US7265983 Power unit comprising a heat sink, and assembly method |
| 09/04/2007 | US7265982 Semiconductor device |
| 09/04/2007 | US7265979 Cooling integrated circuits using a cold plate with two phase thin film evaporation |
| 09/04/2007 | US7265978 Control apparatus having fluid passage for cooling purpose |
| 09/04/2007 | US7265916 Module for optical devices, and manufacturing method of module for optical devices |
| 09/04/2007 | US7265850 Fortified, compensated and uncompensated process-sensitive scatterometry targets |
| 09/04/2007 | US7265580 Semiconductor-integrated circuit utilizing magnetoresistive effect elements |
| 09/04/2007 | US7265566 Semiconductor component arrangement having a temperature-based defect identification |
| 09/04/2007 | US7265454 Semiconductor device and method of producing high contrast identification mark |
| 09/04/2007 | US7265453 Semiconductor component having dummy segments with trapped corner air |
| 09/04/2007 | US7265452 System and method for increasing the strength of a bond made by a small diameter wire in ball bonding |
| 09/04/2007 | US7265451 Semiconductor and method for producing a semiconductor |
| 09/04/2007 | US7265450 Semiconductor device and method for fabricating the same |
| 09/04/2007 | US7265449 Tape circuit substrate, semiconductor chip package including the same, and liquid crystal display device including the semiconductor chip package |
| 09/04/2007 | US7265448 Interconnect structure for power transistors |
| 09/04/2007 | US7265447 Interconnect with composite layers and method for fabricating the same |
| 09/04/2007 | US7265446 Mounting structure for semiconductor parts and semiconductor device |
| 09/04/2007 | US7265445 Integrated circuit package |
| 09/04/2007 | US7265444 Resin molded semiconductor device |
| 09/04/2007 | US7265443 Wire bonded semiconductor device having low inductance and noise |
| 09/04/2007 | US7265442 Stacked package integrated circuit |
| 09/04/2007 | US7265441 Stackable single package and stacked multi-chip assembly |
| 09/04/2007 | US7265440 Methods and apparatus for packaging integrated circuit devices |
| 09/04/2007 | US7265439 Low cost, high speed, high efficiency infrared transceiver |
| 09/04/2007 | US7265438 RF seal ring structure |
| 09/04/2007 | US7265436 Non-repeated and non-uniform width seal ring structure |
| 09/04/2007 | US7265430 Semiconductor device, magnetic sensor, and magnetic sensor unit |