Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2007
08/16/2007US20070187830 Semiconductor apparatus including a radiator for diffusing the heat generated therein
08/16/2007US20070187829 Nonvolatile memory cell comprising a chalcogenide and a transition metal oxide
08/16/2007US20070187828 Ild layer with intermediate dielectric constant material immediately below silicon dioxide based ild layer
08/16/2007US20070187827 Semiconductor package, stack package using the same package and method of fabricating the same
08/16/2007US20070187826 3-d package stacking system
08/16/2007US20070187825 Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument
08/16/2007US20070187824 Semiconductor device with signal line having decreased characteristic impedance
08/16/2007US20070187823 Semiconductor device
08/16/2007US20070187822 Patterned gold bump structure for semiconductor chip
08/16/2007US20070187821 Chip with bump structure
08/16/2007US20070187820 Semiconductor device
08/16/2007US20070187819 Semiconductor device
08/16/2007US20070187817 Power semiconductor modules and method for producing them
08/16/2007US20070187816 Semiconductor component with semiconductor chip and adhesive film, and method for its production
08/16/2007US20070187815 Encapsulation and methods thereof
08/16/2007US20070187814 System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices
08/16/2007US20070187813 UV blocking and crack protecting passivation layer
08/16/2007US20070187812 Method for processing copper surface, method for forming copper pattern wiring and semiconductor device manufactured using such method
08/16/2007US20070187811 Stacked chip semiconductor device and method for manufacturing the same
08/16/2007US20070187810 Package on package with cavity and method for manufacturing thereof
08/16/2007US20070187809 RFIC die and package
08/16/2007US20070187808 Customizable power and ground pins
08/16/2007US20070187807 Multi-chip module for battery power control
08/16/2007US20070187806 Semiconductor chip package mounting structure implementing flexible circuit board
08/16/2007US20070187805 COL-TSOP with nonconductive material for reducing package capacitance
08/16/2007US20070187804 Monolithic integrated circuit
08/16/2007US20070187803 Plasma Enhanced Deposited, Fully Oxidized PSG Film
08/16/2007US20070187791 Solid state imaging device and producing method thereof
08/16/2007US20070187765 Wire bond and redistribution layer process
08/16/2007US20070187764 Method for manufacturing semiconductor integrated circuit device
08/16/2007US20070187763 Semiconductor apparatus
08/16/2007US20070187762 Integrated circuit device and electronic instrument
08/16/2007US20070187679 Technique for evaluating a fabrication of a die and wafer
08/16/2007US20070187142 Method for fabricating a through-hole interconnection substrate and a through-hole interconnection substrate
08/16/2007US20070187074 Heat dissipating apparatus having micro-structure layer and method of fabricating the same
08/16/2007US20070186561 Cooling apparatus
08/16/2007US20070186414 Multilayer wiring board incorporating carbon fibers and glass fibers
08/16/2007DE19721322B4 Elektrostatische Entladungsschutzeinrichtung Electrostatic discharge protection device
08/16/2007DE112005002369T5 Verfahren zur Herstellung eines Halbleitergehäuses und Aufbau desselben The same process for producing a semiconductor package structure and
08/16/2007DE10349908B4 Zweifach passiviertes Leistungshalbleiterbauelement mit einer MESA Randstruktur und Verfahren zu dessen Herstellung Dual passivated power semiconductor device having a mesa edge structure and process for its preparation
08/16/2007DE10244570B4 Liner-Schicht mit geringer Stufenüberdeckung zur Verbesserung des Kontaktwiderstands bei W-Kontakten Liner layer with low step coverage to improve the contact resistance at W contacts
08/16/2007DE10229067B4 Optoelektronisches Bauelement und Verfahren zu dessen Herstellung Optoelectronic component and process for its preparation
08/16/2007DE10222958B4 Verfahren zur Herstellung eines organischen elektro-optischen Elements und organisches elektro-optisches Element A method of manufacturing an organic electro-optical element and an organic electro-optical element
08/16/2007DE102006029334A1 Material zum Ausbilden eines Belichtungslicht blockierenden Films, mehrschichtige Verbindungsstruktur und Herstellungsverfahren dafür, und Halbleitervorrichtung Material for forming an exposure light-blocking film, multilayer interconnection structure and manufacturing method therefor, and the semiconductor device
08/16/2007DE102006027482B3 Gehauste Halbleiterschaltungsanordnung mit Kontakteinrichtung Gehauste semiconductor circuit with contactor
08/16/2007DE102006007040A1 Bauelement mit integriertem Heizelement und Verfahren zum Beheizen eines Halbleiterkörpers Device with an integrated heating element and method for heating a semiconductor body
08/16/2007DE102006005994A1 Semiconductor component e.g. semiconductor chip useful in semiconductor wafer comprises semiconductor substrate having active area region, interspace between carrier and covering filled with underfiller material
08/16/2007DE102006005746A1 Anordnung eines elektrisch zu kontaktierenden Bauteils, insbesondere Anordnung eines Sensors, vorzugsweise eines MR-Sensors für Positions- und Winkelmesssysteme Arrangement of electrically contacting component, in particular arrangement of a sensor, preferably an MR sensor for position and angle measuring systems
08/16/2007DE102006005445A1 Leistungshalbleitermodul The power semiconductor module
08/16/2007DE102006005419A1 Semiconductor component for electronic device, includes walls with photolithographically patterned polymer, and cavity covering having polymer layer, where molecular chains of the polymers are crosslinked to form stable cavity housing
08/16/2007DE102005056907B3 3-dimensionales Mehrchip-Modul 3-dimensional multi-chip module
08/16/2007DE102005001590B4 BOC-Package BOC Package
08/16/2007DE10146353B4 Verfahren zur Herstellung einer Lötperle und Lötperlenstruktur A method for preparing a solder bump and Lötperlenstruktur
08/16/2007DE10134011B4 Trägersubstrat, das zur Kontaktierung mit einer integrierten Schaltung vorgesehen ist Carrier substrate, which is provided for contacting with an integrated circuit
08/15/2007EP1818988A2 Integrated circuit chip and package
08/15/2007EP1818986A2 Semiconductor device
08/15/2007EP1818985A1 Interconnection structure and manufacturing method
08/15/2007EP1818984A2 Semiconductor chip with multiple rows of bond pads
08/15/2007EP1818983A2 Three phase inverter power stage and assembly
08/15/2007EP1818982A2 Assembly of at least one power semiconductor module and a cooling element and associated method of manufacturing
08/15/2007EP1818981A1 Power semiconductor modul with contact arrangement
08/15/2007EP1818980A2 Substrate for high voltage modules
08/15/2007EP1818979A1 Electronic component and production method therefor
08/15/2007EP1818975A2 Multilayer printed circuit board and multilayer printed circuit board manufacturing method
08/15/2007EP1818351A1 Underfill encapsulant for wafer packaging and method for its application
08/15/2007EP1818311A1 Phosphorus-containing coated magnesium oxide powder, method for producing same and resin composition containing such powder
08/15/2007EP1817794A1 Rectangular semiconductor support for microelectronics and method for making same
08/15/2007EP1817793A1 Methods for forming co-planar wafer-scale chip packages
08/15/2007EP1817746A1 Secure sensor chip
08/15/2007EP1817544A2 Overlay measurement target
08/15/2007EP1817439A1 Non-evaporable getter alloys for hydrogen sorption
08/15/2007EP1700256B1 Protection for an integrated circuit chip containing confidential data
08/15/2007EP1516031B1 Heat curable adhesive composition, article, semiconductor apparatus and method
08/15/2007EP1466363A4 Semiconductor device with co-packaged die
08/15/2007EP1466357A4 Surface mounted package with die bottom spaced from support board
08/15/2007EP1313184B1 Semiconductor laser device
08/15/2007CN2935731Y Radiating module
08/15/2007CN2935730Y 散热器结构 Radiator structure
08/15/2007CN2935729Y 散热器结构 Radiator structure
08/15/2007CN2935728Y 散热器结构 Radiator structure
08/15/2007CN2935727Y 散热器结构 Radiator structure
08/15/2007CN2935726Y Fastening structure of hot pipe-type heat sink
08/15/2007CN2935724Y Heat sink with vibration-absorbing structure
08/15/2007CN2935722Y Heat conducting medium protective cover
08/15/2007CN2935721Y Improvement structure of radiator support
08/15/2007CN2935719Y Cuttable radiator fin
08/15/2007CN2935544Y Welding-free LED unit
08/15/2007CN2935477Y High brightness white LED
08/15/2007CN2935475Y Semiconductor wafer with standby element
08/15/2007CN2935474Y Functional lighting LED
08/15/2007CN2935473Y Reinforced micro-electromechanical packaging structure
08/15/2007CN2935472Y 球栅阵列封装结构 Ball grid array package structure
08/15/2007CN2935471Y Two-chip packaging
08/15/2007CN2935470Y Memory card packaging arrangement
08/15/2007CN1332591C Radio frequency device
08/15/2007CN1332498C Cooling body and rectifier module for a motor
08/15/2007CN1332452C Semiconductor device
08/15/2007CN1332447C Semiconductor device and producing method thereof
08/15/2007CN1332446C Semiconductor device packaging
08/15/2007CN1332445C A high-frequency integrated circuit multi-in-line throwing structure
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