Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2007
08/08/2007CN101013709A TFT array structure and manufacturing method thereof
08/08/2007CN101013707A 显示器件 Display Devices
08/08/2007CN101013706A Bigrid layout structure for thin film transistor
08/08/2007CN101013704A Nonvolatile semiconductor memory elememnt and manufacturing method thereof
08/08/2007CN101013697A Semiconductor integrated circuit and method of designing the same
08/08/2007CN101013695A 半导体装置 Semiconductor device
08/08/2007CN101013693A Bidirectional bipolar transistor
08/08/2007CN101013692A Bidirectional insulated gate bipolar transistor
08/08/2007CN101013691A Insulated gate bipolar transistor module
08/08/2007CN101013690A Bidirectional insulated gate field-effect transistor
08/08/2007CN101013689A LED packaging structure and packaging method
08/08/2007CN101013688A Electronic circuit module and method for fabrication thereof
08/08/2007CN101013687A Semiconductor device having fuse element and method of cutting fuse element
08/08/2007CN101013686A Interconnect substrate, semiconductor device, and method of manufacturing the same
08/08/2007CN101013685A Package substrate
08/08/2007CN101013684A Semiconductor device and method of manufacturing the same
08/08/2007CN101013683A 半导体集成电路器件 The semiconductor integrated circuit device
08/08/2007CN101013682A 半导体集成电路器件 The semiconductor integrated circuit device
08/08/2007CN101013681A Heat sink, electronic device, and tuner apparatus
08/08/2007CN101013678A Method for manufacturing semiconductor structure and semiconductor device
08/08/2007CN101013667A Semiconductor layer structure and method of fabricating it
08/08/2007CN101013662A Methods for forming self-assembled patterns of block copolymers and related semiconductor structure
08/08/2007CN101013141A Acceleration sensor and method of manufacturing acceleration sensor
08/08/2007CN101012519A Silver containing copper alloy
08/08/2007CN101012330A Transparent epoxy resin composition for molding optical semiconductor and optical semiconductor integrated circuit device using the same
08/07/2007US7254032 Techniques for providing EMI shielding within a circuit board component
08/07/2007US7254030 Heat sink
08/07/2007US7253711 Embedded toroidal inductors
08/07/2007US7253659 Field programmable structured arrays
08/07/2007US7253549 Thermionic vacuum diode device with adjustable electrodes
08/07/2007US7253533 Divided shadow mask for fabricating organic light emitting diode displays
08/07/2007US7253532 Electrical or electronic component and method of producing same
08/07/2007US7253531 Semiconductor bonding pad structure
08/07/2007US7253530 Method for producing chip stacks
08/07/2007US7253529 Multi-chip package structure
08/07/2007US7253527 Semiconductor chip production method, semiconductor device production method, semiconductor chip, and semiconductor device
08/07/2007US7253526 Semiconductor packaging substrate and method of producing the same
08/07/2007US7253525 Semiconductor device including contact holes between adjacent conductor patterns and method for fabricating the same
08/07/2007US7253524 Copper interconnects
08/07/2007US7253523 Reworkable thermal interface material
08/07/2007US7253522 Integrated capacitor for RF applications with Ta adhesion layer
08/07/2007US7253520 CSP semiconductor device having signal and radiation bump groups
08/07/2007US7253519 Chip packaging structure having redistribution layer with recess
08/07/2007US7253518 Wirebond electronic package with enhanced chip pad design, method of making same, and information handling system utilizing same
08/07/2007US7253517 Method and apparatus for combining multiple integrated circuits
08/07/2007US7253516 Electronic device and carrier substrate for same
08/07/2007US7253515 Semiconductor package featuring metal lid member
08/07/2007US7253514 Self-supporting connecting element for a semiconductor chip
08/07/2007US7253513 High-frequency switch device and electronic device using the same
08/07/2007US7253512 Organic dielectric electronic interconnect structures and method for making
08/07/2007US7253511 Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package
08/07/2007US7253510 Ball grid array package construction with raised solder ball pads
08/07/2007US7253509 Semiconductor device, electronic card and pad rearrangement substrate
08/07/2007US7253508 Semiconductor package with a flip chip on a solder-resist leadframe
08/07/2007US7253507 Semiconductor device
08/07/2007US7253506 Micro lead frame package
08/07/2007US7253505 IC substrate with over voltage protection function
08/07/2007US7253504 Integrated circuit package and method
08/07/2007US7253503 Integrated circuit device packages and substrates for making the packages
08/07/2007US7253502 Circuitized substrate with internal organic memory device, electrical assembly utilizing same, and information handling system utilizing same
08/07/2007US7253501 High performance metallization cap layer
08/07/2007US7253500 Semiconductor wafer and a method for manufacturing a semiconductor wafer
08/07/2007US7253497 Integrated circuit with inductor having horizontal magnetic flux lines
08/07/2007US7253494 Battery mounted integrated circuit device having diffusion layers that prevent cations serving to charge and discharge battery from diffusing into the integrated circuit region
08/07/2007US7253492 Semiconductor structure with via structure
08/07/2007US7253487 Integrated circuit chip having a seal ring, a ground ring and a guard ring
08/07/2007US7253480 Structure and fabrication method of electrostatic discharge protection circuit
08/07/2007US7253475 Power transistor cell and power transistor component with fusible link
08/07/2007US7253472 Method of fabricating semiconductor device employing selectivity poly deposition
08/07/2007US7253471 Semiconductor structure having thick stabilization layer
08/07/2007US7253457 Semiconductor device with external terminals arranged symmetrically with respect to a normal external terminal arrangement
08/07/2007US7253456 Diode structure and integral power switching arrangement
08/07/2007US7253453 Charge-device model electrostatic discharge protection using active device for CMOS circuits
08/07/2007US7253448 Semiconductor radiation emitter package
08/07/2007US7253443 Electronic device with integrally formed light emitting device and supporting member
08/07/2007US7253442 Thermal interface material with carbon nanotubes
08/07/2007US7253439 Substrate for display, method of manufacturing the same and display having the same
08/07/2007US7253436 Resistance defect assessment device, resistance defect assessment method, and method for manufacturing resistance defect assessment device
08/07/2007US7253435 Particles with light-polarizing codes
08/07/2007US7253396 Cooled photodetector
08/07/2007US7253365 Die package for connection to a substrate
08/07/2007US7253363 Circuit board
08/07/2007US7253103 Method for producing semiconductor devices that includes forming a copper film in contact with a ruthenium film
08/07/2007US7253095 Air gap formation method for reducing undesired capacitive coupling between interconnects in an integrated circuit device
08/07/2007US7253091 Process for assembling three-dimensional systems on a chip and structure thus obtained
08/07/2007US7253090 Chip scale surface mounted device and process of manufacture
08/07/2007US7253089 Microfeature devices and methods for manufacturing microfeature devices
08/07/2007US7253029 Non-magnetic, hermetically-sealed micro device package
08/07/2007US7253027 Method of manufacturing hybrid integrated circuit device
08/07/2007US7253026 Ultra-thin semiconductor package device and method for manufacturing the same
08/07/2007US7253025 Multiple substrate microelectronic devices and methods of manufacture
08/07/2007US7253024 Dual-interface IC card by laminating a plurality of foils and method of same
08/07/2007US7253022 Method for fabricating semiconductor package with multi-layer metal bumps
08/07/2007US7253015 Low doped layer for nitride-based semiconductor device
08/07/2007US7253009 Method of producing an integrated circuit arrangement with field-shaping electrical conductor
08/07/2007US7252877 Polymer matrices for polymer solder hybrid materials
08/07/2007US7252875 Diffusion barrier with low dielectric constant and semiconductor device containing same
08/07/2007US7252795 Combining raw material for an organic polymer of polyamic acid and carbon particles; forming a film of particles dispersed in the organic polymer; heat treating the film; improved thermal conductivity in the layer direction, retaining the high thermal conductivity characteristsin the planar direction
08/07/2007US7252385 Projection LED cooling
08/07/2007US7252167 Electrical apparatus, cooling system therefor, and electric vehicle
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