Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2007
09/04/2007US7265422 Low voltage trigger and save area electrostatic discharge device
09/04/2007US7265395 Semiconductor device
09/04/2007US7265382 Method and apparatus employing integrated metrology for improved dielectric etch efficiency
09/04/2007US7265340 Optical device and method for fabricating the same
09/04/2007US7265167 Containing phenolic resin and inorganic filler; preventing short circuiting in devices having reduced pitch distance between interconnection electrodes or wires
09/04/2007US7265064 Semiconductor device with porous interlayer insulating film
09/04/2007US7265047 Post passivation interconnection schemes on top of the IC chips
09/04/2007US7265046 Method of making a solder ball
09/04/2007US7265045 Method for fabricating thermal compliant semiconductor chip wiring structure for chip scale packaging
09/04/2007US7265044 Method for forming bump on electrode pad with use of double-layered film
09/04/2007US7265040 Cleaning solution and method for selectively removing layer in a silicidation process
09/04/2007US7265038 Method for forming a multi-layer seed layer for improved Cu ECP
09/04/2007US7265033 Laser beam processing method for a semiconductor wafer
09/04/2007US7265032 Protective layer during scribing
09/04/2007US7265021 Alignment method, method for manufacturing a semiconductor device, substrate for a semiconductor device, electronic equipment
09/04/2007US7265001 Methods of fabricating semiconductor devices
09/04/2007US7264999 Semiconductor device with interlocking clip
09/04/2007US7264997 Semiconductor device including inclined cut surface and manufacturing method thereof
09/04/2007US7264994 Method of fabricating a semiconductor device
09/04/2007US7264992 Removable flash integrated memory module card and method of manufacture
09/04/2007US7264990 Methods of nanotubes films and articles
09/04/2007US7264977 Method of RFIC die-package configuration
09/04/2007US7264869 Polymer matrix; and carbon powders obtained by graphitizing a polymeric material that has an aromatic ring on its main chain by heating; carbon powders are aligned in a certain direction in the polymer matrix.
09/04/2007US7264481 Pressure contract spring for contact arrangement in power semiconductor module
09/04/2007US7264456 Leadframe and method for reducing mold compound adhesion problems
09/04/2007US7264407 Optical device, method for fabricating optical device, cap component, and method for forming cap component
09/04/2007US7264359 Cooling apparatus
09/04/2007US7264042 Spray cooling system for extreme environments
09/04/2007US7263768 Method of making a semiconductor device having an opening in a solder mask
09/04/2007US7263766 Insulating substrate, manufacturing method thereof, and module semiconductor device with insulating substrate
09/04/2007US7263764 Method for adjusting performance characteristics of a multilayer component
09/04/2007US7263759 Methods of manufacturing and testing bonding wires
09/04/2007CA2425609C Method for locating defects and measuring resistance in a test structure
08/2007
08/30/2007WO2007098402A2 Customizable power and ground pins
08/30/2007WO2007097891A2 Method for providing and removing discharging interconnect for chip-on-glass output leads and structures thereof
08/30/2007WO2007097022A1 Adhesive film
08/30/2007WO2007096975A1 Semiconductor device
08/30/2007WO2007096946A1 Package and method for producing same
08/30/2007WO2007096017A1 Method for producing planar insulating layers with breakthroughs at the correct position by means of laser cutting and devices produced accordingly
08/30/2007WO2007095972A1 Semiconductordevice including a coupled dielectric layer and metal layer, method of fabrication thereof, and passivating coupling material comprissing multiple organic components for use in a semiconductor device
08/30/2007WO2007095916A2 Device for aligning and machining a wafer
08/30/2007WO2007095873A1 Device for short-circuiting power semiconductor modules
08/30/2007WO2007078823A3 Method of manufacturing rfid devices
08/30/2007WO2007078799A3 Low resistivity package substrate and its manufacturing method
08/30/2007WO2007077109A3 Silicon carrier having increased flexibility
08/30/2007WO2007050420A3 Semiconductor device with reduced package cross-talk and loss
08/30/2007WO2007005639A3 Lead frame isolation using laser technology
08/30/2007WO2007005592A3 Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages
08/30/2007WO2006094307A3 Simultaneous and selective partitioning of via structures using plating resist
08/30/2007WO2005122285A3 Methods and devices for fabricating and assembling printable semiconductor elements
08/30/2007US20070204243 Stress analysis method, wiring structure design method, program, and semiconductor device production method
08/30/2007US20070203411 Analyte Monitoring Device and Methods of Use
08/30/2007US20070203410 Analyte Monitoring Device and Methods of Use
08/30/2007US20070203408 Analyte Monitoring Device and Methods of Use
08/30/2007US20070202685 High performance system-on-chip inductor using post passivation process
08/30/2007US20070202684 High performance system-on-chip inductor using post passivation process
08/30/2007US20070200512 Semiconductor Chip For Driving Light Emitting Element, Light Emitting Device And Lighting Equipment
08/30/2007US20070200477 Nanofabrication
08/30/2007US20070200259 Touch panel
08/30/2007US20070200258 Semiconductor device with semiconductor device components embedded in plastic package compound
08/30/2007US20070200257 Stackable integrated circuit package system with multiple interconnect interface
08/30/2007US20070200256 Wiring configuration for semiconductor component
08/30/2007US20070200255 System for fabricating semiconductor components with through wire interconnects
08/30/2007US20070200254 Method and apparatus for using flex circuit technology to create an electrode
08/30/2007US20070200253 Electronic assembly and method for forming the same
08/30/2007US20070200252 Circuit board apparatus, circuit component reinforcing method and electronic device
08/30/2007US20070200251 Method of fabricating ultra thin flip-chip package
08/30/2007US20070200250 Semiconductor Device with a Semiconductor Chip Using Lead Technology and Method of Manufacturing the Same
08/30/2007US20070200249 Wiring Board And Semiconductor Device
08/30/2007US20070200248 Stacked integrated circuit package system
08/30/2007US20070200247 Interconnect Structure to Reduce Stress Induced Voiding Effect
08/30/2007US20070200246 Chip package
08/30/2007US20070200245 Semiconductor device and pattern generating method
08/30/2007US20070200244 Post passivation interconnection schemes on top of the IC chips
08/30/2007US20070200243 Ald formed titanium nitride films
08/30/2007US20070200242 Semiconductor apparatus
08/30/2007US20070200241 Dual damascene process without an etch stop layer
08/30/2007US20070200240 Semiconductor device, electronic device and fabrication method of the same
08/30/2007US20070200239 Redistribution connecting structure of solder balls
08/30/2007US20070200238 Semiconductor integrated circuit apparatus and method of designing the same
08/30/2007US20070200237 Semiconductor device and method of manufacturing the same
08/30/2007US20070200236 Base semiconductor chip, semiconductor integrated circuit device, and semiconductor integrated circuit device manufacturing method
08/30/2007US20070200235 Semiconductor device having reinforced low-k insulating film and its manufacture method
08/30/2007US20070200234 Flip-Chip Device Having Underfill in Controlled Gap
08/30/2007US20070200233 Bond pad structures with reduced coupling noise
08/30/2007US20070200232 Printed-wiring board with built-in component, manufacturing method of printed-wiring board with built-in component, and electronic device
08/30/2007US20070200230 Stackable integrated circuit package system
08/30/2007US20070200229 Chip underfill in flip-chip technologies
08/30/2007US20070200228 Semiconductor package having heat dissipating device and fabrication method of the semiconductor package
08/30/2007US20070200227 Power semiconductor arrangement
08/30/2007US20070200226 Cooling micro-channels
08/30/2007US20070200225 Heat sink for semiconductor package
08/30/2007US20070200224 Thermally-enhanced ball grid array package structure and method
08/30/2007US20070200223 Semiconductor device and semiconductor module therewith
08/30/2007US20070200222 Semiconductor device and method of fabrication
08/30/2007US20070200221 Electronic component module
08/30/2007US20070200220 Flexible substrate
08/30/2007US20070200219 Power Semiconductor Device And Method For Producing It
08/30/2007US20070200218 Printed board and semiconductor integrated circuit
08/30/2007US20070200217 Method and apparatus for manufacturing electronic component-mounted component, and electronic component-mounted component
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