Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2007
09/27/2007US20070222063 Electronic device capable of varying appearance
09/27/2007US20070222062 Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film
09/27/2007US20070222061 Semiconductor Module With Serial Bus Connection to Multiple Dies
09/27/2007US20070222060 Compact power semiconductor module having a connecting device
09/27/2007US20070222059 Direct power delivery into an electronic package
09/27/2007US20070222058 Stitched micro-via to enhance adhesion and mechanical strength
09/27/2007US20070222057 Perpendicularly oriented electrically active element method and system
09/27/2007US20070222056 Encapsulated Electrical Component and Production Method
09/27/2007US20070222055 Method and System for Stacking Integrated Circuits
09/27/2007US20070222054 Semiconductor components with through wire interconnects
09/27/2007US20070222053 Semiconductor constructions having interconnect structures, methods of forming interconnect structures, and methods of forming semiconductor constructions
09/27/2007US20070222052 Wiring structure, multilayer wiring board, and electronic device
09/27/2007US20070222051 Stacked semiconductor device
09/27/2007US20070222050 Stack package utilizing through vias and re-distribution lines
09/27/2007US20070222049 Package structure and manufacturing method thereof
09/27/2007US20070222048 Package structure
09/27/2007US20070222047 Semiconductor package structure
09/27/2007US20070222046 Electronic Circuit Device
09/27/2007US20070222045 Semiconductor device for chip-on-chip configuration and method for manufacturing the same
09/27/2007US20070222044 Electronic Component and Methods to Produce an Electronic Component
09/27/2007US20070222043 Semiconductor device and a method of manufacturing the same
09/27/2007US20070222042 Semiconductor devices and electrical parts manufacturing using metal coated wires
09/27/2007US20070222041 Chip package
09/27/2007US20070222040 Leadless semiconductor package with electroplated layer embedded in encapsulant and the method for manufacturing the same
09/27/2007US20070222039 Semiconductor device and manufacturing method of a semiconductor device
09/27/2007US20070222037 Semiconductor wafer and method for making the same
09/27/2007US20070222029 Semiconductor device having a fuse element
09/27/2007US20070222001 Semiconductor integrated circuit device
09/27/2007US20070221995 Semiconductor device and a method of manufacturing the same
09/27/2007US20070221994 Driver circuit for switching device
09/27/2007US20070221937 Semiconductor light emitting apparatus and its manufacturing method
09/27/2007US20070221920 Semiconductor component having test pads and method and apparatus for testing same
09/27/2007US20070221505 Electrochemical deposition of one or more materials according to desired cross-sectional configurations so as to build up three dimensional structures from a plurality of at least partially adhered layers of deposited material; simplification
09/27/2007US20070221369 Composite Heat Sink With Metal Base And Graphite Fins
09/27/2007US20070221120 Level Realignment Following an Epitaxy Step
09/27/2007US20070220902 Thermoelectric Converter
09/27/2007US20070220725 Thick-film capacitors, embedding thick-film capacitors inside printed circuit boards, and methods of forming such capacitors and printed circuit boards
09/27/2007DE202007010577U1 Ein Aufbau eines Kühlkörpers A structure of a heat sink
09/27/2007DE202007008987U1 Wärmetauscher und Kühler mit selbigem Heat exchangers and coolers with just that
09/27/2007DE19754616B4 Drucksensor Pressure sensor
09/27/2007DE112005002739T5 Versiegelungsmaterial für optische Halbleiter Sealing material for optical semiconductor
09/27/2007DE10333315B4 Leistungshalbleitermodul The power semiconductor module
09/27/2007DE10331453B4 Verfahren zum Erzeugen wenigstens einer Wärmebrücke in einem Substrat A method for generating at least one thermal bridge in a substrate
09/27/2007DE10309302B4 Leistungshalbleitermodul mit Sensorbauteil Power semiconductor module with sensor component
09/27/2007DE10229692B4 Leiterplatte, Mehrchippackung und zugehöriges Herstellungsverfahren PCB, multi-chip package and manufacturing method thereof
09/27/2007DE10223738B4 Verfahren zur Verbindung integrierter Schaltungen A method for bonding integrated circuits
09/27/2007DE102007012336A1 Eingangsschutzschaltung Input protection circuit
09/27/2007DE102006013721A1 Analog silicon-on-insulator semiconductor circuit arrangement, has diode doped region formed in active semiconductor region of specific conductive type up to surface of insulating layer, and measuring diode realized over diode side
09/27/2007DE102006013077A1 Leistungshalbleiterbauelement mit Sekundärpassivierungsschicht und zugehöriges Herstellungsverfahren Power semiconductor component with Sekundärpassivierungsschicht and associated production method
09/27/2007DE102006013076A1 Leistungshalbleiterbauelement mit Passivierungsschicht und zugehöriges Herstellungsverfahren Power semiconductor component with a passivation layer and associated production method
09/27/2007DE102005030946B4 Halbleiterbauteil mit Verdrahtungssubstrat und Lotkugeln als Verbindungselement sowie Verfahren zur Herstellung des Halbleiterbauteils A semiconductor device comprising wiring substrate, and solder balls as a connecting element and method of manufacturing the semiconductor device
09/27/2007DE102005021247B4 Eigenschaftsmessverfahren für Hochfrequenzschaltung, Kalibriermuster und Kalibriervorrichtung Property Measuring method for high frequency circuit calibration pattern and calibration
09/27/2007CA2644433A1 Carrier body for components or circuits
09/26/2007EP1838141A1 Laminated body and method for producing the same
09/26/2007EP1837910A1 Integrated-circuit chip with offset external contacts and method of manufacturing such a chip.
09/26/2007EP1837909A1 Heat sink and cooling unit using same
09/26/2007EP1837908A1 High performance semiconductor component with secondary passivation layer and associated method of manufacture
09/26/2007EP1837907A2 High performance semiconductor component with secondary passivation layer and associated method of manufacture
09/26/2007EP1837612A1 Vapor cooling method, vapor cooling apparatus, and flow passage structure, and application thereof
09/26/2007EP1837086A2 Low dielectric materials and methods for making same
09/26/2007EP1836729A2 Semiconductor chip with identification codes, manufacturing method of the chip and semiconductor chip management system
09/26/2007EP1836728A2 Systems and methods for removing operating heat from a light emitting diode
09/26/2007EP1836449A1 A multi-orientational cooling system with a bubble pump
09/26/2007EP1448316A4 Hot melt conductor paste composition
09/26/2007EP1163483A4 Thermally conductive material and method of using the same
09/26/2007CN200953714Y Thermal conducting board
09/26/2007CN200953700Y Radiator fixed base
09/26/2007CN200953344Y Radiating device
09/26/2007CN200952695Y Large power illuminating two-electrode body
09/26/2007CN101044808A Rack enclosure
09/26/2007CN101044805A Hybrid multilayer substrate and method for manufacturing the same
09/26/2007CN101044619A Substrate with electric contacts and method of manufacturing the same
09/26/2007CN101044618A Device and method for fabricating double-sided soi wafer scale package with through via connections
09/26/2007CN101044617A 半导体晶片及半导体装置 A semiconductor wafer and a semiconductor device
09/26/2007CN101044616A Method of grinding multilayer body and method of manufacturing solid state image pickup device
09/26/2007CN101044592A Packaging decie and forming method thereof
09/26/2007CN101044514A Secure sensor chip
09/26/2007CN101044259A Plasma sputtering film deposition method and equipment
09/26/2007CN101044258A Plasma sputtering film deposition method and equipment
09/26/2007CN101043808A Heat radiating assembly and electronic appliance radiating heat using the same
09/26/2007CN101043806A Combined heat radiating module
09/26/2007CN101043791A Insulation structure for high thermal condition and its manufacturing method
09/26/2007CN101043789A Heat radiating device
09/26/2007CN101043070A Organic light-emitting device
09/26/2007CN101043061A Illuminator packaging structural capable of preventing electrostatic damaged and manufacturing method therefor
09/26/2007CN101043060A Crystal covering type light-emitting diode with function of sudden wave proof and electrostatic protection and method for manufacturing
09/26/2007CN101043049A Layer-stacked wiring and semiconductor device using same and method for manufacturing semiconductor device
09/26/2007CN101043045A 成像器件 Imaging Device
09/26/2007CN101043044A Semi-conductor package structure with optical assembly and manufacturing method thereof
09/26/2007CN101043042A 半导体装置 Semiconductor device
09/26/2007CN101043041A Active matrix substrate, liquid crystal display device, and method of manufacturing liquid crystal display device
09/26/2007CN101043035A Semiconductor memory device and related fabrication method
09/26/2007CN101043033A 半导体集成电路装置 The semiconductor integrated circuit device
09/26/2007CN101043029A High power LED compatible integrating packaging module
09/26/2007CN101043028A Semiconductor device and method of manufacturing the same
09/26/2007CN101043027A Anti-fuse and stylization method thereof
09/26/2007CN101043026A Crystalline semiconductor film, semiconductor device and method for manufacturing thereof
09/26/2007CN101043022A Method for producing semiconductor component and its semiconductor component
09/26/2007CN101043021A Semiconductor device having wirings formed by damascene and its manufacture method
09/26/2007CN101043012A Semiconductor device and a method of manufacturing the same
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