| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/26/2007 | CN101043008A Method for manufacturing a flip-chip package, substrate for manufacturing and flip-chip assembly |
| 09/26/2007 | CN101042946A Silver alloy material, circuit board, electronic device and method of producing circuit board |
| 09/26/2007 | CN101042927A Semiconductor memory device |
| 09/26/2007 | CN101042540A 衬底处理系统和衬底处理方法 A substrate processing system and a substrate processing method |
| 09/26/2007 | CN101042498A LED backlight unit without printed circuit board and method of manufacturing the same |
| 09/26/2007 | CN101042231A LED light heat radiation board |
| 09/26/2007 | CN101042230A Ultrahigh-power LED light and manufacturing method thereof |
| 09/26/2007 | CN101042228A No support high power LED bulb holder and manufacturing method thereof |
| 09/26/2007 | CN100340052C Frequency converter |
| 09/26/2007 | CN100340010C Memory cell with an asymmetrical area |
| 09/26/2007 | CN100339998C Semiconductor device possessing connection bonding pad and manufacturing method thereof |
| 09/26/2007 | CN100339990C Active matrix electroluminescent display devices, and their manufacture |
| 09/26/2007 | CN100339989C Semiconductor device |
| 09/26/2007 | CN100339988C Electrostatic discharge protective circuit of duplication structure |
| 09/26/2007 | CN100339987C Electronic member, method for making the same, and semiconductor device |
| 09/26/2007 | CN100339986C Semiconductor device and method for making the same |
| 09/26/2007 | CN100339985C Shaped springs and methds of fabricating and using shaped springs |
| 09/26/2007 | CN100339984C Radiating mould set |
| 09/26/2007 | CN100339983C Heat radiating member and connection structure |
| 09/26/2007 | CN100339982C Multi-layer ceramic package device and mfg method thereof |
| 09/26/2007 | CN100339981C Packaging base plate having concave-convex side |
| 09/26/2007 | CN100339980C Semiconductor component comprising surface metallization |
| 09/26/2007 | CN100339972C Semiconductor device and mfg. method thereof |
| 09/26/2007 | CN100339965C TAB tape carrier and producing method thereof |
| 09/26/2007 | CN100339914C Silver alloy material, circuit substrate, electronic device, and method for manufacturing circuit substrate |
| 09/26/2007 | CN100339866C Non-contact communication system information carrier |
| 09/26/2007 | CN100339587C Mounting structure of electronic device |
| 09/26/2007 | CN100339457C Method for producing a semiconductor-molding tablet, a semiconductor-molding tablet obtained thereby and a semiconductor device using the same |
| 09/26/2007 | CN100339439C Red phosphorus fire retardant for epoxy, red phosphorus fire retardant composition for epoxy, their mfg. method, epoxy composition for semiconductor sealing materials |
| 09/26/2007 | CN100339416C Polyimide resin for electrical insulating material |
| 09/26/2007 | CN100339412C Granular epoxy, its producing method and granular epoxy resin package |
| 09/25/2007 | USRE39854 Lead frame chip scale package |
| 09/25/2007 | US7275226 Method of performing latch up check on an integrated circuit design |
| 09/25/2007 | US7274923 Wireless communication system |
| 09/25/2007 | US7274570 Electronic component mounting board, electronic component module, method of manufacturing electronic component mounting board, and communications equipment |
| 09/25/2007 | US7274568 Apparatus and method for cooling semiconductor devices |
| 09/25/2007 | US7274543 Over-voltage protection circuit |
| 09/25/2007 | US7274217 High performance PFET header in hybrid orientation technology for leakage reduction in digital CMOS VLSI designs |
| 09/25/2007 | US7274210 Semiconductor integrated circuit |
| 09/25/2007 | US7274207 Semiconductor-integrated circuit utilizing magnetoresistive effect elements |
| 09/25/2007 | US7274205 System and method for testing devices utilizing capacitively coupled signaling |
| 09/25/2007 | US7274204 System and method for testing devices utilizing capacitively coupled signaling |
| 09/25/2007 | US7274110 Semiconductor component having a CSP housing |
| 09/25/2007 | US7274109 Modular bonding pad structure and method |
| 09/25/2007 | US7274108 Semiconductor chip capable of implementing wire bonding over active circuits |
| 09/25/2007 | US7274107 Semiconductor device |
| 09/25/2007 | US7274106 Packaged electroosmotic pumps using porous frits for cooling integrated circuits |
| 09/25/2007 | US7274105 Thermal conductive electronics substrate and assembly |
| 09/25/2007 | US7274104 Semiconductor device having an interconnect that increases in impurity concentration as width increases |
| 09/25/2007 | US7274103 Semiconductor device and manufacturing method thereof |
| 09/25/2007 | US7274102 Contacting device, testing method and corresponding production method |
| 09/25/2007 | US7274101 Semiconductor package and method for manufacturing the same |
| 09/25/2007 | US7274100 Battery protection circuit with integrated passive components |
| 09/25/2007 | US7274099 Method of embedding semiconductor chip in support plate |
| 09/25/2007 | US7274098 Chip packaging structure without leadframe |
| 09/25/2007 | US7274097 Semiconductor package including redistribution pattern and method of manufacturing the same |
| 09/25/2007 | US7274096 Light transmissive cover, device provided with same and methods for manufacturing them |
| 09/25/2007 | US7274095 Interposers with receptacles for receiving semiconductor devices and assemblies and packages including such interposers |
| 09/25/2007 | US7274094 Leadless packaging for image sensor devices |
| 09/25/2007 | US7274093 Semiconductor device connector, semiconductor device carrier, semiconductor device socket using the same and probe card |
| 09/25/2007 | US7274092 Semiconductor component and method of assembling the same |
| 09/25/2007 | US7274091 Semiconductor device and method of manufacturing a semiconductor device |
| 09/25/2007 | US7274090 Electronic package and semiconductor device using the same |
| 09/25/2007 | US7274089 Integrated circuit package system with adhesive restraint |
| 09/25/2007 | US7274088 Flip-chip semiconductor package with lead frame as chip carrier and fabrication method thereof |
| 09/25/2007 | US7274086 Memory device power distribution in memory assemblies |
| 09/25/2007 | US7274074 Semiconductor integrated circuit device |
| 09/25/2007 | US7274071 Electrostatic damage protection device with protection transistor |
| 09/25/2007 | US7274050 Packaging and manufacturing of an integrated circuit |
| 09/25/2007 | US7274049 Semiconductor assemblies |
| 09/25/2007 | US7274048 Substrate based ESD network protection for a flip chip |
| 09/25/2007 | US7273810 Semiconductor apparatus and method of fabricating the same |
| 09/25/2007 | US7273808 Reactive barrier/seed preclean process for damascene process |
| 09/25/2007 | US7273804 Internally reinforced bond pads |
| 09/25/2007 | US7273802 Methods for consolidating previously unconsolidated conductive material to form conductive structures or contact pads or secure conductive structures to contact pads |
| 09/25/2007 | US7273770 Compliant passivated edge seal for low-k interconnect structures |
| 09/25/2007 | US7273769 Method and apparatus for removing encapsulating material from a packaged microelectronic device |
| 09/25/2007 | US7273765 Solid-state imaging device and method for producing the same |
| 09/25/2007 | US7273760 Semiconductor device and method of manufacturing the same |
| 09/25/2007 | US7273657 Electronics, opto-electronic, magneto-electronics and magneto-optics devices, single crystal, integrated circuits |
| 09/25/2007 | US7273654 Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame |
| 09/25/2007 | US7273598 Diamondoid-containing materials for passivating layers in integrated circuit devices |
| 09/25/2007 | US7273540 Electrolytic plating using a solution of water, a sulfonic acid, and tin, copper, and silver ions, and an organic complexing agent; separating a solution around a soluble anode from the plating solution on a cathode side by a non-ionic micro-porous membrane |
| 09/25/2007 | US7273095 Nanoengineered thermal materials based on carbon nanotube array composites |
| 09/25/2007 | US7273092 Modularized cooler |
| 09/25/2007 | US7273091 Cooling apparatus for heat generating devices |
| 09/25/2007 | US7273089 Electronic apparatus having a heat-radiating unit for radiating heat of heat-generating components |
| 09/25/2007 | US7273088 One or more heat exchanger components in major part operably locatable outside computer chassis |
| 09/25/2007 | US7272888 Method of fabricating semiconductor chip assemblies |
| 09/20/2007 | WO2007106814A2 Semiconductor device fabricated using a carbon-containing film as a contact etch stop layer |
| 09/20/2007 | WO2007106636A2 Warp compensated package and method |
| 09/20/2007 | WO2007106487A2 Methods of making qfn package with power and ground rings |
| 09/20/2007 | WO2007105580A1 Base for power module |
| 09/20/2007 | WO2007105450A1 Heat removing method and heat removing apparatus |
| 09/20/2007 | WO2007105368A1 Semiconductor package mounting apparatus |
| 09/20/2007 | WO2007105357A1 Epoxy resin composition for sealing of semiconductor and semiconductor device |
| 09/20/2007 | WO2007104857A1 Heat exchanger and method for manufacturing it |
| 09/20/2007 | WO2007090664A3 Power electronics assembly |
| 09/20/2007 | WO2007078360A3 Lead interconnections and reinforcement |
| 09/20/2007 | WO2006119189A3 Molded lead frame connector with one or more passive components |