| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 08/28/2007 | US7262440 Light emitting diode package and fabrication method thereof |
| 08/28/2007 | US7262126 Sealing and protecting integrated circuit bonding pads |
| 08/28/2007 | US7262085 Display device |
| 08/28/2007 | US7262083 Method of manufacturing a semiconductor device |
| 08/28/2007 | US7262081 Fan out type wafer level package structure and method of the same |
| 08/28/2007 | US7262080 BGA package with stacked semiconductor chips and method of manufacturing the same |
| 08/28/2007 | US7262078 Method of forming a wear-resistant dielectric layer |
| 08/28/2007 | US7262074 Methods of fabricating underfilled, encapsulated semiconductor die assemblies |
| 08/28/2007 | US7261841 Thick film conductor case compositions for LTCC tape |
| 08/28/2007 | US7261840 Packaging of electronics; mixture of thermoplastic resin , carbon black and butadiene-styrene block polymer |
| 08/28/2007 | US7261828 Bumping process |
| 08/28/2007 | US7261792 Method of producing piezoelectric component and piezoelectric component |
| 08/28/2007 | US7261144 Bubble generator |
| 08/28/2007 | CA2432286C High power radiation emitter device and heat dissipating package for electronic components |
| 08/23/2007 | WO2007095461A2 Surface acoustic wave packages and methods of forming same |
| 08/23/2007 | WO2007095369A2 Quasi-radial heatsink with rectangular form factor and uniform fin length |
| 08/23/2007 | WO2007094507A1 Cr-Cu ALLOY, PROCESS FOR PRODUCING THE SAME, HEAT SINK FOR SEMICONDUCTOR, AND HEAT DISSIPATING COMPONENT FOR SEMICONDUCTOR |
| 08/23/2007 | WO2007094284A1 Cap for airtight sealing, package for housing electronic part, and process for producing airtightly sealing cap |
| 08/23/2007 | WO2007094221A1 Metallized ceramic board incorporating lead and package |
| 08/23/2007 | WO2007094123A1 Multilayered ceramic electronic component, multilayered ceramic substrate, and method for manufacturing multilayered ceramic electronic component |
| 08/23/2007 | WO2007094067A1 Substrate structure |
| 08/23/2007 | WO2007094044A1 Semiconductor device manufacturing method and semiconductor manufacturing apparatus |
| 08/23/2007 | WO2007093931A1 Interconnect structure and method of manufacture |
| 08/23/2007 | WO2007093380A1 Bonding wire |
| 08/23/2007 | WO2007093304A1 Component with integrated heating element and method for heating a semiconductor body |
| 08/23/2007 | WO2007075727A3 Microelectronic packages and methods therefor |
| 08/23/2007 | WO2007051110A3 Wire embedded bridge |
| 08/23/2007 | WO2007001653A3 Reticle alignment technique |
| 08/23/2007 | US20070198201 Configurable voltage regulator |
| 08/23/2007 | US20070197017 Manufacturing method of semiconductor module |
| 08/23/2007 | US20070196969 Semiconductor device and method of manufacturing the same |
| 08/23/2007 | US20070196956 Semiconductor device and method of manufacturing the same |
| 08/23/2007 | US20070196682 Three dimensional multilayer barrier and method of making |
| 08/23/2007 | US20070196664 Epoxy resin composition and semiconductor device |
| 08/23/2007 | US20070196612 Liquid epoxy resin composition |
| 08/23/2007 | US20070195506 Heat dissipating device for an integrated circuit chip |
| 08/23/2007 | US20070195500 Heat dissipation apparatus |
| 08/23/2007 | US20070195326 Image processing alignment method and method of manufacturing semiconductor device |
| 08/23/2007 | US20070194841 Semiconductor integrated circuit device |
| 08/23/2007 | US20070194466 Overlay measurement mark and pattern formation method for the same |
| 08/23/2007 | US20070194465 Light emitting diode package structure and fabricating method thereof |
| 08/23/2007 | US20070194464 Semiconductor device and a manufacturing method thereof |
| 08/23/2007 | US20070194463 Integrated circuit package system with l-shaped leadfingers |
| 08/23/2007 | US20070194462 Integrated circuit package system with bonding lands |
| 08/23/2007 | US20070194461 Apparatus and method for manufacturing semiconductor package capable of potting thermosetting resin while being heated |
| 08/23/2007 | US20070194459 Wiring Substrate of a Semiconductor Component Comprising External Contact Pads for External Contacts and Method for Producing the Same |
| 08/23/2007 | US20070194457 Semiconductor package featuring thin semiconductor substrate and liquid crystal polymer sheet, and method for manufacturing such semiconductor package |
| 08/23/2007 | US20070194456 Flexible circuit substrate for flip-chip-on-flex applications |
| 08/23/2007 | US20070194455 Stacked semiconductor memory device and control method thereof |
| 08/23/2007 | US20070194454 Semiconductor device |
| 08/23/2007 | US20070194453 Integrated circuit architecture for reducing interconnect parasitics |
| 08/23/2007 | US20070194452 Hydrogen Permeable Membrane, Fuel Cell And Hydrogen Extracting Apparatus Equipped With The Hydrogen Permeable Membrane, And Method Of Manufacturing The Hydrogen Permeable Membrane |
| 08/23/2007 | US20070194451 Apparatus for integrated input/output circuit and verification method thereof |
| 08/23/2007 | US20070194450 BEOL compatible FET structure |
| 08/23/2007 | US20070194449 Pattern and fabricating method therefor, device and fabricating method therefor, electro-optical apparatus, electronic apparatus, and method for fabricating active matrix substrate |
| 08/23/2007 | US20070194448 Semiconductor interconnection line and method of forming the same |
| 08/23/2007 | US20070194447 Semiconductor component comprising an integrated semiconductor chip and a chip housing, and electronic device |
| 08/23/2007 | US20070194446 Memory module comprising an electronic printed circuit board and a plurality of semiconductor components and method |
| 08/23/2007 | US20070194445 Semiconductor device and manufacturing method for the same |
| 08/23/2007 | US20070194444 Protecting apparatus of chip |
| 08/23/2007 | US20070194443 Power semiconductor modules having a cooling component and method for producing them |
| 08/23/2007 | US20070194442 Multisurfaced microdevice system array and a method of producing the array |
| 08/23/2007 | US20070194441 Redistributed solder pads using etched lead frame |
| 08/23/2007 | US20070194440 Substrate for semiconductor device and semiconductor device |
| 08/23/2007 | US20070194439 Solid-state imaging device, fabrication method of the same, and camera module |
| 08/23/2007 | US20070194438 Device And Method For Joining Substrates |
| 08/23/2007 | US20070194437 Substrate having a functionally gradient coefficient of thermal expansion |
| 08/23/2007 | US20070194436 Ball grid array package |
| 08/23/2007 | US20070194435 Semiconductor device and method of manufacturing the same |
| 08/23/2007 | US20070194434 Differential signal transmission structure, wiring board, and chip package |
| 08/23/2007 | US20070194433 Electronic circuit, a semiconductor device and a mounting substrate |
| 08/23/2007 | US20070194432 Arrangement of non-signal through vias and wiring board applying the same |
| 08/23/2007 | US20070194431 Conductive vias having two or more conductive elements for providing electrical communication between traces in different planes in a substrate, semiconductor device assemblies including such vias, and accompanying methods |
| 08/23/2007 | US20070194430 Substrate of chip package and chip package structure thereof |
| 08/23/2007 | US20070194429 Pressure contact power semiconductor module |
| 08/23/2007 | US20070194428 Connection Structure and Method for Connecting flexible Printed Circuit to Main Substrate |
| 08/23/2007 | US20070194427 Semiconductor package including transformer or antenna |
| 08/23/2007 | US20070194426 Chip package and stacked structure of chip packages |
| 08/23/2007 | US20070194425 Single-chip and multi-chip module for proximity communication |
| 08/23/2007 | US20070194424 Integrated circuit package system with die on base package |
| 08/23/2007 | US20070194423 Stacked integrated circuit package-in-package system with recessed spacer |
| 08/23/2007 | US20070194422 Light emitting diode package and fabricating method thereof |
| 08/23/2007 | US20070194421 Chip module having a protection device |
| 08/23/2007 | US20070194420 Semiconductor package having an optical device and a method of making the same |
| 08/23/2007 | US20070194419 Semiconductor module and method of manufacturing the same |
| 08/23/2007 | US20070194418 Semiconductor device |
| 08/23/2007 | US20070194417 Semiconductor apparatus containing multi-chip package structures |
| 08/23/2007 | US20070194416 Apparatus and methods for high-density chip connectivity |
| 08/23/2007 | US20070194415 Semiconductor device assemblies including face-to-face semiconductor dice, systems including such assemblies, and methods for fabricating such assemblies |
| 08/23/2007 | US20070194414 Method for providing and removing discharging interconnect for chip-on-glass output leads and structures thereof |
| 08/23/2007 | US20070194413 Method for manufacturing semiconductor substrate |
| 08/23/2007 | US20070194412 Resin layer formation method, semiconductor device and semiconductor device fabrication method |
| 08/23/2007 | US20070194411 Thermal Treatment Apparatus, Method For Manufacturing Semiconductor Device, And Method For Manufacturing Substrate |
| 08/23/2007 | US20070194409 Method of manufacturing semiconductor device with crack prevention ring |
| 08/23/2007 | US20070194392 Method and apparatus for indicating directionality in integrated circuit manufacturing |
| 08/23/2007 | US20070194381 Memory integrated circuit device providing improved operation speed at lower temperature |
| 08/23/2007 | US20070194380 Method for fabricating an ESD protection apparatus for discharging electric charge in a depth direction |
| 08/23/2007 | US20070194310 Non-contact electrical connections test device |
| 08/23/2007 | US20070193763 Leadframe-based module dc bus design to reduce module inductance |
| 08/23/2007 | US20070193718 Heat sinks and method of formation |