Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2007
08/14/2007US7256461 Electrostatic discharge (ESD) protection device
08/14/2007US7256460 Body-biased pMOS protection against electrostatic discharge
08/14/2007US7256456 SOI substrate and semiconductor integrated circuit device
08/14/2007US7256431 Insulating substrate and semiconductor device having a thermally sprayed circuit pattern
08/14/2007US7256421 Display device having a structure for preventing the deterioration of a light emitting device
08/14/2007US7256410 Solid state relay
08/14/2007US7256353 Metal/ceramic bonding substrate and method for producing same
08/14/2007US7256146 Method of forming a ceramic diffusion barrier layer
08/14/2007US7256143 Semiconductor device having self-aligned contact plug and method for fabricating the same
08/14/2007US7256136 Self-patterning of photo-active dielectric materials for interconnect isolation
08/14/2007US7256127 Air gap formation
08/14/2007US7256123 Method of forming an interface for a semiconductor device
08/14/2007US7256122 Method of fabricating semiconductor device
08/14/2007US7256118 Semiconductor device using low-K material as interlayer insulating film and its manufacture method
08/14/2007US7256116 Method for fabricating semiconductor components having encapsulated, bonded, interconnect contacts on redistribution contacts
08/14/2007US7256115 Asymmetric plating
08/14/2007US7256105 Semiconductor substrate and thin processing method for semiconductor substrate
08/14/2007US7256074 Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods
08/14/2007US7256073 Semiconductor device and manufacturing method thereof
08/14/2007US7256071 Underfilling efficiency by modifying the substrate design of flip chips
08/14/2007US7256069 Wafer-level package and methods of fabricating
08/14/2007US7256068 Semiconductor package assembly and method for electrically isolating modules
08/14/2007US7256066 Flip chip packaging process
08/14/2007US7256058 Device and method for package warp compensation in an integrated heat spreader
08/14/2007US7256055 System and apparatus for using test structures inside of a chip during the fabrication of the chip
08/14/2007US7255931 Aluminum/ceramic bonding substrate and method for producing same
08/14/2007US7255919 Mold release layer transferring film and laminate film
08/14/2007US7255802 Tape substrate and method for fabricating the same
08/14/2007US7255801 Deep submicron CMOS compatible suspending inductor
08/14/2007US7255799 Method for selectively covering a micro machined surface
08/14/2007US7255579 Anisotropic conductive connector and circuit-device electrical-inspection device
08/14/2007US7255273 Descriptor for identifying a defective die site
08/14/2007US7255154 Cooling device
08/14/2007US7255010 Integrated circuitry and method for manufacturing the same
08/14/2007US7254889 Interconnection devices
08/14/2007US7254888 Method for manufacturing graphite-base heat sinks
08/09/2007WO2007089885A2 Passive impedance equalization of high speed serial links
08/09/2007WO2007089828A2 Covert intelligent networked sensors and other fully encapsulated circuits
08/09/2007WO2007089341A2 Integrated circuits with antennas formed from package lead wires
08/09/2007WO2007089207A1 Methods for making a starting substrate wafer for semiconductor engineering having wafer through connections
08/09/2007WO2007089206A1 Vias and method of making
08/09/2007WO2007089011A1 Cooling structure of power semiconductor element and inverter
08/09/2007WO2007088835A1 Hollow package made of resin, and manufacturing method therefor
08/09/2007WO2007088792A1 Method for seed film formation, plasma film forming apparatus, and memory medium
08/09/2007WO2007088748A1 Process for producing metallized ceramic substrate, metallized ceramic substrate produced by the process, and package
08/09/2007WO2007087660A1 Printed circuit board element having at least one component embedded therein and method for embedding at least one component in a printed circuit board element
08/09/2007WO2007068018A3 Arrangement comprising at least one electronic component
08/09/2007WO2007036868A3 Wafer with scribe lanes comprising active circuits for die testing of complementary signal processing parts
08/09/2007WO2006128416A3 Housing body and method for production thereof
08/09/2007WO2005081812A3 Hotspot spray cooling
08/09/2007US20070185286 Organic solvent, polyimidesiloxane soluble therein, curable component such as an epoxy compound or a polyvalent isocyanate compound, and silicone defoamer; provides polyimidesiloxane solution excellent in defoaming ability and that can maintain wettability of outer lead bonded on wiring board
08/09/2007US20070185227 Epoxy resins, cyanate ester resins, thermoplastic polyphenylene ethers, adding flexibilizer (bis(2,3-epoxy-2-methylpropyl)ether), thermoplastic polyphenylene ether; gelling, curing, for semiconductor chip assembled to substrate with solder interconnections; shock/fracture resistance; storage stability
08/09/2007US20070184670 Manufacturing method of semiconductor device, and ic card, ic tag, rfid, transponder, bill, securities, passport, electronic apparatus, bag, and garment
08/09/2007US20070184652 Method for preparing a metal feature surface prior to electroless metal deposition
08/09/2007US20070184651 Copper interconnect systems which use conductive, metal-based cap layers
08/09/2007US20070184650 Copper interconnect systems which use conductive, metal-based cap layers
08/09/2007US20070184645 Active area bonding compatible high current structures
08/09/2007US20070184644 Ball grid array copper balancing
08/09/2007US20070184630 Method of bonding a semiconductor wafer to a support substrate
08/09/2007US20070184629 Method for producing a surface-mountable semiconductor component
08/09/2007US20070184604 Multilayer interconnection board, semiconductor device having the same, and method of forming the same as well as method of mounting the semicondutor chip on the interconnection board
08/09/2007US20070184603 Method of fabricating semiconductor integrated circuit device
08/09/2007US20070184343 Card with embedded IC and electrochemical cell
08/09/2007US20070183624 Methods and Tangible Objects Employing Machine Readable Data
08/09/2007US20070183194 Controlling access to device-specific information
08/09/2007US20070182601 Impedance matching commonly and independently
08/09/2007US20070182521 High performance system-on-chip inductor using post passivation process
08/09/2007US20070182284 Support and decoupling structure for an acoustic resonator, acoustic resonator and corresponding integrated circuit
08/09/2007US20070182029 Semiconductor component and method for producing semiconductor components
08/09/2007US20070182028 Electronic component package
08/09/2007US20070182026 Semiconductor device
08/09/2007US20070182025 Laminate structure and method of producing the same
08/09/2007US20070182024 Integrated circuit packaging system including a non-leaded package
08/09/2007US20070182023 Semiconductor device
08/09/2007US20070182022 Wafer level chip scale package (WLCSP) with high reliability against thermal stress
08/09/2007US20070182021 Semiconductor component comprising flip chip contacts and method for producing the same
08/09/2007US20070182020 Chip connector
08/09/2007US20070182019 Semiconductor device and manufacturing method for the same
08/09/2007US20070182018 Integrated circuit package system including zero fillet resin
08/09/2007US20070182017 Semiconductor devices and methods of manufacturing the same
08/09/2007US20070182016 Method of making same low moisture absorptive circuitized substrave with reduced thermal expansion
08/09/2007US20070182015 Fabrication of Nanowires
08/09/2007US20070182014 Semiconductor device and method for manufacturing same
08/09/2007US20070182013 Damascene structure having a reduced permittivity and manufacturing method thereof
08/09/2007US20070182012 Methods for bonding and devices according to such methods
08/09/2007US20070182011 Method for forming a redistribution layer in a wafer structure
08/09/2007US20070182010 Embossing processes for substrate imprinting, structures made thereby, and polymers used therefor
08/09/2007US20070182009 Wiring board and method for manufacturing the same and semiconductor device and method for manufacturing the same
08/09/2007US20070182008 Substrate and method for mounting silicon device
08/09/2007US20070182007 Solder bump on a semiconductor substrate
08/09/2007US20070182006 Semiconductor device with an improved solder joint
08/09/2007US20070182005 Semiconductor device, reticle used in fabricating method for the same and fabrication method thereof
08/09/2007US20070182004 Methods of Forming Electronic Interconnections Including Compliant Dielectric Layers and Related Devices
08/09/2007US20070182003 Stackable Semiconductor Device and Method for Producing the Same
08/09/2007US20070182002 Package structure of a microphone
08/09/2007US20070182001 Semiconductor device
08/09/2007US20070182000 Module part
08/09/2007US20070181999 Memory module with rubber spring connector
08/09/2007US20070181998 Stacked integrated circuit package system with face to face stack configuration
08/09/2007US20070181997 Semiconductor device package with heat sink leadframe and method for producing it
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