Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2007
08/23/2007US20070193029 Heat dissipating apparatus having micro-structure layer and method of fabricating the same
08/23/2007US20070193027 Method of manufacturing circuit device
08/23/2007DE202007003877U1 Elektronische Vorrichtung Electronic device
08/23/2007DE19600393B4 Leiterrahmen Leadframe
08/23/2007DE112005002326T5 CPU-Stromversorgungssystem CPU power supply system
08/23/2007DE10249331B4 Kühlvorrichtung Cooler
08/23/2007DE10233641B4 Verfahren zur Verbindung einer integrierten Schaltung mit einem Substrat und entsprechende Schaltungsanordnung A method for bonding an integrated circuit having a substrate and corresponding circuit arrangement
08/23/2007DE10220396B4 Leistungshalbleiterbauelementanordnung Power semiconductor device assembly
08/23/2007DE102006012232A1 Surface areas laminating method for e.g. transistor, involves cutting foils during simultaneous fixing of foils on surface areas, and adjusting characteristics of areas to function of foils in individual or selective manner
08/23/2007DE102006007381A1 Ultra-wide-band semiconductor component for ultra-wide-band standard in communication, comprises semiconductor component, ultra-wide-band semiconductor chip and multilevel circuit substrate with lower and upper metal layer
08/23/2007DE102006007331A1 Multilayer capacitance arrangement e.g. metal-insulator-metal capacitance arrangement, for use in integrated circuit, has electrically conductive layer arranged over metallization layer, and dielectric layer arranged over conductive layer
08/23/2007DE102006007093A1 Coating method for surface of semiconductor body, involves clearing away thin layer near surface within range of surface of semiconductor body, which is coated, by sputtering
08/23/2007DE102006006825A1 Semiconductor component e.g. ball grid array semiconductor component, has semiconductor chip with protective casing, and soldering ball arranged in recess of electrical insulating layer and connected with connecting carrier
08/23/2007DE102006006561A1 Flip-Chip-Modul und Verfahren zum Austauschen eines Halbleiterchips eines Flip-Chip-Moduls Flip-chip module and method for replacing a semiconductor chip of a flip-chip module
08/23/2007DE102006006425A1 Leistungshalbleitermodul in Druckkontaktausführung Power semiconductor module in pressure contact design
08/23/2007DE102006006424A1 Anordnung mit mindestens einem Leistungshalbleitermodul und einem Kühlbauteil und zugehöriges Herstellungsverfahren Arrangement with at least one power semiconductor module and a cooling component and associated production method
08/23/2007DE102006006423A1 Leistungshalbleitermodul und zugehöriges Herstellungsverfahren The power semiconductor module and associated production method
08/23/2007DE102006006422A1 Leistungshalbleitermodul mit Kontakteinrichtung Power semiconductor module with contactor
08/23/2007DE102006006421A1 Power semiconductor module has substrate with insulating material body, where connection element is formed as contact spring with two contact mechanism and springy section
08/23/2007DE102006006300A1 Integrated circuit e.g. electrically erasable programmable ROM, arrangement for automobile industry, has electronic units covered by passivation layer, where identification data is provided in substrate and clearly indicates circuit
08/23/2007DE102006006175A1 Power electronics assembly has surface of insulating substrate with a metal layer, which projects beyond substrate on all sides and projecting region of metal layer forms metal flange which borders insulating substrate
08/23/2007DE102005035083B4 Bondverbindungssystem, Halbleiterbauelementpackung und Drahtbondverfahren Bonding system, semiconductor device package and wire bonding method
08/23/2007DE102004031954B4 Halbleiterpackung mit gestapelten Chips Semiconductor package with stacked chips
08/23/2007DE10125725B4 Ball-Grid-Array-Packung Ball Grid Array Package
08/22/2007EP1821342A1 Heat sink material, method for manufacturing such heat sink material, and semiconductor laser device
08/22/2007EP1820971A1 Centrifugal fan
08/22/2007EP1819478A2 Method and system for laser soft marking
08/22/2007EP1819477A1 Method for welding two welding parts by means of a fillet weld and welding part with an inclined tapered edge area therefor
08/22/2007EP1490909B1 Active matrix electroluminescent display devices and their manufacture
08/22/2007EP1269808B1 Method for fabricating electrical connecting elements, and connecting element
08/22/2007CN2938727Y Silencer of heat sink
08/22/2007CN2938726Y Device for raising radiation efficient of heat sink
08/22/2007CN2938723Y Heat sink assembly
08/22/2007CN2938722Y Heat sink structure
08/22/2007CN2938721Y Improved heat sink module fixing base
08/22/2007CN2938720Y Heat sink device
08/22/2007CN2938719Y Temp. evenness plate structure
08/22/2007CN2938718Y Heat sink device of electronic product
08/22/2007CN2938416Y High power LED of packed by metal casing
08/22/2007CN2938406Y LED package structure of increasing luminous effect
08/22/2007CN2938405Y Led
08/22/2007CN2938404Y Test device for measuring PN junction current
08/22/2007CN2938403Y Wire frame carrier
08/22/2007CN2938402Y Anti-electric-corrosion electrode structure and substrate
08/22/2007CN2938401Y Heat sink for high power semiconductor device
08/22/2007CN2938400Y Package base of semiconductor element
08/22/2007CN2938399Y Semiconductor power assembly
08/22/2007CN2938398Y Water-cooled combined heat sink for semiconductor device
08/22/2007CN2938397Y Input end structure of vehicle rectifier
08/22/2007CN2938396Y Refrigeration chip cooling device
08/22/2007CN1333627C Electronic module including a cooling substrate and related methods
08/22/2007CN1333526C Solid state relay
08/22/2007CN1333469C Efficient radiating support device for light-emitting diode
08/22/2007CN1333464C Semiconductor integrated circuit device and its manufacturing method
08/22/2007CN1333463C Method for forming co-axial interconnect in CMOS process
08/22/2007CN1333462C Laminated sheet, method of manufacturing demiconductor and semiconductor part
08/22/2007CN1333461C Potting material for electronic components
08/22/2007CN1333460C High-frequency module board device
08/22/2007CN1333459C 电路装置 Circuit device
08/22/2007CN1333450C Electric connection end structure of embedded chip and its producing method
08/22/2007CN1333449C Semiconductor package piece
08/22/2007CN1333441C Nickel silicide with reduced interface roughness
08/22/2007CN1333434C Manufacturing method of semiconductor device, semiconductor device, circuit substrate and electronic equipment
08/22/2007CN1332902C High thermal expansion glass and belt composition
08/22/2007CN101023528A Self-cleaning lower contact
08/22/2007CN101023527A An organic ferroelectric or electret device with via connections and a method for its manufacture
08/22/2007CN101023526A Electrical via connection and associated contact means as well as a method for their manufacture
08/22/2007CN101023525A Semiconductor integrated circuit including metal mesh structure
08/22/2007CN101023510A Semiconductor structure processing using multiple laser beam spots
08/22/2007CN101022718A Groove-type flat-plate heat pipe soaking device
08/22/2007CN101022717A Liquid self-loop composite heat pipe radiating device used for electronic equipment
08/22/2007CN101022714A Radiating module
08/22/2007CN101022713A 风扇固定装置 Fan fixtures
08/22/2007CN101022712A Thermal interfacial material and radiating device association using the same thermal interfacial material
08/22/2007CN101022706A Lock joint device and radiating module using the same lock joint device
08/22/2007CN101022147A Ceramic packaged light-emitting diode and producing method thereof
08/22/2007CN101022144A Large power light-emitting diode
08/22/2007CN101022143A Special power light-emitting diode for road lamp
08/22/2007CN101022142A Light emitted semiconductor assembly package structure and producing method thereof
08/22/2007CN101022136A Alkaline-earth metal salt decorative nano crystal semiconductor optical anode, producing method and application thereof
08/22/2007CN101022123A Organic electroluminescence display device and method for manufacturing same
08/22/2007CN101022121A Organic light emitting device and manufacturing method of the same
08/22/2007CN101022119A Micro photographic module and producing method thereof
08/22/2007CN101022117A Semiconductor structure and producing method thereof
08/22/2007CN101022107A Versatile semiconductor test structure array
08/22/2007CN101022106A 半导体装置 Semiconductor device
08/22/2007CN101022104A Light-emitting diode package, light-emitting diode array and method for improving chromatic aberration
08/22/2007CN101022103A Chip package body
08/22/2007CN101022101A Integrated circuit chip and package
08/22/2007CN101022100A Light-emitting diode module
08/22/2007CN101022099A Thick film circuit, pin frame, circuit board and assembly thereof
08/22/2007CN101022098A Connection structure and method for fabricating the same
08/22/2007CN101022097A Circulating hot tube type radiator
08/22/2007CN101022096A Semiconductor structure of liquid crystal display and producing method thereof
08/22/2007CN101022095A Picture element structure of liquid crystal display and producing method thereof
08/22/2007CN101022094A Two-dimensional display semiconductor structure and producing method thereof
08/22/2007CN101022080A Metal conducting wire and producing method thereof
08/22/2007CN101022049A Varistor and light-emitting apparatus
08/22/2007CN101021680A Material for forming exposure light-blocking film, multilayer interconnection structure and manufacturing method thereof, and semiconductor device
08/22/2007CN101021659A Liquid crystal picture element and producing method thereof and liquid crystal display device
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