| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 08/09/2007 | US20070181996 Circuit board |
| 08/09/2007 | US20070181995 Circuit board structure embedded with semiconductor chips |
| 08/09/2007 | US20070181994 Circuit board manufacturing method and circuit board |
| 08/09/2007 | US20070181993 Printed circuit board including reinforced copper plated film and method of fabricating the same |
| 08/09/2007 | US20070181992 Microelectronic devices and methods for manufacturing microelectronic devices |
| 08/09/2007 | US20070181991 Stacked semiconductor device |
| 08/09/2007 | US20070181990 Stacked semiconductor structure and fabrication method thereof |
| 08/09/2007 | US20070181989 Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices |
| 08/09/2007 | US20070181988 Bare chip embedded PCB and method of the same |
| 08/09/2007 | US20070181987 Highly reliable, cost effective and thermally enhanced AuSn die-attach technology |
| 08/09/2007 | US20070181986 Substrate for device bonding and method for manufacturing same |
| 08/09/2007 | US20070181985 Method of manufacturing a semiconductor device and used for the same |
| 08/09/2007 | US20070181984 Semiconductor package suitable for high voltage applications |
| 08/09/2007 | US20070181983 Semiconductor device and manufacturing method thereof |
| 08/09/2007 | US20070181982 Integrated circuit package system with leadfinger support |
| 08/09/2007 | US20070181981 Edge seal for improving integrated circuit noise isolation |
| 08/09/2007 | US20070181970 High performance system-on-chip inductor using post passivation process |
| 08/09/2007 | US20070181948 ESD protection device |
| 08/09/2007 | US20070181936 Novel architecture to monitor isolation integrity between floating gate and source line |
| 08/09/2007 | US20070181286 Structure for air conduction in radiator device |
| 08/09/2007 | US20070181240 Method for inspecting a film carrier tape for mounting electronic components |
| 08/09/2007 | US20070181218 Solder composition and method of bump formation therewith |
| 08/09/2007 | DE202007007220U1 Leichtlösbare Lufthaube Easily Detachable air hood |
| 08/09/2007 | DE19521985B4 Halbleitervorrichtung und diesbezügliches Herstellungsverfahren A semiconductor device manufacturing method and to this effect |
| 08/09/2007 | DE112005001961T5 Integrierte Hartmaske mit niedrigem K-Wert Integrated hard mask with a low K value |
| 08/09/2007 | DE10350702B4 Halbleiterbauelement mit einer kapazitiven, gegenüber Fehlern einer Dielektrikusschicht robusten Struktur Semiconductor device with a capacitive, against errors Dielektrikusschicht a robust structure |
| 08/09/2007 | DE10343681B4 Halbleiterstruktur und deren Verwendung, insbesondere zum Begrenzen von Überspannungen Semiconductor structure and their use, in particular for limiting overvoltages |
| 08/09/2007 | DE10211677B4 Anordnung zum Senden oder Empfangen von optischen Signalen Arrangement for transmitting or receiving optical signals |
| 08/09/2007 | DE102006003930A1 Power semiconductor component, has dielectric intermediate layer arranged between metal layers, where intermediate layer has less ductility than metal layers and laminar extension of intermediate layer is adapted to extension of surfaces |
| 08/09/2007 | DE102006002695A1 Electronic component`s e.g. multi-layer piezo stack, surface e.g. side surface, passivation method, involves bringing electrical insulation on surface of component and producing openings in insulation in area of electrodes of surface |
| 08/09/2007 | DE102005045661B4 Mikroelektronischer Bauelementchip und Herstellungsverfahren, Packung und LCD-Vorrichtung Microelectronic component chip and manufacturing process, pack and LCD device |
| 08/09/2007 | DE10156386B4 Verfahren zum Herstellen eines Halbleiterchips A method of manufacturing a semiconductor chip |
| 08/09/2007 | DE10142585B4 Halbleiteranordnung und zugehöriges Verfahren zu deren Herstellung A semiconductor device and associated method for the preparation thereof |
| 08/09/2007 | DE10121896B4 Halbleiterbauelement mit Ball-Grid-Array-Packung Semiconductor component with ball grid array package |
| 08/09/2007 | DE10084657B4 Modulkarte und Herstellverfahren für diese Module board and manufacturing method of this |
| 08/09/2007 | DE10008572B4 Verbindungseinrichtung für Leistungshalbleitermodule Connector for power semiconductor modules |
| 08/09/2007 | CA2650700A1 Printed circuit board element comprising at least one embedded component as well as method for embedding at least one component in a printed circuit board element |
| 08/09/2007 | CA2637038A1 Apparatus and methods for packaging integrated cirguit chips with antennas formed from package lead wires |
| 08/08/2007 | EP1816685A1 Light emitting element mounting board, light emitting element storing package, light emitting device and lighting equipment |
| 08/08/2007 | EP1816676A1 High performance semiconductor module |
| 08/08/2007 | EP1816470A1 Method of inspecting laminated assembly and method of inspecting heat spreader module |
| 08/08/2007 | EP1816175A2 Thermal interface material |
| 08/08/2007 | EP1816152A1 Polymerizable composition |
| 08/08/2007 | EP1815545A2 Alkaline fluoride dope molecular films and applications for p-n junction and field-effect transistor devices |
| 08/08/2007 | EP1815522A2 An electrically programmable fuse for silicon-on-insulator (soi) technology |
| 08/08/2007 | EP1815515A2 Semiconductor device package with bump overlying a polymer layer |
| 08/08/2007 | EP1815514A1 A flow distribution module and a stack of flow distribution modules |
| 08/08/2007 | EP1815513A1 Integrated multi-purpose getter for radio-frequency (rf) circuit modules |
| 08/08/2007 | EP1815507A2 Copper interconnect wiring and method of forming thereof |
| 08/08/2007 | EP1697987A4 Electronic packaging materials for use with low-k dielectric-containing semiconductor devices |
| 08/08/2007 | EP1252654B1 A method for transferring and stacking of semiconductor devices |
| 08/08/2007 | EP1139703B1 Substrate of circuit board |
| 08/08/2007 | EP0766307B1 Silicon nitride circuit board |
| 08/08/2007 | CN2932932Y Radiator with heat radiation group |
| 08/08/2007 | CN2932930Y Unidirectional cold source flow cooling and temperature control device |
| 08/08/2007 | CN2932929Y Heat radiation module structure |
| 08/08/2007 | CN2932624Y A standard voltage-stabilizing tube for silicon plane temperature compensation |
| 08/08/2007 | CN2932622Y A pin base |
| 08/08/2007 | CN2932621Y Encapsulating structure with top and bottom radiating fins |
| 08/08/2007 | CN2932620Y Semiconductor silicon sheet with damage stress ring |
| 08/08/2007 | CN2932616Y 半导体晶片和半导体器件 The semiconductor wafer and the semiconductor device |
| 08/08/2007 | CN1331375C Multi-layer structure unit and its manufacturing method |
| 08/08/2007 | CN1331281C Electric device and method for making same |
| 08/08/2007 | CN1331239C Semi-conductor diode with reduced leakage |
| 08/08/2007 | CN1331227C Circuit board and production method therefor |
| 08/08/2007 | CN1331226C High voltage assembly structure with high static discharge protective tolerance capacity |
| 08/08/2007 | CN1331225C Device for shielding transmission line to ground or power supply |
| 08/08/2007 | CN1331224C Resin packaging semiconductor device |
| 08/08/2007 | CN1331223C Semiconductor device and its producing method |
| 08/08/2007 | CN1331222C High-density flip-chip interconnect |
| 08/08/2007 | CN1331221C 芯片球栅阵列封装结构 Chip ball grid array package |
| 08/08/2007 | CN1331220C Method of manufacturing an electronic device |
| 08/08/2007 | CN1331219C Semiconductor chip installed substrate, electro-optical evice, liquid crystal device, electroluminescent device and electronic machine |
| 08/08/2007 | CN1331218C Packaging assembly and method of assembling the same |
| 08/08/2007 | CN1331217C Wafer package structure and its base plate |
| 08/08/2007 | CN1331211C Semiconductor element manufacturing method by detecting nitride content of gage silicon oxide layer |
| 08/08/2007 | CN1331205C Large area silicon carbide devices and manufacturing methods therefor |
| 08/08/2007 | CN1331204C Lead-free solder structure and method for high fatigue life |
| 08/08/2007 | CN1331203C Low-k interconnect structure comprised of a multilayer of spin-on porous dielectrics |
| 08/08/2007 | CN1331200C Semiconductor device and its conductive structure forming process |
| 08/08/2007 | CN1331091C Semiconductor device and production method theref |
| 08/08/2007 | CN1331019C Method for retaining heat-conducting pin in heat-conducting diffusion plate and its device |
| 08/08/2007 | CN1330704C Epoxy resin composition and method for producing epoxy resin composition and semiconductor device obtained thereby |
| 08/08/2007 | CN1330451C Wire bonder for ball bonding insulated wire and method of using same |
| 08/08/2007 | CN101015235A Capacitor layer-forming material and printed circuit board having internal capacitor circuit obtained by using capacitor layer-forming material |
| 08/08/2007 | CN101015056A Integrated transistor module and method of fabricating same |
| 08/08/2007 | CN101015055A 功率半导体封装 Power semiconductor packages |
| 08/08/2007 | CN101015054A Package and method for packaging an integrated circuit wafer |
| 08/08/2007 | CN101015053A Method of manufacturing semiconductor device and semiconductor device |
| 08/08/2007 | CN101015051A Radio chip |
| 08/08/2007 | CN101015050A Method for manufacturing semiconductor device and semiconductor device manufactured by such method |
| 08/08/2007 | CN101014821A Composite heat sink with metal base and graphite fins |
| 08/08/2007 | CN101014235A Apparatus of uniform heat transfer and method of manufacturing the same |
| 08/08/2007 | CN101014234A Buckle structure for radiating fin |
| 08/08/2007 | CN101014226A Electronic apparatus |
| 08/08/2007 | CN101014225A 多层印刷电路板及其制造方法 Multilayer printed wiring board and its manufacturing method |
| 08/08/2007 | CN101013887A 半导体集成电路 The semiconductor integrated circuit |
| 08/08/2007 | CN101013735A Lead frame and light emitting device package using the same |
| 08/08/2007 | CN101013720A Organic electroluminescence device with plane sandwiched structure |
| 08/08/2007 | CN101013714A Solid-state imaging device and electronic endoscope using the same |