| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 08/22/2007 | CN101021631A Substrate structure and method for producing thin film pattern layer |
| 08/22/2007 | CA2541256A1 Shielding electrode for monolithic radiation detector |
| 08/21/2007 | USRE39784 Structure for removable cooler |
| 08/21/2007 | US7259820 Active matrix type liquid crystal display device and method of manufacturing the same |
| 08/21/2007 | US7259649 Switchable inductance |
| 08/21/2007 | US7259644 Substrate having microstrip line structure, semiconductor device having microstrip line structure, and manufacturing method of substrate having microstrip line structure |
| 08/21/2007 | US7259623 RF generator with reduced size and weight |
| 08/21/2007 | US7259622 RF generator with phase controlled MOSFETs |
| 08/21/2007 | US7259468 Structure of package |
| 08/21/2007 | US7259467 Semiconductor integrated circuit device |
| 08/21/2007 | US7259465 Semiconductor device with lead-free solder |
| 08/21/2007 | US7259464 Vertical twist scheme for high-density DRAMs |
| 08/21/2007 | US7259463 Damascene interconnect structure with cap layer |
| 08/21/2007 | US7259462 Interconnect dielectric tuning |
| 08/21/2007 | US7259461 Semiconductor device having improved contact hole structure and method for fabricating the same |
| 08/21/2007 | US7259460 Wire bonding on thinned portions of a lead-frame configured for use in a micro-array integrated circuit package |
| 08/21/2007 | US7259459 Semiconductor module and DC-DC converter |
| 08/21/2007 | US7259458 Integrated circuit with increased heat transfer |
| 08/21/2007 | US7259457 Die-up ball grid array package including a substrate capable of mounting an integrated circuit die and method for making the same |
| 08/21/2007 | US7259456 Heat dissipation apparatus for package device |
| 08/21/2007 | US7259455 Semiconductor device |
| 08/21/2007 | US7259454 Semiconductor chip manufacturing method, semiconductor chip, semiconductor device manufacturing method, and semiconductor device |
| 08/21/2007 | US7259453 Hexagonal array structure for ball grid array packages |
| 08/21/2007 | US7259452 Leaded package integrated circuit stacking |
| 08/21/2007 | US7259451 Invertible microfeature device packages |
| 08/21/2007 | US7259450 Double-packaged multi-chip semiconductor module |
| 08/21/2007 | US7259449 Method and system for sealing a substrate |
| 08/21/2007 | US7259448 Die-up ball grid array package with a heat spreader and method for making the same |
| 08/21/2007 | US7259447 Flip-chip type nitride semiconductor light emitting diode |
| 08/21/2007 | US7259446 Heat sink packaging assembly for electronic components |
| 08/21/2007 | US7259445 Thermal enhanced package for block mold assembly |
| 08/21/2007 | US7259443 Methods for forming patterns on a filled dielectric material on substrates |
| 08/21/2007 | US7259441 Hollow structure in an integrated circuit and method for producing such a hollow structure in an integrated circuit |
| 08/21/2007 | US7259440 Fast switching diode with low leakage current |
| 08/21/2007 | US7259438 Solid state imaging device and producing method thereof |
| 08/21/2007 | US7259432 Semiconductor device for reducing parasitic capacitance produced in the vicinity of a transistor located within the semiconductor device |
| 08/21/2007 | US7259429 Semiconductor display device |
| 08/21/2007 | US7259416 Semiconductor device having a conductive plug |
| 08/21/2007 | US7259376 Detector module |
| 08/21/2007 | US7259095 Semiconductor device and manufacturing process therefor as well as plating solution |
| 08/21/2007 | US7259094 Apparatus and method for heat treating thin film |
| 08/21/2007 | US7259092 Semiconductor device and method for fabricating the same |
| 08/21/2007 | US7259080 Glass-type planar substrate, use thereof, and method for the production thereof |
| 08/21/2007 | US7259077 Integrated passive devices |
| 08/21/2007 | US7259058 Fabricating method of semiconductor integrated circuits |
| 08/21/2007 | US7259052 Manufacture of a semiconductor integrated circuit device including a pluarality of a columnar laminates having different spacing in different directions |
| 08/21/2007 | US7259046 Semiconductor device and manufacturing method thereof |
| 08/21/2007 | US7259044 Lead frame, method of manufacturing the same, and method of manufacturing a semiconductor device using the same |
| 08/21/2007 | US7259043 Circular test pads on scribe street area |
| 08/21/2007 | US7259042 Ultra thin dual chip image sensor package structure and method for fabrication |
| 08/21/2007 | US7259041 Method for the hermetic encapsulation of a component |
| 08/21/2007 | US7259027 Low energy dose monitoring of implanter using implanted wafers |
| 08/21/2007 | US7258808 High-power ball grid array package, heat spreader used in the BGA package and method for manufacturing the same |
| 08/21/2007 | US7258743 Composite structure with a uniform crystal orientation and the method of controlling the crystal orientation of one such structure |
| 08/21/2007 | US7258537 Fast firing flattening apparatus for sintered multilayer ceramic electronic substrates |
| 08/21/2007 | US7258161 Cooling system for densely packed electronic components |
| 08/21/2007 | US7258160 Heat transfer element, cooling device and electronic device having the element |
| 08/21/2007 | US7257891 Method for forming bonding pads |
| 08/21/2007 | US7257884 Method for fabricating semiconductor component with adjustment circuitry for electrical characteristics or input/output configuration |
| 08/16/2007 | WO2007091574A1 Multilayer wiring structure, and method for fabricating multilayer wiring |
| 08/16/2007 | WO2007091329A1 Electronic component package |
| 08/16/2007 | WO2007091214A1 Semiconductor device and method of manufacturing thereof |
| 08/16/2007 | WO2007090664A2 Power electronics assembly |
| 08/16/2007 | WO2007075599A3 Multi-fluid coolant system |
| 08/16/2007 | WO2007031750A3 A heat dissipation device |
| 08/16/2007 | WO2006138425A3 Chip spanning connection |
| 08/16/2007 | WO2006114971A9 Electronic component module |
| 08/16/2007 | WO2004061901A8 Heatsink with multiple, selectable fin densities |
| 08/16/2007 | US20070192057 Method and apparatus for repairing shape, and method for manufacturing semiconductor device using those |
| 08/16/2007 | US20070191699 Analyte Monitoring Device and Methods of Use |
| 08/16/2007 | US20070191542 Modifier for resin and resin composition using the same and formed article |
| 08/16/2007 | US20070190887 Display apparatus and method of manufacturing the same |
| 08/16/2007 | US20070190781 Methods of forming metal-containing films over surfaces of semiconductor substrates |
| 08/16/2007 | US20070190779 Diffusion Barrier Layers and Methods Comprising for Depositing Metal Films by CVD or ALD Processes |
| 08/16/2007 | US20070190776 Methods of Processing Thick ILD Layers Using Spray Coating or Lamination for C4 Wafer Level Thick Metal Integrated Flow |
| 08/16/2007 | US20070190771 System and method for stress free conductor removal |
| 08/16/2007 | US20070190744 Method for fabricating semiconductor devices |
| 08/16/2007 | US20070190699 Electronic device and method of manufacturing the same |
| 08/16/2007 | US20070190695 Apparatus and method integrating an electro-osmotic pump and microchannel assembly into a die package |
| 08/16/2007 | US20070190694 Integrated circuit package with leadframe locked encapsulation and method of manufacture therefor |
| 08/16/2007 | US20070190690 Integrated circuit package system with exposed interconnects |
| 08/16/2007 | US20070190461 Polycarbosilane substituted with a benzyl or diazo group and/or a polysilazane having a substituent capable of absorbing exposure light; high exposure light (particularly ultraviolet light) absorptivity, which efficiently blocks the exposure light that reaches porous insulating films |
| 08/16/2007 | US20070190248 Thin metal films by atomic layer deposition: tungsten nucleation layer over a silicon wafer; copper film from CuCl and triethylboron; vapor phase pulses in inert gas |
| 08/16/2007 | US20070188692 Driver module structure |
| 08/16/2007 | US20070188082 Organic el device and liquid crystal display |
| 08/16/2007 | US20070187845 Integrated Stress Relief Pattern and Registration Structure |
| 08/16/2007 | US20070187844 Electronic assembly with detachable components |
| 08/16/2007 | US20070187843 Semiconductor device having improved wire-bonding reliability and method of manufacturing the same |
| 08/16/2007 | US20070187842 Printed circuit, method of manufacturing the printed circuit, printed circuit/electronic element assembly, and method of manufacturing the printed circuit/electronic element assembly |
| 08/16/2007 | US20070187841 Power composite integrated semiconductor device and manufacturing method thereof |
| 08/16/2007 | US20070187840 Nanoscale probes for electrophysiological applications |
| 08/16/2007 | US20070187839 Integrated circuit package system with heat sink |
| 08/16/2007 | US20070187838 Pad structure for bonding pad and probe pad and manufacturing method thereof |
| 08/16/2007 | US20070187837 Active area bonding compatible high current structures |
| 08/16/2007 | US20070187836 Package on package design a combination of laminate and tape substrate, with back-to-back die combination |
| 08/16/2007 | US20070187835 Packaging box |
| 08/16/2007 | US20070187834 Utilizes a compound phosphor to provide composition that takes advantage of the best properties of conventional and QD phosphors; garnet, sulphide, thiometallate, silicate, oxides, oxynitrides, nitrides, and selenide based phosphors; uniform intensity |
| 08/16/2007 | US20070187833 made by stacking piezoelectric layers and internal electrodes alternately one on another, wherein piezoelectric layer contains lead titanate lead zirconate as main component and contains silicon of 5-100 ppm; wherein grain boundary has single molecules of silica and has no glass phase |
| 08/16/2007 | US20070187832 Semiconductor device and method for fabricating the same |
| 08/16/2007 | US20070187831 Conductive layers for hafnium silicon oxynitride films |