| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/12/2007 | CN101034700A Electronic component integrated module and method for fabricating the same |
| 09/12/2007 | CN101034698A Overlay accuracy measurement vernier and method of forming the same |
| 09/12/2007 | CN101034697A Electrically programmable fuse structures with narrowed width regions configured to enhance current crowding and methods of fabrication thereof |
| 09/12/2007 | CN101034696A Electrically programmable fuse structures with terminal portions residing at different heights, and methods of fabrication thereof |
| 09/12/2007 | CN101034695A Semiconductor structure and method for manufacturing semiconductor structure |
| 09/12/2007 | CN101034694A Electronic component with lead using pb-free solder |
| 09/12/2007 | CN101034693A Semiconductor device and method for manufacturing semiconductor device |
| 09/12/2007 | CN101034692A 芯片封装体 Chip package |
| 09/12/2007 | CN101034691A Semiconductor component and its making method |
| 09/12/2007 | CN101034690A Semiconductor package with the heat radiation device and its making method |
| 09/12/2007 | CN101034689A Double encapsulated semiconductor package and manufacturing method thereof |
| 09/12/2007 | CN101034688A Optical device and method for manufacturing the same |
| 09/12/2007 | CN101034687A Base board for flexible optoelectronic part and its making method |
| 09/12/2007 | CN101034686A A P type GaP semiconductor material and its making method |
| 09/12/2007 | CN101034683A Method for forming integrated circuit and structure |
| 09/12/2007 | CN101034682A Semiconductor device and method of manufacturing the same |
| 09/12/2007 | CN101034681A Method of manufacturing semiconductor device |
| 09/12/2007 | CN101034676A Methods for detecting charge effects during semiconductor processing |
| 09/12/2007 | CN101034674A Board on chip package and manufacturing method thereof |
| 09/12/2007 | CN101034663A Method and structure for improved alignment in mram integration |
| 09/12/2007 | CN101034659A Method of manufacturing basal plate and device for processing the basal plate |
| 09/12/2007 | CN101033379A 各向异性导电胶粘剂 Anisotropic conductive adhesive |
| 09/12/2007 | CN100337385C Test by using independently controllable voltage islands |
| 09/12/2007 | CN100337331C Data carrier comprising an integrated circuit with an ESD protection circuit |
| 09/12/2007 | CN100337330C Radio frequency semiconductor device and method of manufacturing the same |
| 09/12/2007 | CN100337328C Electrostatic discharging protective circuit of controlling substrate potential and its method |
| 09/12/2007 | CN100337327C Semiconductor device and method for making same |
| 09/12/2007 | CN100337326C Heat sink of integrated circuit chip |
| 09/12/2007 | CN100337325C Packaging baseplate having electrostatic discharge protection |
| 09/12/2007 | CN100337317C Novel integrated circuit or discrete component flat bump package technics and its package structure |
| 09/12/2007 | CN100337307C Photolithography evaluating method and photolithography process |
| 09/12/2007 | CN100337089C Device detection |
| 09/11/2007 | US7269813 Off-width pitch for improved circuit card routing |
| 09/11/2007 | US7269807 Area ratio/occupancy ratio verification method and pattern generation method |
| 09/11/2007 | US7269803 System and method for mapping logical components to physical locations in an integrated circuit design environment |
| 09/11/2007 | US7269009 Case for covering electronic parts and display apparatus including the same |
| 09/11/2007 | US7268941 Module inspection fixture |
| 09/11/2007 | US7268486 Hermetic encapsulation of organic, electro-optical elements |
| 09/11/2007 | US7268440 Fabrication of semiconductor integrated circuit chips |
| 09/11/2007 | US7268439 Semiconductor device having resin-sealed area on circuit board thereof |
| 09/11/2007 | US7268438 Semiconductor element including a wet prevention film |
| 09/11/2007 | US7268437 Semiconductor package with encapsulated passive component |
| 09/11/2007 | US7268436 Electronic device with cavity and a method for producing the same |
| 09/11/2007 | US7268435 Capacitive semiconductor sensor |
| 09/11/2007 | US7268434 Semiconductor device and method of manufacturing the same |
| 09/11/2007 | US7268433 Semiconductor device |
| 09/11/2007 | US7268432 Interconnect structures with engineered dielectrics with nanocolumnar porosity |
| 09/11/2007 | US7268431 System for and method of forming via holes by use of selective plasma etching in a continuous inline shadow mask deposition process |
| 09/11/2007 | US7268430 Semiconductor device and process for manufacturing the same |
| 09/11/2007 | US7268429 Technique for manufacturing an overmolded electronic assembly |
| 09/11/2007 | US7268428 Thermal paste containment for semiconductor modules |
| 09/11/2007 | US7268427 Semiconductor package, printed board mounted with the same, and electronic apparatus having the printed board |
| 09/11/2007 | US7268426 High-frequency chip packages |
| 09/11/2007 | US7268425 Thermally enhanced electronic flip-chip packaging with external-connector-side die and method |
| 09/11/2007 | US7268424 Semiconductor device, electronic card and pad rearrangement substrate |
| 09/11/2007 | US7268423 Flexible rewiring plate for semiconductor components, and process for producing it |
| 09/11/2007 | US7268422 Method of making a semiconductor device adapted to remove noise from a signal |
| 09/11/2007 | US7268421 Semiconductor chip assembly with welded metal pillar that includes enlarged ball bond |
| 09/11/2007 | US7268420 Semiconductor device having layered chips |
| 09/11/2007 | US7268419 Interposer containing bypass capacitors for reducing voltage noise in an IC device |
| 09/11/2007 | US7268418 Multi-chips stacked package |
| 09/11/2007 | US7268417 Card-type circuit device |
| 09/11/2007 | US7268416 Mounting structure, electro-optical device, substrate for electro-optical device, and electronic apparatus |
| 09/11/2007 | US7268415 Semiconductor device having post-mold nickel/palladium/gold plated leads |
| 09/11/2007 | US7268414 Semiconductor package having solder joint of improved reliability |
| 09/11/2007 | US7268409 Spiral inductor with electrically controllable resistivity of silicon substrate layer |
| 09/11/2007 | US7268408 Wiring board, method for manufacturing wiring board and electronic component using wiring board |
| 09/11/2007 | US7268398 ESD protection cell with active pwell resistance control |
| 09/11/2007 | US7268382 DRAM cells |
| 09/11/2007 | US7268304 Microelectronic connection components having bondable wires |
| 09/11/2007 | US7268303 Circuit board, mounting structure of ball grid array, electro-optic device and electronic device |
| 09/11/2007 | US7268201 Polymer for insulation of film forming siloxanes |
| 09/11/2007 | US7268192 Process for producing high-purity epoxy resin and epoxy resin composition |
| 09/11/2007 | US7268191 Mixing an epoxy resin, a phenol resin, and a hardening accelerator, under a reduced pressure and under a heating condition and then mixing |
| 09/11/2007 | US7268087 Manufacturing method of semiconductor device |
| 09/11/2007 | US7268072 Method and structure for reducing contact aspect ratios |
| 09/11/2007 | US7268069 Method of fabricating semiconductor device having multilayer wiring structure |
| 09/11/2007 | US7268068 Semiconductor device and manufacturing method thereof |
| 09/11/2007 | US7268067 Semiconductor integrated circuit package having electrically disconnected solder balls for mounting |
| 09/11/2007 | US7268065 Methods of manufacturing metal-silicide features |
| 09/11/2007 | US7268059 Methods for securing components of semiconductor device assemblies to each other with adhesive materials that include pressure-sensitive and curable components |
| 09/11/2007 | US7268053 Semiconductor wafer and a method for manufacturing a semiconductor wafer |
| 09/11/2007 | US7268021 Lead frame and method of manufacturing the same |
| 09/11/2007 | US7268019 Method and apparatus for high temperature operation of electronics |
| 09/11/2007 | US7268018 Method for fabricating semiconductor component with stiffener and circuit decal |
| 09/11/2007 | US7268016 Method for manufacturing solid-state imaging devices |
| 09/11/2007 | US7268013 Method of fabricating a semiconductor die package having improved inductance characteristics |
| 09/11/2007 | US7268012 Methods for fabrication of thin semiconductor assemblies including redistribution layers and packages and assemblies formed thereby |
| 09/11/2007 | US7268011 Diamond composite heat spreader and associated methods |
| 09/11/2007 | US7268010 Method of manufacturing an LED |
| 09/11/2007 | US7268002 Packaging method, packaging structure and package substrate for electronic parts |
| 09/11/2007 | US7267861 Solder joints for copper metallization having reduced interfacial voids |
| 09/11/2007 | US7267287 IC card |
| 09/11/2007 | US7266888 Method for fabricating a warpage-preventive circuit board |
| 09/11/2007 | CA2362387C Method for production of three-dimensionally arranged conducting and connecting structures for volumetric and energy flows |
| 09/07/2007 | WO2007100404A2 Semiconductor interconnect having adjacent reservoir for bonding and method for formation |
| 09/07/2007 | WO2007100125A1 Semiconductor device, its manufacturing method, and sputtering target material for use in the method |
| 09/07/2007 | WO2007100037A1 Function element mounting module and method for manufacturing same |
| 09/07/2007 | WO2007099677A1 Functional-element-mounted module, process for producing the same, resin sealing plate for use therein, and substrate structure for resin sealing |
| 09/07/2007 | WO2007099662A1 Heat sink provided with centrifugal fan |