| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 09/13/2007 | US20070210449 Memory device and an array of conductive lines and methods of making the same |
| 09/13/2007 | US20070210448 Electroless cobalt-containing liner for middle-of-the-line (mol) applications |
| 09/13/2007 | US20070210447 Elongated fasteners for securing together electronic components and substrates, semiconductor device assemblies including such fasteners, and accompanying systems and methods |
| 09/13/2007 | US20070210446 Apparatus and Methods For Cooling Semiconductor Integrated Circuit Chip Packages |
| 09/13/2007 | US20070210445 Power Semiconductor Module and Method for Cooling a Power Semiconductor Module |
| 09/13/2007 | US20070210444 Methods of promoting adhesion between transfer molded ic packages and injection molded plastics for creating over-molded memory cards |
| 09/13/2007 | US20070210443 Integrated circuit package on package system |
| 09/13/2007 | US20070210442 Method and apparatus for providing structural support for interconnect pad while allowing signal conductance |
| 09/13/2007 | US20070210441 Microelectronic device assemblies including assemblies with recurved leadframes, and associated methods |
| 09/13/2007 | US20070210440 Semiconductor device |
| 09/13/2007 | US20070210439 Board on chip package and manufacturing method thereof |
| 09/13/2007 | US20070210438 Semiconductor package |
| 09/13/2007 | US20070210437 Semiconductor device and manufacturing method thereof |
| 09/13/2007 | US20070210436 Integrated circuit package system |
| 09/13/2007 | US20070210434 Structure of stacked integrated circuits and method for manufacturing the same |
| 09/13/2007 | US20070210433 Integrated device having a plurality of chip arrangements and method for producing the same |
| 09/13/2007 | US20070210432 Stacked integrated circuits package system with passive components |
| 09/13/2007 | US20070210431 Support with integrated deposit of gas absorbing material for manufacturing microelectronic microoptoelectronic or micromechanical devices |
| 09/13/2007 | US20070210430 Semiconductor device and method of manufacturing the same |
| 09/13/2007 | US20070210429 Package structure for electronic device |
| 09/13/2007 | US20070210428 Die stack system and method |
| 09/13/2007 | US20070210427 Warp compensated package and method |
| 09/13/2007 | US20070210426 Gold-bumped interposer for vertically integrated semiconductor system |
| 09/13/2007 | US20070210425 Integrated circuit package system |
| 09/13/2007 | US20070210424 Integrated circuit package in package system |
| 09/13/2007 | US20070210423 Embedded chip package structure |
| 09/13/2007 | US20070210422 Semiconductor package system with substrate having different bondable heights at lead finger tips |
| 09/13/2007 | US20070210421 Semiconductor device fabricated using a carbon-containing film as a contact etch stop layer |
| 09/13/2007 | US20070210394 Method and structure for improved alignment in MRAM integration |
| 09/13/2007 | US20070210387 ESD protection device and method |
| 09/13/2007 | US20070210386 Plasma display apparatus |
| 09/13/2007 | US20070210385 Devices without current crowding effect at the finger's ends |
| 09/13/2007 | US20070210384 Substrate-based silicon diode for electrostatic discharge protection |
| 09/13/2007 | US20070210306 Test pattern for measuring contact short at first metal level |
| 09/13/2007 | US20070209831 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board |
| 09/13/2007 | DE60310222T2 Halbleiterkapselung und verfahren zu ihrer herstellung Semiconductor package and process for its preparation |
| 09/13/2007 | DE202007008678U1 Kühleraufbau Cooler construction |
| 09/13/2007 | DE202007007222U1 Befestigung für Kühlkörper Attachment for heat sink |
| 09/13/2007 | DE19947044B9 Oberflächenmontierbares optoelektronisches Bauelement mit Reflektor und Verfahren zur Herstellung desselben Surface-mountable optoelectronic component with a reflector and method of manufacturing the same |
| 09/13/2007 | DE112004002705T5 Harzvergießverfahren für eine elektronische Komponente sowie bei diesem Verfahren verwendetes Formwerkzeug Harzvergießverfahren for an electronic component as well as the mold used in this method |
| 09/13/2007 | DE10216080B4 Halbleiter-Bauelement mit Niederimpedanzbereich zum Verpolungsschutz Semiconductor device with low impedance range for reverse polarity protection |
| 09/13/2007 | DE102006051454A1 Halbleitervorrichtung Semiconductor device |
| 09/13/2007 | DE102006030598A1 Vorrichtung mit einem Modul und einer Kühlvorrichtung sowie Verfahren zur Verbindung einer Kühlvorrichtung und eines Moduls Apparatus having a module and a cooling device and method for connection of a cooling device and a module |
| 09/13/2007 | DE102006011794B3 Heat exchanger, has flow guiding unit with flow guiding structures that divert part of fluid, which is guided by substrate surface, where part of fluid is directed towards substrate surface |
| 09/13/2007 | DE102006011528A1 Heat pipe for cooling electronic component e.g. CPU, of e.g. personal computer, has working fluid container with working fluid for changing heat transfer phase and with upper and lower boundaries as cover and evaporator plate, respectively |
| 09/13/2007 | DE102006011333A1 Vorrichtung zur Kühlung, insbesondere elektronischer Bauelemente An apparatus for cooling, in particular of electronic components |
| 09/13/2007 | DE102006010511A1 Vertical semiconductor arrangement e.g. semiconductor chip stack, for printed circuit board substrate, has auxiliary layer that is bounded on area of relevant main side or includes structure provided with recess, channel, wall and trench |
| 09/13/2007 | DE102006008793A1 Elektronisches Bauteil Electronic component |
| 09/13/2007 | DE102006007797A1 Halbleiterbauelement und Verfahren zu dessen Herstellung sowie dessen Verwendung Semiconductor device and process for its preparation and its use |
| 09/13/2007 | DE102006007306B3 Elektrische Anordnung mit einer Drahtverbindungsanordnung und Verfahren zum Herstellen einer derartigen elektrischen Anordnung An electrical assembly with a wire connection arrangement and method of manufacturing such an electric arrangement |
| 09/13/2007 | DE102005003390B4 Substrat für ein FBGA-Halbleiterbauelement Substrate for a semiconductor device FBGA |
| 09/13/2007 | DE10037270B4 Silicatein-vermittelte Synthese von amorphen Silikaten und Siloxanen und ihre Verwendung Silicatein-mediated synthesis of amorphous silicates and siloxanes and their use |
| 09/13/2007 | DE10002639B4 Bandträger für ein BGA und eine Halbleitervorrichtung, die diesen benutzt Band carrier for BGA and a semiconductor device using this |
| 09/13/2007 | CA2644460A1 Method and process of manufacturing robust high temperature solder joints |
| 09/13/2007 | CA2644234A1 Method and apparatus for cooling semiconductor chips |
| 09/12/2007 | EP1833089A2 Method of producing a conductor substrate for mounting a semiconductor element |
| 09/12/2007 | EP1833088A1 Method of forming a crack-free connection between a heat sink and a substrate plate |
| 09/12/2007 | EP1833086A2 A method of manufacturing a semiconductor device |
| 09/12/2007 | EP1832824A1 Forced convection heat transfer apparatus |
| 09/12/2007 | EP1832351A2 Low dielectric materials and methods for making same |
| 09/12/2007 | EP1831995A1 A power device and a method for controlling a power device |
| 09/12/2007 | EP1831927A1 An anti-fuse cell and its manufacturing process |
| 09/12/2007 | EP1831926A2 An electronic device, a chip containing method and a contacting device |
| 09/12/2007 | EP1831924A1 Manufacturing method for semiconductor chips |
| 09/12/2007 | EP1831920A1 Wafer bonded mos decoupling capacitor |
| 09/12/2007 | EP1831919A2 Gallium nitride/silicon based monolithic microwave integrated circuit |
| 09/12/2007 | EP1831918A2 Fabrication of a ferromagnetic inductor core and capacitor electrode in a single photo mask step |
| 09/12/2007 | EP1831281A1 Optoelectronic molding compound that transmits visible light and blocks infrared light |
| 09/12/2007 | EP1579499A4 Method of self-assembling electronic circuitry and circuits formed thereby |
| 09/12/2007 | EP1454333B1 Mems device having a trilayered beam and related methods |
| 09/12/2007 | EP1415341B1 Method of fabricating an alloy film on a face of a heat exchanger for an integrated circuit |
| 09/12/2007 | EP1390692A4 Periodic patterns and technique to control misalignment |
| 09/12/2007 | EP1329526B1 Method for producing high-purity zirconium and hafnium for sputtering targets |
| 09/12/2007 | EP0883173B1 Circuit board for mounting electronic parts |
| 09/12/2007 | CN200947720Y Heat radiator, lighting device |
| 09/12/2007 | CN200947719Y Water-cooled assistance heat radiating device |
| 09/12/2007 | CN200947718Y Water-cooled system with parallel channel and conflux device thereof |
| 09/12/2007 | CN200947717Y Composite radiating module |
| 09/12/2007 | CN200947715Y Side board radiator |
| 09/12/2007 | CN200947713Y Heat radiator for electrical component |
| 09/12/2007 | CN200947435Y LED for wide irradiation angle illumination |
| 09/12/2007 | CN200947434Y Water-cooled heat abstractor for high power electronic chip |
| 09/12/2007 | CN200947433Y Fixing structure for heat radiator |
| 09/12/2007 | CN200946795Y Lamp heat radiation structure |
| 09/12/2007 | CN101036238A Light emitting device, lighting equipment or liquid crystal display device using such light emitting device |
| 09/12/2007 | CN101036230A Treatment of silicon prior to nickel silicide formation |
| 09/12/2007 | CN101036226A Cooled integrated circuit |
| 09/12/2007 | CN101036217A PE-ALD of TaN diffusion barrier region on low-K materials |
| 09/12/2007 | CN101036036A Method for manufacturing physical quantity sensor |
| 09/12/2007 | CN101035876A Thermally conductive composition and method for preparing the same |
| 09/12/2007 | CN101035424A Heat radiating apparatus and optical projection device having the same |
| 09/12/2007 | CN101035411A 存储器模块 Memory Modules |
| 09/12/2007 | CN101034736A Light emitting element, light emitting device, and electronic device |
| 09/12/2007 | CN101034726A Light-emitting diode encapsulating parts |
| 09/12/2007 | CN101034718A Thin film transistor device and method of manufacturing the same |
| 09/12/2007 | CN101034710A Method capable of adjusting sensing part lens deviation and its encapsulation structure |
| 09/12/2007 | CN101034708A Nanowire memory device and method of manufacturing the same |
| 09/12/2007 | CN101034704A Semiconductor integrated circuit device and power source wiring method therefor |
| 09/12/2007 | CN101034703A Semiconductor apparatus |
| 09/12/2007 | CN101034701A IC stack structure and its making method |