Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2007
08/07/2007US7252139 Method and system for cooling electronic components
08/07/2007US7251872 Method for forming a chip package
08/07/2007CA2432508C High efficiency four port circuit
08/02/2007WO2007087620A2 Low profile semiconductor system having a partial-cavity substrate
08/02/2007WO2007087502A2 Flip-attached and underfilled stacked semiconductor devices
08/02/2007WO2007087249A2 Wafer level packaging to lidded chips
08/02/2007WO2007087247A2 Wafer level chip packaging
08/02/2007WO2007086668A1 Package of light emitting diode and method for manufacturing the same
08/02/2007WO2007086604A1 Electronic device cooling apparatus
08/02/2007WO2007086551A1 Printed-circuit board, and method for manufacturing the same
08/02/2007WO2007086498A1 Substrate with built-in semiconductor element and built-in semiconductor element type multilayered circuit board
08/02/2007WO2007086481A1 Electronic device package, module and electronic device
08/02/2007WO2007086443A1 Heat dissipating member and semiconductor device using same
08/02/2007WO2007086353A1 Liquid-cooled heat radiation device
08/02/2007WO2007086278A1 Integrated circuit device
08/02/2007WO2007085988A1 Stress buffering package for a semiconductor component
08/02/2007WO2007085774A1 Electronic module and a method of assembling such a module
08/02/2007WO2007070356A3 Package using array capacitor core
08/02/2007WO2007067591A3 Solder deposition and thermal processing of thin-die thermal interface material
08/02/2007WO2007050421A3 Semiconductor device with improved encapsulation
08/02/2007US20070179372 Analyte Monitoring Device and Methods of Use
08/02/2007US20070179370 Analyte Monitoring Device and Methods of Use
08/02/2007US20070178710 Method for sealing thin film transistors
08/02/2007US20070178628 Fabrication of an integrated circuit package
08/02/2007US20070178624 Semiconductor Arrangement
08/02/2007US20070178319 Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device
08/02/2007US20070177362 Covert intelligent networked sensors and other fully encapsulated circuits
08/02/2007US20070177246 Micromechanical Getter Anchor
08/02/2007US20070176619 Probe For Semiconductor Devices
08/02/2007US20070176317 Semiconductor device and method of manufacturing thereof
08/02/2007US20070176305 Alignment mark and overlay inspection mark
08/02/2007US20070176304 Regularly-aligned nano-structured material and method for producing the same
08/02/2007US20070176303 Circuit device
08/02/2007US20070176302 Low temperature co-fired ceramic module and method of manufacturing the same
08/02/2007US20070176301 Structure and Method for Bond Pads of Copper-Metallized Integrated Circuits
08/02/2007US20070176300 Wiring board and semiconductor apparatus
08/02/2007US20070176299 Power Semiconductor Component Having Chip Stack
08/02/2007US20070176298 Semiconductor device
08/02/2007US20070176297 Reworkable stacked chip assembly
08/02/2007US20070176296 Semiconductor device and method of manufacturing the same
08/02/2007US20070176294 Thorough wiring board and method of manufacturing the same
08/02/2007US20070176293 Semiconductor device having tin-based solder layer and method for manufacturing the same
08/02/2007US20070176292 Bonding pad structure
08/02/2007US20070176291 Cascoded rectifier package
08/02/2007US20070176290 Wafer level chip scale package having a gap and method for manufacturing the same
08/02/2007US20070176289 Plastic Ball Grid Array Package with Integral Heatsink
08/02/2007US20070176288 Solder wall structure in flip-chip technologies
08/02/2007US20070176287 Thin integrated circuit device packages for improved radio frequency performance
08/02/2007US20070176286 Composite core circuit module system and method
08/02/2007US20070176285 Integrated circuit underfill package system
08/02/2007US20070176284 Multi stack package with package lid
08/02/2007US20070176283 Solderable compact camera module
08/02/2007US20070176282 Aerogel/PTFE Composite Insulating Material
08/02/2007US20070176281 Semiconductor package
08/02/2007US20070176280 Waferscale package system
08/02/2007US20070176279 Circuit board, semiconductor package having the same, and method of manufacturing the circuit board
08/02/2007US20070176278 Multi-chips stacked package
08/02/2007US20070176277 Semiconductor module having a semiconductor chip stack and method
08/02/2007US20070176276 Semiconductor die assembly
08/02/2007US20070176275 Stack of semiconductor chips
08/02/2007US20070176274 Functional device-mounted module and a process for producing the same
08/02/2007US20070176273 Card and Manufacturing Method
08/02/2007US20070176272 Semiconductor device and manufacturing method thereof
08/02/2007US20070176271 Integrated circuit package system having die-attach pad with elevated bondline thickness
08/02/2007US20070176270 Microfabricated Beam Modulation Device
08/02/2007US20070176269 Multi-chips module package and manufacturing method thereof
08/02/2007US20070176268 Socketless planar semiconductor module
08/02/2007US20070176267 Aluminum leadframes for semiconductor QFN/SON devices
08/02/2007US20070176266 Semiconductor device
08/02/2007US20070176258 Method of manufacturing semiconductor device including bonding pad and fuse elements
08/02/2007US20070176257 Semiconductor device including fuse elements and bonding pad
08/02/2007US20070176243 Semiconductor device having capacitor capable of reducing additional processes and its manufacture method
08/02/2007US20070176241 Semiconductor chips having improved electrostatic discharge protection circuit arrangement
08/02/2007US20070176240 Wafer level package having floated metal line and method thereof
08/02/2007US20070176239 Trenched MOSFETS with improved ESD protection capability
08/02/2007US20070176169 Organic light emitting display including transparent cathode
08/02/2007US20070176128 Alignment systems and methods for lithographic systems
08/02/2007US20070175660 Warpage-reducing packaging design
08/02/2007US20070175658 High performance chip carrier substrate
08/02/2007US20070175656 Electrical component on a substrate and method for production thereof
08/02/2007US20070175623 Cooling System For Hybrid Vehicles
08/02/2007US20070175025 Method of manufacturing multi-layer wiring board
08/02/2007DE4418426B4 Halbleiterleistungsmodul und Verfahren zur Herstellung des Halbleiterleistungsmoduls The semiconductor power module and method of manufacturing the semiconductor power module
08/02/2007DE19833245B4 Halbleiterlichtemissionseinrichtung mit blasenfreiem Gehäuse Semiconductor light-emitting device with bubble-free housing
08/02/2007DE10359424B4 Umverdrahtungsplatte für Halbleiterbauteile mit engem Anschlussraster und Verfahren zur Herstellung derselben Rewiring for semiconductor devices with a narrow grid connection and method of making same
08/02/2007DE10339762B4 Chipstapel von Halbleiterchips und Verfahren zur Herstellung desselben The same chip stack of semiconductor chips and processes for making
08/02/2007DE10252106B4 Schnappverschließvorrichtung für einen KGD-Träger Schnappverschließvorrichtung for a KGD-carrier
08/02/2007DE10238843B4 Halbleiterbauelement Semiconductor device
08/02/2007DE102006051780A1 Kühlvorrichtung und Verfahren zu ihrer Herstellung Cooling device and process for their preparation
08/02/2007DE102006050211A1 Dampfkompresssionskühlsystem Dampfkompresssionskühlsystem
08/02/2007DE102006007293A1 Verfahren zum Herstellen eines Quasi-Substratwafers und ein unter Verwendung eines solchen Quasi-Substratwafers hergestellter Halbleiterkörper A method for manufacturing a quasi-substrate wafer, and a semiconductor body produced using such a quasi-substrate wafer
08/02/2007DE102006004428A1 Non-destructive metal delamination monitoring method e.g. for semiconductor devices, involves forming metal-comprising test plate in metallization layer stack of semiconductor device formed above substrate
08/02/2007DE102006003931B3 Halbleiterbauteil mit oberflächenmontierbaren Außenkontakten und Verfahren zur Herstellung desselben Of the same semiconductor device with surface-mountable external contacts and methods for preparing
08/02/2007DE102006002904A1 Bauelementanordnung und Verfahren zur Ermittlung der Temperatur in einem Halbleiterbauelement Component assembly and method for determining the temperature in a semiconductor device
08/02/2007DE102006001600B3 Semiconductor component with flip-chip contacts, has flip-chip contacts arranged on contact surfaces of upper metallization layer
08/02/2007DE102004020833B4 Material mit niedriger Wärmeausdehnung und hoher Wärmeleitfähigkeit auf Kupferbasis sowie Verfahren zum Herstellen desselben Of the same material of low thermal expansion and high thermal conductivity copper-based as well as methods for preparing
08/02/2007DE10143790B4 Elektronisches Bauteil mit wenigstens einem Halbleiterchip Electronic component with at least one semiconductor chip
08/02/2007DE10014304B4 Halbleiterbauelement und Verfahren zu dessen Herstellung Semiconductor device and process for its preparation
08/01/2007EP1814371A1 Printed circuit board and method of use thereof
08/01/2007EP1814321A1 Digital television receiver circuit module
1 ... 1042 1043 1044 1045 1046 1047 1048 1049 1050 1051 1052 1053 1054 1055 1056 1057 1058 1059 1060 1061 1062 ... 2262