| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 09/20/2007 | WO2006105514A3 Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sides |
| 09/20/2007 | US20070218643 Material for forming insulating film with low dielectric constant, low dielectric insulating film, method for forming low dielectric insulating film and semiconductor device |
| 09/20/2007 | US20070218614 Semiconductor Device and Method of Manufacturing The Same, Electronic Device and Method of Manufacturing The Same, and Electronic Instrument |
| 09/20/2007 | US20070217177 Semiconductor device, manufacturing method and mounting method of the semiconductor device, circuit board, and electronic apparatus |
| 09/20/2007 | US20070217148 Power supply cooling |
| 09/20/2007 | US20070217122 Capacitor |
| 09/20/2007 | US20070216281 Wavelength-converting casting composition and light-emitting semiconductor component |
| 09/20/2007 | US20070216041 Fiducial scheme adapted for stacked integrated circuits |
| 09/20/2007 | US20070216040 Epoxy Resin Composition for the Encapsulation of Semiconductors and Semiconductor Devices |
| 09/20/2007 | US20070216039 Electronic component integrated module and method for fabricating the same |
| 09/20/2007 | US20070216038 Method for producing semiconductor components |
| 09/20/2007 | US20070216037 Memory card structure and method for manufacturing the same |
| 09/20/2007 | US20070216036 Methods and structures for facilitating proximity communication |
| 09/20/2007 | US20070216035 Flip-chip type semiconductor device |
| 09/20/2007 | US20070216034 Low thermal resistance assembly for flip chip applications |
| 09/20/2007 | US20070216033 Carrierless chip package for integrated circuit devices, and methods of making same |
| 09/20/2007 | US20070216032 Enhancing metal/low-K interconnect reliability using a protection layer |
| 09/20/2007 | US20070216031 Formation of oxidation-resistant seed layer for interconnect applications |
| 09/20/2007 | US20070216030 Integrated circuit having a multilayer capacitance arrangement |
| 09/20/2007 | US20070216029 A method for fabricating a capacitor structure |
| 09/20/2007 | US20070216028 Micro-element package and manufacturing method thereof |
| 09/20/2007 | US20070216027 Semiconductor device |
| 09/20/2007 | US20070216026 Aluminum bump bonding for fine aluminum wire |
| 09/20/2007 | US20070216025 Device having a contacting structure |
| 09/20/2007 | US20070216024 Heat sink, electronic device, method of manufacturing heat sink, and method of manufacturing electronic device |
| 09/20/2007 | US20070216023 Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same |
| 09/20/2007 | US20070216022 Fin structure for a heat sink |
| 09/20/2007 | US20070216021 Semiconductor Device and Method of Manufacturing Thereof |
| 09/20/2007 | US20070216020 Semiconductor device |
| 09/20/2007 | US20070216019 Laminated ic packaging substrate and inter-connector structure thereof |
| 09/20/2007 | US20070216018 Assembling multi-core dice using sockets with multiple sets of front side bus contacts |
| 09/20/2007 | US20070216017 Composite contact |
| 09/20/2007 | US20070216016 Heat-radiating tape carrier package and method for manufacturing the same |
| 09/20/2007 | US20070216015 Integrated Circuit Chip With Electrostatic Discharge Protection Device |
| 09/20/2007 | US20070216014 Separable network interconnect systems and asemblies |
| 09/20/2007 | US20070216013 Power semiconductor module |
| 09/20/2007 | US20070216012 Method for mounting an electronic part on a substrate using a liquid containing metal particles |
| 09/20/2007 | US20070216011 Multichip module with improved system carrier |
| 09/20/2007 | US20070216010 Integrated circuit package system |
| 09/20/2007 | US20070216009 Semiconductor Package With Heat Spreader |
| 09/20/2007 | US20070216008 Low profile semiconductor package-on-package |
| 09/20/2007 | US20070216007 Multichip package system |
| 09/20/2007 | US20070216006 Integrated circuit package on package system |
| 09/20/2007 | US20070216005 Integrated circuit package-in-package system |
| 09/20/2007 | US20070216004 Blank including a composite panel with semiconductor chips and plastic package molding compound and method and mold for producing the same |
| 09/20/2007 | US20070216003 Semiconductor package with enhancing layer and method for manufacturing the same |
| 09/20/2007 | US20070216002 Semiconductor device |
| 09/20/2007 | US20070216001 Semiconductor package containing multi-layered semiconductor chips |
| 09/20/2007 | US20070216000 Cover tape for packaging semiconductor device and package for semiconductor device |
| 09/20/2007 | US20070215999 Semiconductor device |
| 09/20/2007 | US20070215998 LED package structure and method for manufacturing the same |
| 09/20/2007 | US20070215997 Chip-scale package |
| 09/20/2007 | US20070215996 Electronic Component and Method for its Assembly |
| 09/20/2007 | US20070215995 Fabrication processes of leadframe-based BGA packages and leadless leadframe implemented in the processes |
| 09/20/2007 | US20070215994 Connecting a Plurality of Bond Pads and/or Inner Leads With a Single Bond Wire |
| 09/20/2007 | US20070215993 Chip Package Structure |
| 09/20/2007 | US20070215992 Chip package and wafer treating method for making adhesive chips |
| 09/20/2007 | US20070215991 Tape |
| 09/20/2007 | US20070215990 Method for making QFN package with power and ground rings |
| 09/20/2007 | US20070215989 Semiconductor chip assembly |
| 09/20/2007 | US20070215987 Method for forming a memory device and memory device |
| 09/20/2007 | US20070215986 Hard mask layer stack and a method of patterning |
| 09/20/2007 | US20070215985 Novel chip packaging structure for improving reliability |
| 09/20/2007 | US20070215975 Method of fabricating semiconductor device |
| 09/20/2007 | US20070215949 Semiconductor device including MOS transistor having LOCOS offset structure and manufacturing method thereof |
| 09/20/2007 | US20070215948 Semiconductor device having function of improved electrostatic discharge protection |
| 09/20/2007 | US20070215947 Computer |
| 09/20/2007 | US20070215894 Insulation structure for high temperature conditions and manufacturing method thereof |
| 09/20/2007 | US20070215874 Layout and process to contact sub-lithographic structures |
| 09/20/2007 | US20070215820 Methods and systems for thermal-based laser processing a multi-material device |
| 09/20/2007 | US20070215435 Production System |
| 09/20/2007 | US20070215341 Device, cooling function monitoring apparatus, and fan deterioration monitoring program storing medium |
| 09/20/2007 | US20070215337 Heat Sink Material, Manufacturing Method For The Same, And Semiconductor Laser Device |
| 09/20/2007 | US20070215332 Fluid Cooling System |
| 09/20/2007 | DE202007009900U1 Kühlkörper mit Wärmetransportverstärkungsstruktur Heatsink with heat transfer enhancement structure |
| 09/20/2007 | DE202007007568U1 Eine flache Heatpipe (Wärmeleitrohr) und Kühlkörper welche diese verwenden A flat heat pipe (heat pipe) and heat sink using these |
| 09/20/2007 | DE10202881B4 Verfahren zur Herstellung von Halbleiterchips mit einer Chipkantenschutzschicht, insondere für Wafer Level Packaging Chips Method for manufacturing semiconductor chips with a chip edge protection layer, insondere for wafer level packaging chips |
| 09/20/2007 | DE102006012738A1 Nutzen aus einer Verbundplatte mit Halbleiterchips und Kunststoffgehäusemasse sowie Verfahren und Moldform zur Herstellung desselben Of the same benefits of a composite plate with semiconductor chips and plastic housing composition and method for the production and Moldform |
| 09/20/2007 | DE102006012600A1 Elektronisches Bauelement, elektronische Baugruppe sowie Verfahren zur Herstellung einer elektronischen Baugruppe An electronic component, electronic assembly and methods of making an electronic assembly |
| 09/20/2007 | DE102006011967A1 Halbleiterbauteil mit mehreren in ein gemeinsames Gehäuse gepackten Halbleiterchips und dafür eingerichtete Halbleiterchips A semiconductor device comprising a plurality of packed in a common housing a semiconductor chip and equipped for this purpose semiconductor chips |
| 09/20/2007 | DE102006011753A1 Halbleitersensorbauteil mit Sensorgehäuse und Sensorchip und Verfahren zur Herstellung desselben Of the same semiconductor sensor device with the sensor housing and the sensor chip and method for producing |
| 09/20/2007 | DE102006011706A1 Semiconductor component e.g. static RAM, testing method, involves transmitting test-signal applied to terminal of component to another terminal of component instead of switching core during test operating mode of component |
| 09/20/2007 | DE102006011697A1 Integrierte Halbleiterbauelementeanordnung und Verfahren zu deren Herstellung Integrated semiconductor device assembly and method for their preparation |
| 09/20/2007 | DE102006011332A1 Spannvorrichtung, Kühlkörperanordnung und Vorrichtung zur Kühlung Jig heat sink assembly and apparatus for cooling |
| 09/20/2007 | DE102006010733A1 Layer arrangement, has support layer arranged on substrate side and exhibiting top layer and balancing layer that is arranged between top layer and substrate, where top layer exhibits same coefficient of thermal expansion as substrate |
| 09/20/2007 | DE102006002753A1 Verfahren und Anordnung zur Bewertung der Unterätzung von tiefen Grabenstrukturen in SOI-Scheiben Method and apparatus for evaluating the undercutting of deep grave structures in SOI wafers |
| 09/20/2007 | DE102005061248B4 Systemträger mit in Kunststoffmasse einzubettenden Oberflächen, Verfahren zur Herstellung eines Systemträgers und Verwendung einer Schicht als Haftvermittlerschicht System carrier having embedded in plastics material surfaces, methods of manufacturing a system carrier, and use of a layer as a bonding layer |
| 09/20/2007 | DE10057080B4 Oberflächenmontierbares elektronisches Bauteil und Herstellungsverfahren dafür Surface-mountable electronic component, and manufacturing method thereof |
| 09/19/2007 | EP1835536A2 Integrated passive device substrate |
| 09/19/2007 | EP1834975A1 Poly(Phenylene ether) - Polyvinyl thermosetting resin |
| 09/19/2007 | EP1834357A2 Semiconductor structures utilizing thin film resistors and tungsten plug connectors and methods for making the same |
| 09/19/2007 | EP1834356A1 Structured lead frame |
| 09/19/2007 | EP1834355A1 Cooling device for cooling a semiconductor component, in particular, an optoelectronic semiconductor component |
| 09/19/2007 | EP1834354A1 Microelectronic assembly with built-in thermoelectric cooler and method of fabricating same |
| 09/19/2007 | EP1834351A1 Method for producing an electronic circuit |
| 09/19/2007 | EP1745509B1 A screened electrical device and a process for manufacturing the same |
| 09/19/2007 | EP1676316A4 Dc-dc converter implemented in a land grid array package |
| 09/19/2007 | EP1102525B1 Printed wiring board and method for producing the same |
| 09/19/2007 | CN200950717Y Quakeproof fan radiating structure |
| 09/19/2007 | CN200950716Y Composite radiating module |