Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2007
10/02/2007US7276801 Designs and methods for conductive bumps
10/02/2007US7276799 Chip stack package and manufacturing method thereof
10/02/2007US7276797 Structure and method for fabricating a bond pad structure
10/02/2007US7276796 Formation of oxidation-resistant seed layer for interconnect applications
10/02/2007US7276795 Small grain size, conformal aluminum interconnects and method for their formation
10/02/2007US7276794 Junction-isolated vias
10/02/2007US7276793 Semiconductor device and semiconductor module
10/02/2007US7276792 Semiconductor device, circuit substrate, electro-optic device and electronic appliance
10/02/2007US7276791 Board having alternating rows of processors and memories
10/02/2007US7276790 Methods of forming a multi-chip module having discrete spacers
10/02/2007US7276789 Microelectromechanical systems using thermocompression bonding
10/02/2007US7276788 Hydrophobic foamed insulators for high density circuits
10/02/2007US7276787 Silicon chip carrier with conductive through-vias and method for fabricating same
10/02/2007US7276786 Stacked board-on-chip package having mirroring structure and dual inline memory module on which the stacked board-on-chip packages are mounted
10/02/2007US7276785 Electronic module, panel having electronic modules which are to be divided up, and process for the production thereof
10/02/2007US7276784 Semiconductor device and a method of assembling a semiconductor device
10/02/2007US7276783 Electronic component with a plastic package and method for production
10/02/2007US7276782 Package structure for semiconductor
10/02/2007US7276781 Multichip module for LOC mounting and method for producing the multichip module
10/02/2007US7276780 Semiconductor device and chip-stack semiconductor device
10/02/2007US7276776 Semiconductor device
10/02/2007US7276767 Thin film resistor device and a method of manufacture therefor
10/02/2007US7276745 Gas sensor
10/02/2007US7276738 Miniature optical element for wireless bonding in an electronic instrument
10/02/2007US7276736 Wavelength-converting casting composition and white light-emitting semiconductor component
10/02/2007US7276731 Wiring line assembly and method for manufacturing the same, and thin film transistor array substrate having the wiring line assembly and method for manufacturing the same
10/02/2007US7276727 Electronic devices containing organic semiconductor materials
10/02/2007US7276667 Press-fit sealed electronic component and method for producing the same
10/02/2007US7276454 Application of impressed-current cathodic protection to prevent metal corrosion and oxidation
10/02/2007US7276441 Dielectric barrier layer for increasing electromigration lifetimes in copper interconnect structures
10/02/2007US7276440 Method of fabrication of a die oxide ring
10/02/2007US7276436 Manufacturing method for electronic component module and electromagnetically readable data carrier
10/02/2007US7276429 Method and apparatus for producing ultra-thin semiconductor chip and method and apparatus for producing ultra-thin back-illuminated solid-state image pickup device
10/02/2007US7276422 Post passivation interconnection schemes on top of the IC chips
10/02/2007US7276401 Adhesion by plasma conditioning of semiconductor chip surfaces
10/02/2007US7276400 Methods of making microelectronic packages with conductive elastomeric posts
10/02/2007US7276399 Method of designing a module-based flip chip substrate design
10/02/2007US7276387 Castellation wafer level packaging of integrated circuit chips
10/02/2007US7276300 comprising metal-oxide-containing layer, which is a ferroelectric or a paraelectsic which is covered by a hydrogen barrier layer, characterized in that the hydrogen barrier provides improved protection of a hydrogen-sensitive dielectric against hydrogen contamination
10/02/2007US7276292 Ceramic substrate board and a metal alloy layer consisting mainly of aluminum formed on a surface portion of the ceramic substrate board, wherein the Vickers hardness of the metal alloy layer is not less than 25 and not more than 40.
10/02/2007US7276222 Diamondoid-containing thermally conductive materials
10/02/2007US7276185 Easily ensure the conductivity at the same level as an Ag bulk by a low temperature treatment
10/02/2007US7275833 Cooling system and projection-type image display apparatus using the same
10/02/2007US7275696 Non-contact ID card and the like and method for manufacturing same
10/02/2007US7275432 Acceleration sensor and method of manufacturing acceleration sensor
10/02/2007US7275424 Wafer level capped sensor
10/02/2007US7275316 Method of embedding passive component within via
10/02/2007CA2402552C Electrocatalyst powders, methods for producing powders and devices fabricated from same
10/02/2007CA2211875C Low dielectric loss glasses
09/2007
09/27/2007WO2007109652A2 Aluminum bump bonding for fine aluminum wire
09/27/2007WO2007109492A2 Low profile semiconductor package-on-package
09/27/2007WO2007109486A2 Carrierless chip package for integrated circuit devices, and methods of making same
09/27/2007WO2007109133A2 Improved chip-scale package
09/27/2007WO2007108437A1 Silica powder and use thereof
09/27/2007WO2007108419A1 Infrared sensor and method for manufacturing infrared sensor
09/27/2007WO2007108281A1 Oxide particle-containing polysiloxane composition and method for producing same
09/27/2007WO2007108262A1 Transmitter/receiver
09/27/2007WO2007107964A1 Electrically enhanced wirebond package
09/27/2007WO2007107601A2 Carrier body for components or circuits
09/27/2007WO2007107119A1 Current carrier combined with heat-pipe
09/27/2007WO2007082373A8 A tunable semiconductor component provided with a current barrier
09/27/2007WO2006023914A3 Thermal fatigue resistant tin-lead-silver solder
09/27/2007US20070225465 Composition for Sealing Optical Semiconductor, Optical Semiconductor Sealing Material, and Method for Producing Composition for Sealing Optical Semiconductor
09/27/2007US20070224771 Semiconductor device having fuse and capacitor at the same level and method of fabricating the same
09/27/2007US20070224761 Semiconductor device and method for fabricating the same
09/27/2007US20070224760 Method for manufacturing semiconductor device
09/27/2007US20070224744 Thin film transistor, method of fabricating the same, and flat panel display using thin film transistor
09/27/2007US20070224731 Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film
09/27/2007US20070224730 Hillock-free aluminum layer and method of forming the same
09/27/2007US20070224511 Wiring parts are formed by utilizing such a conductor formulation, ensure the conductivity at the same level as an Ag bulk by a low temperature treatment
09/27/2007US20070224426 Use between a radiating body such as a heat sink and a heat-generating part for electronics or parts such as integrated circuits; binder component, a maleated liquid polyolefin, and thermally conductive filler(s) selected from metal oxides and metal hydroxides; good flexibility, no offensive odor
09/27/2007US20070223195 Method for Manufacturing a Heat Sink
09/27/2007US20070223159 Semiconductor Module with Serial Bus Connection to Multiple Dies
09/27/2007US20070222875 Semiconductor device
09/27/2007US20070222089 Semiconductor wafer, semiconductor device, and method of manufacturing semiconductor device
09/27/2007US20070222088 Overlay Metrology Mark
09/27/2007US20070222087 Semiconductor device with solderable loop contacts
09/27/2007US20070222086 On-die bond wires system and method for enhancing routability of a redistribution layer
09/27/2007US20070222085 Semiconductor device and fabrication process thereof
09/27/2007US20070222084 Device for avoiding parasitic capacitance in an integrated circuit package
09/27/2007US20070222083 RF and MMIC stackable micro-modules
09/27/2007US20070222082 Semiconductor integrated circuit device
09/27/2007US20070222081 Surface treatment of inter-layer dielectric
09/27/2007US20070222080 Semiconductor device and a method of manufacturing the same and designing the same
09/27/2007US20070222079 Method of manufacturing wiring substrate, and liquid ejection head manufactured by same
09/27/2007US20070222078 Semiconductor device and method of manufacturing the same
09/27/2007US20070222077 Composite semiconductor device, led head that employs the composite semiconductor device, and image forming apparatus that employs the led head
09/27/2007US20070222076 Single or dual damascene structure reducing or eliminating the formation of micro-trenches arising from lithographic misalignment
09/27/2007US20070222075 Wiring material and a semiconductor device having a wiring using the material, and the manufacturing method thereof
09/27/2007US20070222074 Electric Device With Vertical Component
09/27/2007US20070222073 Structure and method to improve current-carrying capabilities of c4 joints
09/27/2007US20070222072 Chip package and fabricating method thereof
09/27/2007US20070222071 Nitrogen Rich Barrier Layers and Methods of Fabrication Thereof
09/27/2007US20070222070 Contact piece member, contactor and contact method
09/27/2007US20070222069 Semiconductor integrated circuit device
09/27/2007US20070222068 Semiconductor device having multilayered interconnection structure formed by using Cu damascene method, and method of fabricating the same
09/27/2007US20070222067 Dielectric device
09/27/2007US20070222066 Structure and method of forming electrodeposited contacts
09/27/2007US20070222065 Method for precision assembly of integrated circuit chip packages
09/27/2007US20070222064 Thermal paste containment for semiconductor modules
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