Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2007
10/03/2007CN200956710Y Shaft-seal-free liquid-circulating-cooling radiating device
10/03/2007CN200956709Y Fan flow field gain structure for radiating device
10/03/2007CN200956708Y Heat pipe and radiating fin compact structure
10/03/2007CN200956705Y Radiating seat holding rod positioning structure
10/03/2007CN200956703Y Fin-type water-cooled radiator
10/03/2007CN200956701Y Flexible adhesive tape type radiator fin structure
10/03/2007CN200956700Y 散热器 Heat sink
10/03/2007CN200956685Y Electronic element-component package aluminium substrate
10/03/2007CN200956372Y Structure for improving brightness of luminous assembly with light-emitting diode
10/03/2007CN200956370Y Package-on-package structure for communication module
10/03/2007CN200956369Y Comsumption type terminal protection structure
10/03/2007CN200956368Y Mounted package casing for semiconductor power device
10/03/2007CN200955691Y 投射灯 Spot Light
10/03/2007CN101049056A Method for the production of a metal-ceramic substrate or copper-ceramic substrate, and support to be used in said method
10/03/2007CN101048868A Method for manufacturing semiconductor device having three-dimensional multilayer structure
10/03/2007CN101048867A Bi-directional ESD protection circuit
10/03/2007CN101048866A Wiring substrate of a semiconductor component comprising external contact pads for external contacts and method for producing the same
10/03/2007CN101048865A Chip comprising at least one test contact configuration
10/03/2007CN101048864A 半导体装置 Semiconductor device
10/03/2007CN101048863A 电子部件模块以及无线通信设备 Electronics module and a wireless communication device
10/03/2007CN101048521A High temperature lead-free solder and package for storing semiconductor element
10/03/2007CN101048444A Amide-substituted silicones and methods for their preparation and use
10/03/2007CN101048056A Radiator and its manufacturing method, electronic equipment with radiator
10/03/2007CN101048055A Advanced heat sinks and thermal spreaders
10/03/2007CN101048054A Fixing device for radiator
10/03/2007CN101048030A Printed wiring board, semiconductor package with printed wiring board and electronic device having printed circuit board
10/03/2007CN101048022A Organic luminous display
10/03/2007CN101047333A Switchable on-die decoupling cell
10/03/2007CN101047298A Electronic component and electronic component module
10/03/2007CN101047224A 热电模块 Thermoelectric Modules
10/03/2007CN101047217A LED with color package casing
10/03/2007CN101047216A Luminous device and manufacturing method thereof
10/03/2007CN101047209A 电容器结构及多层电容器结构 Capacitor structure and multilayer capacitor structure
10/03/2007CN101047201A Luminescent device, manufacturing method thereof and electric device
10/03/2007CN101047197A Solid-state image sensing device and method of operating the same
10/03/2007CN101047187A 存储器及其制造方法 Memory and manufacturing method thereof
10/03/2007CN101047186A Memory cell and related memory device
10/03/2007CN101047181A Electrostatic discharge protection device for raising electrostatic bleeder channel using longitudinal polysilicon
10/03/2007CN101047180A Electrostatic discharge protection device of dispersing electrostatic leakage current
10/03/2007CN101047179A Grid-shaped electrostatic discharge protection device
10/03/2007CN101047177A 半导体装置 Semiconductor device
10/03/2007CN101047174A Composite semiconductor device, LED head, and image forming apparatus
10/03/2007CN101047172A Compact type power semi-conductor module with connecting device
10/03/2007CN101047171A 半导体装置 Semiconductor device
10/03/2007CN101047167A Semiconductor package stack with through-via connection
10/03/2007CN101047166A Fuse memory bit with double voltage source and its power supplying method
10/03/2007CN101047165A Overlay mark arrangement for reducing overlay shift
10/03/2007CN101047164A Roughness reducing film at interface, materials for forming roughness reducing film at interface, wiring layer and semiconductor device prepared by the same, and method for manufacturing semiconductor
10/03/2007CN101047163A Semiconductor device and method for manufacturing the same
10/03/2007CN101047162A Semiconductor device and memory card using the same
10/03/2007CN101047161A Design of low inductance embedded capacitor layer connections
10/03/2007CN101047160A Semiconductor connection line packaging structure and its method of connection with IC
10/03/2007CN101047159A Multilayer interconnection substrate, semiconductor device, and solder resist
10/03/2007CN101047158A Semiconductor device and fabrication process thereof
10/03/2007CN101047157A Conducting pad system and its making method
10/03/2007CN101047156A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
10/03/2007CN101047155A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
10/03/2007CN101047154A 半导体装置及其形成方法 Semiconductor device and method of forming
10/03/2007CN101047153A 半导体集成电路芯片及其形成方法 And method of forming a semiconductor integrated circuit chip
10/03/2007CN101047152A Semiconductor device and a method of manufacturing the same
10/03/2007CN101047148A Manufacturing method of semiconductor device and semiconductor device corresponding to loop back test
10/03/2007CN101047147A IC structure and its making method
10/03/2007CN101047063A 电容结构 Capacitance structure
10/03/2007CN101047034A 存储器 Memory
10/03/2007CN101046283A Pipe cooled superhigh power LED lamp and its making process
10/03/2007CN101045852A Sealing material tablet, method of manufacturing the tablet and electronic component device
10/03/2007CN100341242C Master slice and substrate element and producing method therefor
10/03/2007CN100341234C Commutating crystal brake tube power-phase module of integrated gate pole
10/03/2007CN100341158C 半导体器件及微处理器 Semiconductor devices and the microprocessor
10/03/2007CN100341152C 半导体集成电路器件 The semiconductor integrated circuit device
10/03/2007CN100341150C electrostatic discharge protection assembly structure having low trigger voltage characteristics
10/03/2007CN100341149C Chip having specific configuration in I/O port
10/03/2007CN100341148C Wiring substrate
10/03/2007CN100341147C Chip terminating device in semiconductor IC and controlling method thereof
10/03/2007CN100341146C Semiconductor device and its producing technology
10/03/2007CN100341145C Air outlet flow guiding structure of radiating fan
10/03/2007CN100341144C Central type flow guiding heat radiation device
10/03/2007CN100341143C Semiconductor device miniature radiator
10/03/2007CN100341142C Power semiconductor composed by duplex-metal and china and its manufacturing method
10/03/2007CN100341141C Wiring substrate
10/03/2007CN100341137C Semiconductor multi-layer wiring plate and forming method thereof
10/03/2007CN100341136C Semiconductor device and forming method for interconnecting structure and copper wiring processing method
10/03/2007CN100341135C Semiconductor device
10/03/2007CN100341128C Manufacturing method and manufacturing apparatus for semiconductor device
10/03/2007CN100341127C 半导体器件 Semiconductor devices
10/03/2007CN100341112C Method for forming inductor and semiconductor structure
10/03/2007CN100340962C Touch induction packing structure
10/03/2007CN100340922C Impression mask photoetching
10/03/2007CN100340685C Lead-free tin-silver-copper alloy solder composition
10/02/2007US7277295 Industrial ethernet switch
10/02/2007US7277292 Expandable bracing apparatus and method
10/02/2007US7277290 Secure device for a heat dissipating component
10/02/2007US7277288 Heat sink assembly with retention module and clip
10/02/2007US7277285 Heat dissipation module
10/02/2007US7277284 Microchannel heat sink
10/02/2007US7277282 Integrated circuit cooling system including heat pipes and external heat sink
10/02/2007US7276956 Integrated circuit apparatus controlling source voltage of MOSFET based on temperature
10/02/2007US7276928 System and method for testing devices utilizing capacitively coupled signaling
10/02/2007US7276803 Semiconductor component and method for fabricating
10/02/2007US7276802 Semiconductor integrated circuit package having electrically disconnected solder balls for mounting
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