Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2007
10/04/2007US20070228569 Interconnects forming method and interconnects forming apparatus
10/04/2007US20070228568 Manufacturing Method of Semiconductor Device and Semiconductor Device Produced Therewith
10/04/2007US20070228567 Semiconductor Chip Comprising A Metal Coating Structure And Associated Production Method
10/04/2007US20070228566 Ball grid array package construction with raised solder ball pads
10/04/2007US20070228565 Ball grid array housing having a cooling foil
10/04/2007US20070228564 Flip chip bonded package applicable to fine pitch technology
10/04/2007US20070228563 High-performance semiconductor package
10/04/2007US20070228562 Electronic packaging using conductive interproser connector
10/04/2007US20070228561 Semiconductor device and manufacturing method thereof
10/04/2007US20070228560 Semiconductor device that improves electrical connection reliability
10/04/2007US20070228559 Connecting structure, method for forming bump, and method for producing device-mounting substrate
10/04/2007US20070228558 Semiconductor packaging unit with sliding cage
10/04/2007US20070228557 Electronic component, production method of electronic component, mounted structure of electronic component, and evaluation method of electronic component
10/04/2007US20070228556 Power Semiconductor Component with a Power Semiconductor Chip and Method for Producing the Same
10/04/2007US20070228554 Semiconductor device and manufacturing method thereof
10/04/2007US20070228553 Light assembly
10/04/2007US20070228552 Optical semiconductor device provided with phase control function
10/04/2007US20070228551 Optical semiconductor element and optical semiconductor device
10/04/2007US20070228550 Optical Semiconductor device
10/04/2007US20070228549 Interconnect structure with stress buffering ability and the manufacturing method thereof
10/04/2007US20070228548 Chip carrier substrate with a land grid array and external bond terminals
10/04/2007US20070228547 Integrated Circuit (IC) Carrier Assembly Incorporating An Integrated Circuit (IC) Retainer
10/04/2007US20070228546 Multi-chip package for reducing parasitic load of pin
10/04/2007US20070228545 Stacked semiconductor packages and method therefor
10/04/2007US20070228544 Semiconductor package stack with through-via connection
10/04/2007US20070228543 Controlling Flip-Chip Techniques for Concurrent Ball Bonds in Semiconductor Devices
10/04/2007US20070228542 Stacked integrated circuit
10/04/2007US20070228541 Method for fabricating chip package structure
10/04/2007US20070228540 MEMS Device Wafer-Level Package
10/04/2007US20070228539 Method for detaching a semiconductor chip from a foil and device for mounting semiconductor chips
10/04/2007US20070228538 Integrated circuit die with pedestal
10/04/2007US20070228537 Semiconductor Device
10/04/2007US20070228536 Memory card
10/04/2007US20070228535 Optical device package and optical semiconductor device using the same
10/04/2007US20070228534 Semiconductor device and manufacturing method of the same
10/04/2007US20070228533 Folding chip planar stack package
10/04/2007US20070228532 Edge Coating a Microelectronic Device
10/04/2007US20070228531 Apparatus and system for an IC substrate, socket, and assembly
10/04/2007US20070228530 Heat conductive bonding material, semiconductor package, heat spreader, semiconductor chip and bonding method of bonding semiconductor chip to heat spreader
10/04/2007US20070228529 Mounting substrate and manufacturing method thereof
10/04/2007US20070228528 Semiconductor device and manufacturing method thereof
10/04/2007US20070228527 Substrate for electronic device and method for processing same
10/04/2007US20070228526 Insulating film and semiconductor device
10/04/2007US20070228494 Electronic card with protection against aerial discharge
10/04/2007US20070228476 Semiconductor device
10/04/2007US20070228475 Esd protection circuit with isolated diode element and method thereof
10/04/2007US20070228474 Semiconductor integrated circuit device
10/04/2007US20070228430 Devices and Methods of Preventing Plasma Charging Damage in Semiconductor Devices
10/04/2007US20070228406 Chip package structure and method for manufacturing bumps
10/04/2007US20070228405 Electronic component and electronic component module
10/04/2007US20070228396 Light emitting unit and lighting apparatus
10/04/2007US20070228372 Method for Fabricating a Body Contact in a Finfet Structure and a Device Including the Same
10/04/2007US20070228371 Method for Evaluating Semiconductor Device
10/04/2007US20070228110 Method Of Wirebonding That Utilizes A Gas Flow Within A Capillary From Which A Wire Is Played Out
10/04/2007US20070228109 bonding an electronic device to a substrate; forming high-strength joints by soldering; low temperature melting
10/04/2007US20070227765 Multilayer printed circuit board and multilayer printed circuit board manufacturing method
10/04/2007US20070227761 Heat Conduction From an Embedded Component
10/04/2007US20070227710 Cooling system for electrical devices
10/04/2007US20070227705 Electronic Apparatus Having a Heat-Radiating Unit for Radiating Heat of Heat-Generating Components
10/04/2007US20070226998 Multi-layer circuit assembly and process for preparing the same
10/04/2007US20070226996 Hybrid integrated circuit device and method of manufacturing the same
10/04/2007DE202007008140U1 Abstrahlungsmodul mit niedrigem Wärmewiderstand und hohem Wärmeabstrahlungswirkungsgrad Radiation module with low thermal resistance and high heat radiation efficiency
10/04/2007DE19904363B4 Schaltungsanordnung zum Entstören von integrierten Schaltkreisen Circuit arrangement for suppressing of integrated circuits
10/04/2007DE19745243B4 Verfahren zum Herstellen eines mit Harz verschlossenen Halbleiterbauelements und Prägevorrichtung dafür A method for manufacturing a resin-sealed semiconductor device and embossing apparatus therefor
10/04/2007DE112005002899T5 Halbleiterbauelement mit einem Chip, der zwischen einer becherförmigen Leiterplatte und einer Leiterplatte mit Mesas und Tälern angeordnet ist A semiconductor device having a chip which is arranged between a cup-shaped printed circuit board and a circuit board having mesas and valleys
10/04/2007DE10345247B4 Verwendung von Leiterbahnen als Krallkörper Use of traces as claw body
10/04/2007DE10334575B4 Elektronisches Bauteil und Nutzen sowie Verfahren zur Herstellung derselben Electronic component and benefits as well as methods for making same
10/04/2007DE10310554B4 Feldeffekttransistor und Verstärkerschaltung mit dem Feldeffekttransistor Field effect transistor and the amplifier circuit with the field-effect transistor
10/04/2007DE10300711B4 Verfahren zur Passivierung eines Halbleiterchipstapels A method for passivation of a semiconductor chip stack
10/04/2007DE10257870B4 Halbleiterstruktur mit einer integrierten Abschirmung Semiconductor structure with an integrated shield
10/04/2007DE102007004005A1 Leistungshalbleitermodul The power semiconductor module
10/04/2007DE102006056816A1 Thermal management assembly for e.g. fuel cells, comprises heat sink including graphite layer (exhibiting thermal conductivity, which is anisotropic in nature) obtained by cleaving graphene layer from graphite sheet, and support layer
10/04/2007DE102006015222A1 Semiconductor or sensor arrangement for use in soldered housing, has surfaces soldered in region and connected with board in another region, where former region lying proximate at structure to be contacted is thicker than latter region
10/04/2007DE102006015115A1 Electronic module, has units and body covered with electrical insulating layer, where units have surfaces that are electrically conductive and connected by one unit with contact area of body and by path structure
10/04/2007DE102006013853A1 Leistungshalbleiterbauelement mit großflächigen Außenkontakten sowie Verfahren zur Herstellung desselben Power semiconductor component thereof with outer contacts, as well as large-scale process for preparing
10/04/2007DE102006013078A1 Kompaktes Leistungshalbleitermodul mit Verbindungseinrichtung Compact power semiconductor module with connector
10/04/2007DE102006010762B3 Integrierter Halbleiterspeicher Integrated semiconductor memory
10/04/2007DE102006009789B3 Verfahren zur Herstellung eines Halbleiterbauteils aus einer Verbundplatte mit Halbleiterchips und Kunststoffgehäusemasse A method for manufacturing a semiconductor device of a composite plate with semiconductor chips and plastic housing composition
10/04/2007DE102006008948B3 Verfahren zum Aufbringen und elektrischen Kontaktieren von elektronischen Bauteilen auf eine Substratbahn A method for applying and electrically contacting electronic components on a substrate web
10/04/2007DE102004057238B4 Halbleiterbauteil mit Passivierungsschicht A semiconductor device comprising passivating
10/04/2007DE10144704B4 Verfahren zum Verbinden eines Bauelements mit einem Träger A method for connecting a component with a carrier
10/03/2007EP1841298A2 Plated vias exit structure for printed circuit board
10/03/2007EP1840980A1 Structure comprising Peltier cells integrated on a semiconductor substrate and corresponding manufacturing process
10/03/2007EP1840973A2 Semi-conductor case with sliding cage.
10/03/2007EP1840964A1 Semiconductor device with protected access
10/03/2007EP1840963A2 Pressure contact assembly with a power output element, a metal casing and a connecting device
10/03/2007EP1840962A1 Fluid cooled electronic assembly
10/03/2007EP1840961A2 High performance semiconductor module and associated manufacturing method
10/03/2007EP1840953A1 Semiconductor device
10/03/2007EP1840952A1 Devices with microjetted polymer standoffs
10/03/2007EP1840941A2 Semiconductor device and manufacturing method thereof
10/03/2007EP1839335A1 Semiconductor device
10/03/2007EP1839334A1 Strip conductor structure for minimizing thermomechanical loads
10/03/2007EP1839333A2 Manufacturing method for semiconductor chips and semiconductor wafer
10/03/2007EP1839063A1 Method and apparatus for testing integrated circuits for susceptibility to latch-up
10/03/2007EP1473775B1 Method for producing solid-state imaging device
10/03/2007EP1316108B9 Fabrication process of a semiconductor device comprising an intermediate low-dielectric silicon nitride film
10/03/2007EP1021833B1 Device with security integrated circuit and method for making same
10/03/2007EP0821406B1 An integrated circuit on an ultra-flexible substrate and a method of wire bonding an integrated circuit to an ultra-flexible substrate
10/03/2007CN200956711Y Radiator bottom and structure comprising film heat transfer medium coating
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