Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2007
10/09/2007US7279781 Two-stage transfer molding device to encapsulate MMC module
10/09/2007US7279780 Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including same
10/09/2007US7279779 Substrate assembly for stressed systems
10/09/2007US7279778 Semiconductor package having a high-speed signal input/output terminal
10/09/2007US7279777 Organic polymers, laminates, and capacitors
10/09/2007US7279776 Method of manufacturing semiconductor device and semiconductor device
10/09/2007US7279775 Semiconductor die with protective layer and related method of processing a semiconductor wafer
10/09/2007US7279772 Edge intensive antifuse and method for making the same
10/09/2007US7279771 Wiring board mounting a capacitor
10/09/2007US7279768 Semiconductor device for overvoltage protection
10/09/2007US7279767 Semiconductor structure with high-voltage sustaining capability and fabrication method of the same
10/09/2007US7279753 Floating base bipolar ESD devices
10/09/2007US7279750 Semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion
10/09/2007US7279733 Dual damascene interconnection with metal-insulator-metal-capacitor and method of fabricating the same
10/09/2007US7279732 Enhanced atomic layer deposition
10/09/2007US7279724 Ceramic substrate for a light emitting diode where the substrate incorporates ESD protection
10/09/2007US7279720 Large bumps for optical flip chips
10/09/2007US7279719 Light emitting diode
10/09/2007US7279712 Solid state image pickup device and method of producing solid state image pickup device
10/09/2007US7279707 Test key structure
10/09/2007US7279706 Semiconductor device with electrode pad having probe mark
10/09/2007US7279689 Contact opening metrology
10/09/2007US7279682 Device for maintaining an object under vacuum and methods for making same, use in non-cooled infrared sensors
10/09/2007US7279642 Component with ultra-high frequency connections in a substrate
10/09/2007US7279423 Forming a copper diffusion barrier
10/09/2007US7279418 Plastically deformable irreversible storage medium and method of producing one such medium
10/09/2007US7279416 Methods of forming a conductive structure in an integrated circuit device
10/09/2007US7279409 Method for forming multi-layer bumps on a substrate
10/09/2007US7279408 Semiconductor device, method for manufacturing the same, and plating solution
10/09/2007US7279391 Integrated inductors and compliant interconnects for semiconductor packaging
10/09/2007US7279372 Manufacturing method of semiconductor device
10/09/2007US7279371 Thin film transistor array panel and manufacturing method thereof
10/09/2007US7279366 Method for assembling semiconductor die packages with standard ball grid array footprint
10/09/2007US7279365 Method of manufacturing heat conductive substrate
10/09/2007US7279363 Vertically stacked semiconductor device
10/09/2007US7279361 Method for making a semiconductor multi-package module having wire bond interconnect between stacked packages
10/09/2007US7279357 Method for fabricating a chip-scale-packaging (CSP) having an inductor
10/09/2007US7279356 Depopulation of a ball grid array to allow via placement
10/09/2007US7279355 Method for fabricating a packaging device for semiconductor die and semiconductor device incorporating same
10/09/2007US7279224 Multilayer; mixture of silicone rubber and heat conductive filler; heat exchanging
10/09/2007US7279118 Copper-containing material is formed over a semiconductor; forming methylated silicon nitride barrier layer; nitriding
10/09/2007US7279108 Plating a resistive material onto a portion of the insulative substrate which is between the metallic areas, such that the resistive material connects the metallic areas, and thereafter trimming at least a portion of the resistive material from the insulative substrate
10/09/2007US7279061 Process for the production of improved metallized films
10/09/2007US7279023 High power electronic packaging; diamond particles dispersed in and chemically bonded to surface of aluminum, copper and/or magnesium metal or alloy
10/09/2007US7278868 Socket for semiconductor device
10/09/2007US7278564 Method of mounting electronic component, structure for mounting electronic component, electronic component module, and electronic apparatus
10/09/2007US7278549 Remedies to prevent cracking in a liquid system
10/09/2007US7278474 Heat exchanger
10/09/2007US7278469 Thin sheet type heat pipe
10/09/2007US7278467 Liquid-cooled heat radiator kit
10/09/2007US7278209 Method for manufacturing heat sink for use in heat sink fan
10/09/2007US7278207 Method of making an electronic package
10/09/2007US7278206 Method of preparing terminal board
10/04/2007WO2007112396A2 Semiconductor devices and electrical parts manufacturing using metal coated wires
10/04/2007WO2007112393A2 Semiconductor device with solderable loop contacts
10/04/2007WO2007112361A2 Structure and method of forming electrodeposited contacts
10/04/2007WO2007111606A1 Radiation-or thermally-curable barrier sealants
10/04/2007WO2007111518A1 Filling of nanoscale and microscale structures
10/04/2007WO2007111125A1 Electroless plating liquid
10/04/2007WO2007110988A1 Process for producing semiconductor device
10/04/2007WO2007110985A1 Composite substrate and method of manufacturing composite substrate
10/04/2007WO2007110959A1 Process for producing semiconductor device
10/04/2007WO2007110799A2 Low ohmic through substrate interconnection for semiconductor carriers
10/04/2007WO2007110680A1 Lead frame with non-conductive connective bar
10/04/2007WO2007095461A3 Surface acoustic wave packages and methods of forming same
10/04/2007WO2007079125A3 Leadframe based flash memory cards
10/04/2007WO2007079121A3 Interconnected ic packages with vertical smt pads
10/04/2007WO2007078714A3 Integrated capacitors in package-level structures, processes of making same, and systems containing same
10/04/2007WO2007053523A3 Stacked module systems and methods
10/04/2007WO2007041100A3 Pakaged electronic devices and process of manufacturing same
10/04/2007WO2007005844A3 Schottky diode with improved surge capability
10/04/2007WO2006091793A8 Microelectronic assemblies having compliancy
10/04/2007US20070234243 Design data creating method, design data creating program product, and manufacturing method of semiconductor device
10/04/2007US20070232061 Semiconductor device having adhesion increasing film to prevent peeling
10/04/2007US20070232059 Multilayer interconnection substrate and method of manufacturing the same
10/04/2007US20070232053 Method for fabricating thermal compliant semiconductor chip wiring structure for chip scale packaging
10/04/2007US20070231971 Methods of Packaging Using Fluid Resin
10/04/2007US20070231964 Methods of forming semiconductor assemblies
10/04/2007US20070231949 Functional blocks for assembly and method of manufacture
10/04/2007US20070231936 Fabrication Method of Semiconductor Integrated Circuit Device
10/04/2007US20070231552 fireproofing, materials handling; polytriazines
10/04/2007US20070230153 Semiconductor Device
10/04/2007US20070230139 Semiconductor Module with Serial Bus Connection to Multiple Dies
10/04/2007US20070230134 Semiconductor Module with Serial Bus Connection to Multiple Dies
10/04/2007US20070230120 Electronic Apparatus Having a Heat-Radiating Unit for Radiating Heat of Heat-Generating Components
10/04/2007US20070229210 Composite Device
10/04/2007US20070229143 Power Module
10/04/2007US20070228583 Methods of bridging lateral nanowires and device using same
10/04/2007US20070228582 Tape wiring substrate and tape package using the same
10/04/2007US20070228581 Universal chip package structure
10/04/2007US20070228580 Semiconductor device having stacked structure and method of manufacturing the same
10/04/2007US20070228579 Chip stack package utilizing a dummy pattern die between stacked chips for reducing package size
10/04/2007US20070228578 Circuit substrate
10/04/2007US20070228577 Packaged microelectronic devices recessed in support member cavities, and associated methods
10/04/2007US20070228575 Wiring material and wiring board using the same
10/04/2007US20070228574 Semiconductor device and a method of manufacturing the same
10/04/2007US20070228573 Semiconductor device having capacitor formed in multilayer wiring structure
10/04/2007US20070228572 Formation of an integrated circuit structure with reduced dishing in metallization levels
10/04/2007US20070228571 Interconnect structure having a silicide/germanide cap layer
10/04/2007US20070228570 RELIABLE BEOL INTEGRATION PROCESS WITH DIRECT CMP OF POROUS SiCOH DIELECTRIC
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