Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2007
10/10/2007EP1843397A1 Semiconductor device
10/10/2007EP1843393A2 Pressure contact type power semiconductor module
10/10/2007EP1843392A1 Electronics assembly having heat sink substrate disposed in cooling vessel
10/10/2007EP1843391A1 Stacked electronic component, electronic device and method for manufacturing stacked electronic component
10/10/2007EP1842408A2 Low thermal resistance power module assembly
10/10/2007EP1842237A2 Electronic device and process for forming same
10/10/2007EP1842233A1 Interconnect structures with bond-pads and methods of forming bump sites on bond-pads
10/10/2007EP1842232A1 Improvements to ceramic packages for high frequency circuits
10/10/2007EP1842021A1 Vapor chamber with boiling-enhanced multi-wick structure
10/10/2007EP1695382A4 Thermal interface material and solder preforms
10/10/2007EP1561368B1 Multi-layer circuit assembly and process for preparing the same
10/10/2007EP1408087B1 Epoxy-polysiloxane resin compositions, solid state devices encapsulated therewith and method
10/10/2007EP1334647B1 Integrated circuit carrier
10/10/2007CN200959704Y Radiator structural improvement
10/10/2007CN200959702Y 固定扣件 Fixed Fastener
10/10/2007CN200959567Y Rectifier structure with hot-pipe radiating for large element of locomotive
10/10/2007CN200959342Y LED device
10/10/2007CN200959340Y Light-emitting diode structure
10/10/2007CN200959334Y Memory radiator with replaceable central radiating plate
10/10/2007CN200959333Y Electronic-power device module
10/10/2007CN101053290A Immersion cooling apparatus
10/10/2007CN101053145A Three level power converter
10/10/2007CN101053086A Semiconductor sensor component with cavity cover and sensor chip and manufacturing method thereof
10/10/2007CN101053080A Electronic package for image sensor, and the packaging method thereof
10/10/2007CN101053079A Stacked packaging improvements
10/10/2007CN101053078A High withstand voltage semiconductor device covered with resin and manufacturing method therefor
10/10/2007CN101053073A Selective w-cvd process and process for producing cu multilayer wiring
10/10/2007CN101053005A Active matrix substrate, display device, and pixel defect correcting method
10/10/2007CN101052291A Prefabricated plate type heat radiation element
10/10/2007CN101052290A High efficiency heat radiation cool plate for electronic device
10/10/2007CN101052289A Heat radiation fin
10/10/2007CN101052288A Cooler for electronic device
10/10/2007CN101051664A Semiconductor light emitting device
10/10/2007CN101051659A LED tube rack and its forming method
10/10/2007CN101051647A 有机发光显示装置及其测试方法 The organic light emitting display device and test methods
10/10/2007CN101051646A Phase change memory fabricated using self-aligned processing
10/10/2007CN101051645A Pixel array substrate
10/10/2007CN101051644A Thin film transistor substrate and method of fabricating the same
10/10/2007CN101051642A Thin film transistor array base board and its repairing method
10/10/2007CN101051635A Solid-state image pickup device and method for manufacturing thereof
10/10/2007CN101051634A Silicon lining bottom plane LED integrated chip and producing method
10/10/2007CN101051633A A package having an array of embedded capacitors for power delivery and decoupling in the mid-frequency range and methods of forming thereof
10/10/2007CN101051632A Interconnection structure and its making method
10/10/2007CN101051631A Interconnecting machine structure, damascene structure of IC and semiconductor structure
10/10/2007CN101051630A Semiconductor chip or device of vertical structure
10/10/2007CN101051629A Semiconductor package structure and its producing method
10/10/2007CN101051628A Micro link lug structure with stress buffer and its producing method
10/10/2007CN101051627A Semiconductor device and its making method
10/10/2007CN101051626A Semiconductor structure of display device and its producing method and pixel capacitance structure
10/10/2007CN101051623A Method for forming self-aligned contacts and local interconnects simultaneously
10/10/2007CN101051621A Method of manufacturing semiconductor device and semiconductor device
10/10/2007CN101051618A Method for fabricating a BGA device and BGA device
10/10/2007CN101051617A Lug process and wafer structure of protective detection welding pad
10/10/2007CN101051615A Base plate with buried passive element and its producing method
10/10/2007CN101051614A Method for forming reinforced interconnects on a substrate
10/10/2007CN101051134A Liquid crystal display device, semiconductor device, and electronic appliance
10/10/2007CN100342765C Electromagnetic noise reduction device
10/10/2007CN100342538C Semiconductor device, electronic apparatus and their manufacturing methods, electronic equipment
10/10/2007CN100342537C Semiconductor apparatus and processing system utilizing the same semiconductor apparatus
10/10/2007CN100342536C Integrated electronic micromodule and method for making same
10/10/2007CN100342535C Turn-on-efficient bipolar structures with deep N-well for on-chip ESD protection
10/10/2007CN100342534C Stacked microelectronic packages
10/10/2007CN100342533C Semiconductor device and its manufacturing method
10/10/2007CN100342532C Structure of conductive pad in use for encapsulating chips
10/10/2007CN100342531C Composite scab structure and producing method thereof
10/10/2007CN100342530C Thermolysis modules possessing guidance air pipe and fan housing
10/10/2007CN100342529C Micropassage type radiator based on diamond film
10/10/2007CN100342528C Resin-sealed semiconductor device and method of manufacturing the device
10/10/2007CN100342527C Heat conductive multilayer substrate and substrate for power module
10/10/2007CN100342526C Semiconductor sealing baseplate structure of electric padding metal protective layer and producing method thereof
10/10/2007CN100342523C Three dimensional CMOS integrated circuits having device layers built on different crystal oriented wafers
10/10/2007CN100342513C Bumpless semiconductor device
10/10/2007CN100342512C Bonded structure using reacted borosilicate mixture
10/10/2007CN100342511C Underfill encapsulant for wafer packaging and method for its application
10/10/2007CN100342453C Ferroelectric memory circuit and method for its fabrication
10/10/2007CN100341937C Resin composition for radiating material and radiating material
10/09/2007US7281231 Integrated circuit structure and a design method thereof
10/09/2007US7280362 Method and apparatus for attaching a processor and corresponding heat sink to a circuit board
10/09/2007US7280359 Heat-radiating structure of electronic apparatus
10/09/2007US7280358 Liquid loop with multiple heat exchangers for efficient space utilization
10/09/2007US7280357 Pump and electronic device having the pump
10/09/2007US7280329 Integrated circuit device having input/output electrostatic discharge protection cell equipped with electrostatic discharge protection element and power clamp
10/09/2007US7280328 Semiconductor integrated circuit device
10/09/2007US7279963 Low inductance semiconductor device having half-bridge configuration
10/09/2007US7279798 High wireability microvia substrate
10/09/2007US7279797 Module assembly and method for stacked BGA packages
10/09/2007US7279796 Microelectronic die having a thermoelectric module
10/09/2007US7279795 Stacked die semiconductor package
10/09/2007US7279794 Semiconductor device and electronic device, and methods for manufacturing thereof
10/09/2007US7279792 Semiconductor device and method of manufacturing same
10/09/2007US7279791 Semiconductor device and method of fabricating the same
10/09/2007US7279790 Semiconductor device and a manufacturing method thereof
10/09/2007US7279789 Thermally enhanced three-dimensional package and method for manufacturing the same
10/09/2007US7279788 Device for establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate
10/09/2007US7279787 Microelectronic complex having clustered conductive members
10/09/2007US7279786 Nested integrated circuit package on package system
10/09/2007US7279785 Stacked die package system
10/09/2007US7279784 Semiconductor package
10/09/2007US7279783 Partitioned integrated circuit package with central clock driver
10/09/2007US7279782 FBGA and COB package structure for image sensor
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