Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2007
10/11/2007WO2007113079A1 Heat sink and its use as a cooling and screening apparatus
10/11/2007WO2007112664A1 Heat exchange enhancement
10/11/2007WO2007112662A1 Heat exchange enhancement
10/11/2007WO2007112661A1 Heat exchange enhancement
10/11/2007WO2007096463A3 Element
10/11/2007WO2007075352A3 Rfid tag film embossing manufacturing techniques
10/11/2007WO2007060640A3 Method of forming a self aligned copper capping layer
10/11/2007WO2007007273A3 Ldmos transistor
10/11/2007WO2006041580A9 3d interconnect with protruding contacts
10/11/2007WO2005117092A3 Stacked semiconductor package having adhesive/spacer structure and insulation
10/11/2007WO2004083759A3 Apparatus and method of forming channels in a heat-exchanging device
10/11/2007US20070240083 Processing apparatus
10/11/2007US20070238223 Apparatus and method for signal bus line layout in semiconductor device
10/11/2007US20070238206 System and apparatus for using test structures inside of a chip during the fabrication of the chip
10/11/2007US20070237976 Surface Treated Copper Foil, Flexible Copper-Clad Laminate Manufactured Using the Same, and Film Carrier Tape
10/11/2007US20070237970 Diffusion barrier with low dielectric constant and semiconductor device containing same
10/11/2007US20070237480 Method for fabricating thick film alumina structures used in high frequency, low loss applications and a structure resulting therefrom
10/11/2007US20070236232 System and apparatus for using test structures inside of a chip during the fabrication of the chip
10/11/2007US20070235888 Film type package and display apparatus having the same
10/11/2007US20070235887 Bonding Wire and Integrated Circuit Device Using the Same
10/11/2007US20070235886 Semiconductor die packages using thin dies and metal substrates
10/11/2007US20070235885 Semiconductor device
10/11/2007US20070235884 Surface structure of flip chip substrate
10/11/2007US20070235883 Combined semiconductor apparatus and a fabricating method thereof
10/11/2007US20070235882 Semiconductor device and method for fabricating the same
10/11/2007US20070235881 Semiconductor Device and Method of Manufacturing the Same, Circuit Board and Electronic Device
10/11/2007US20070235880 Semiconductor device and method of fabricating the same
10/11/2007US20070235879 Hybrid stacking package system
10/11/2007US20070235878 Integrated circuit package system with post-passivation interconnection and integration
10/11/2007US20070235877 Integration scheme for semiconductor photodetectors on an integrated circuit chip
10/11/2007US20070235876 Method of forming an atomic layer thin film out of the liquid phase
10/11/2007US20070235875 Low leakage metal-containing cap process using oxidation
10/11/2007US20070235874 Semiconductor integrated circuit device
10/11/2007US20070235873 Pad structures and methods for forming pad structures
10/11/2007US20070235872 Semiconductor package structure
10/11/2007US20070235871 High frequency IC package and method for fabricating the same
10/11/2007US20070235870 Common Assembly Substrate and Applications Thereof
10/11/2007US20070235869 Integrated circuit package system with wire bond pattern
10/11/2007US20070235868 Protective covers for gas sensor, gas sensor and gas sensor manufacturing method
10/11/2007US20070235867 Field effect transistor with interleaved layout
10/11/2007US20070235866 Housing for accommodating microwave devices
10/11/2007US20070235865 Semiconductor module havingdiscrete components and method for producing the same
10/11/2007US20070235864 Single package wireless communication device
10/11/2007US20070235863 LED chip array module
10/11/2007US20070235862 Hybrid flip-chip and wire-bond connection package system
10/11/2007US20070235861 Semiconductor device package with a heat sink and method for fabricating the same
10/11/2007US20070235860 Power semiconductor module with flush terminal elements
10/11/2007US20070235859 Integrated circuit package system with heatspreader
10/11/2007US20070235858 Mounting assembly for semiconductor devices
10/11/2007US20070235857 Semiconductor device having an adhesion promoting layer and method for producing it
10/11/2007US20070235856 Substrate for a microelectronic package and method of fabricating thereof
10/11/2007US20070235855 Methods and apparatus for a reduced inductance wirebond array
10/11/2007US20070235854 Integrated circuit package system with ground ring
10/11/2007US20070235853 Chip package structure
10/11/2007US20070235852 Method and system for sealing packages for optics
10/11/2007US20070235851 Point-to-point connection topology for stacked devices
10/11/2007US20070235850 Packaged system of semiconductor chips having a semiconductor interposer
10/11/2007US20070235849 Semiconductor package and method using isolated Vss plane to accommodate high speed circuitry ground isolation
10/11/2007US20070235848 Substrate having conductive traces isolated by laser to allow electrical inspection
10/11/2007US20070235847 Method of making a substrate having thermally conductive structures and resulting devices
10/11/2007US20070235846 Integrated circuit package system with net spacer
10/11/2007US20070235845 Apparatus, system and method for use in mounting electronic elements
10/11/2007US20070235844 Electronic device mounting structure and method of manufacturing the same
10/11/2007US20070235843 Electronic device with selective nickel palladium gold plated leadframe and method of making the same
10/11/2007US20070235812 Semiconductor device and method for manufacturing the same
10/11/2007US20070235810 Power semiconductor module and fabrication method
10/11/2007US20070235809 Semiconductor device
10/11/2007US20070235808 Substrate-biased Silicon Diode for Electrostatic Discharge Protection
10/11/2007US20070235774 Chip scale surface mount package for semiconductor device and process of fabricating the same
10/11/2007US20070235773 Gas-sensitive field-effect transistor for the detection of hydrogen sulfide
10/11/2007US20070235749 Miniature mt optical assembly (mmtoa)
10/11/2007US20070235685 Etching reagent, and method for manufacturing electronic device substrate and electronic device
10/11/2007US20070235180 Multichannel cooling system with magnetohydrodynamic pump
10/11/2007US20070235167 Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers
10/11/2007US20070235127 Photochemically and thermally curable adhesive formulations
10/11/2007DE202007011063U1 Kühlmodul Cooling module
10/11/2007DE19781978B4 Gehäuse für eine integrierte Schaltung und Verfahren zu dessen Herstellung Housing for an integrated circuit and method for its production
10/11/2007DE10308323B4 Halbleiterchipanordnung mit ROM Semiconductor chip assembly with ROM
10/11/2007DE10247035B4 Speichermodul mit einer Wärmeableiteinrichtung Memory module with a heat sink
10/11/2007DE102007015731A1 Halbleitervorrichtung mit Wärmeabstrahlteil und Halbleiterchip und Verfahren zu dessen Herstellung A semiconductor device having heat radiation and the semiconductor chip and process for its preparation
10/11/2007DE102007012986A1 Vertikaler Halbleiterleistungsschalter, elektronisches Bauelement und Verfahren zu dessen Herstellung Vertical semiconductor power switch, electronic component and method for its production
10/11/2007DE102007008389A1 Excess temperature recognizing circuit arrangement for power transistor, has temperature sensor with parasitic diode structure, and unit evaluating current supplied to diode and temperature dependent voltage drop at diode
10/11/2007DE102006062030A1 Schaltbare On-Die-Entkopplungszelle Switched On-The-decoupling cell
10/11/2007DE102006018709B3 Heat exchanger for cooling electronic component, has two stages arranged consecutively, where each stage has heat exchanging channel and guiding channels that are in flow connection with heat exchanging channels of next stages
10/11/2007DE102006016812A1 Bauelement mit einem Halbleitersubstrat und Verfahren zu dessen Herstellung Component having a semiconductor substrate and process for its preparation
10/11/2007DE102006015510A1 Illuminating assembly, has chip receiver attached to contact surface of rib type cooling unit and defining mounting recess, and light emitting chip installed in chip receiver and comprising connecting unit with two connecting contacts
10/11/2007DE102006015447A1 Leistungshalbleiterbauelement mit einem Leistungshalbleiterchip und Verfahren zur Herstellung desselben Power semiconductor component thereof with a power semiconductor chip and method for producing
10/11/2007DE102006015377A1 Halbleiter-Strahlungsquelle sowie Lichthärtgerät Semiconductor radiation source and light curing device
10/11/2007DE102006014733A1 Integrierte Schaltungsanordnung mit einer Mehrzahl extern gespeister Stromversorgungsnetze An integrated circuit device having a plurality of externally-powered power supply networks
10/11/2007DE102006014609A1 Semiconductor module, has plumb layer forming layer compound together with substrate underside-metallization layer, where edges of layer compound are formed such that radii of edges lie in specific range
10/11/2007DE102006014582A1 Halbleitermodul Semiconductor module
10/11/2007DE102006014145A1 Druck kontaktierte Anordnung mit einem Leistungsbauelement, einem Metallformkörper und einer Verbindungseinrichtung Pressure-contact arrangement with a power device, a metal mold body and a connecting means
10/11/2007DE102006012977A1 Thermal-insulating layer system for use in e.g. gas turbine, has active thermal-insulating layer counteracting heat flow, which is defined by intrinsic thermal conductivity of passive poor heat conducting thermal-insulating layer
10/11/2007DE102006012615A1 Enclosing unit, has intermediate layers enclosing electronic circuit, and claddings surrounding intermediate layers, where electronic circuit is surrounded by one intermediate layer
10/11/2007DE102005061263B4 Halbleiterwafersubstrat für Leistungshalbleiterbauelemente sowie Verfahren zur Herstellung desselben The same semiconductor wafer substrate for power semiconductor devices and methods for preparing
10/11/2007DE102004042538B4 Verfahren zum Herstellen eines Gehäuses für eine elektronische Komponente A method of manufacturing a housing for an electronic component
10/11/2007DE102004021122B4 Anordnung in Druckkontaktierung mit einem Leistungshalbleitermodul Arrangement in pressure contact with a power semiconductor module
10/11/2007DE10132763B4 Integrierte Halbleiterschaltung, Verfahren zum Kühlen eines Mikrowellenschaltungsbereiches und Verfahren zum Herstellen einer integrierten Halbleiterschaltung A semiconductor integrated circuit, method of cooling a microwave circuit section and method for manufacturing a semiconductor integrated circuit
10/10/2007EP1843453A1 Rotary electric machine
10/10/2007EP1843403A2 Light emitting unit and lighting apparatus
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