Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2007
10/17/2007CN101054508A Composite epoxy type electron packaging material and preparation method thereof
10/17/2007CN101054458A Hydrophobic crosslinkable compositions for electronic applications
10/17/2007CN100344217C 电子设备和电路模块设备 Electronic devices and circuit modules equipment
10/17/2007CN100344216C Pin grid array package socket
10/17/2007CN100344211C Static electricity protective circuit and high-frequency circuit apparatus incorporating the same
10/17/2007CN100343992C 半导体器件 Semiconductor devices
10/17/2007CN100343991C Repair fuse box of semiconductor device
10/17/2007CN100343990C Semiconductor structure and its producing method
10/17/2007CN100343989C 集成电路芯片组件 IC chip assembly
10/17/2007CN100343988C Method and apparatus for mounting a lidless semiconductor device
10/17/2007CN100343987C Semiconductor device having metal plates and semiconductor chip
10/17/2007CN100343986C Member for semiconductor device
10/17/2007CN100343985C Heat dissipating device
10/17/2007CN100343984C Constructed configuration of heat sink capable of embedding semiconductor of electronic module
10/17/2007CN100343983C Secondary packaging device of avalanche photodiode for infrared photodetection
10/17/2007CN100343975C Method of manufacturing semiconductor device
10/17/2007CN100343965C Semiconductor device having conducting portion of upper and lower conductive layers, and method of fabricating the same
10/17/2007CN100343959C Production method for semiconductor device
10/17/2007CN100343955C Method for making integrated circuit using memory wordline hard mask extension
10/17/2007CN100343954C Method of fabricating crystalline silicon and switching device using crystalline silicon
10/17/2007CN100343784C Fan vane unit of centrifugal fan
10/17/2007CN100343782C Redundant liquid cooling system and electronic apparatus having the same therein
10/17/2007CN100343611C Structure and fabricating method for radiating module
10/17/2007CN100343354C Thermally-formable and cross-linkable precursor of a thermally conductive material
10/17/2007CN100343170C Particulate alumina, method for producing particulate alumina and composition containing particulate alumina
10/16/2007US7283401 Monolithic, combo nonvolatile memory allowing byte, page and block write with no disturb and divided-well in the cell array using a unified cell structure and technology with a new scheme of decoder and layout
10/16/2007US7283373 Electronic device
10/16/2007US7283368 Heat dissipating assembly
10/16/2007US7283364 Thermal management apparatus
10/16/2007US7283361 Heat dissipation device
10/16/2007US7283360 Enhanced flow channel for component cooling in computer systems
10/16/2007US7283236 Alignment system and lithographic apparatus equipped with such an alignment system
10/16/2007US7283130 Display device
10/16/2007US7282988 Bandgap reference circuit
10/16/2007US7282951 Reconfigurable processor module comprising hybrid stacked integrated circuit die elements
10/16/2007US7282940 Semiconductor device with electrode pads for test probe
10/16/2007US7282932 Compliant contact pin assembly, card system and methods thereof
10/16/2007US7282931 Full wafer contacter and applications thereof
10/16/2007US7282906 Electronic circuit protection device
10/16/2007US7282824 Press-fitting method and rectifying device having press-fitted member
10/16/2007US7282806 Semiconductor devices at least partially covered by a composite coating including particles dispersed through photopolymer material
10/16/2007US7282805 Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting element
10/16/2007US7282804 Structure of high performance combo chip and processing method
10/16/2007US7282803 Integrated electronic circuit comprising a capacitor and a planar interference inhibiting metallic screen
10/16/2007US7282802 Modified via bottom structure for reliability enhancement
10/16/2007US7282801 Microelectronic device chip including hybrid Au bump, package of the same, LCD apparatus including microelectronic device chip and method of fabricating microelectronic device chip
10/16/2007US7282800 Semiconductor device and method of manufacturing the same
10/16/2007US7282799 Thermal interface with a patterned structure
10/16/2007US7282798 Spontaneous emission enhanced heat transport method and structures for cooling, sensing, and power generation
10/16/2007US7282797 Graded liquid crystal polymer package
10/16/2007US7282796 Electronic assembly having a more dense arrangement of contacts that allows for routing of traces to the contacts
10/16/2007US7282795 Modifying a semiconductor device to provide electrical parameter monitoring
10/16/2007US7282794 Multiple die stack apparatus employing t-shaped interposer elements
10/16/2007US7282793 Multiple die stack apparatus employing T-shaped interposer elements
10/16/2007US7282792 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
10/16/2007US7282791 Stacked semiconductor device and semiconductor memory module
10/16/2007US7282790 Planar array contact memory cards
10/16/2007US7282789 Back-to-back semiconductor device assemblies
10/16/2007US7282788 Image sensing chip package structure
10/16/2007US7282787 Laminated multiple substrates
10/16/2007US7282786 Semiconductor package and process for making the same
10/16/2007US7282785 Surface mount type semiconductor device and lead frame structure thereof
10/16/2007US7282778 Chemical sensor using chemically induced electron-hole production at a Schottky barrier
10/16/2007US7282769 Thin film transistor device and method of making the same
10/16/2007US7282768 MOS field-effect transistor
10/16/2007US7282767 Guardwall structures for ESD protection
10/16/2007US7282751 Semiconductor device
10/16/2007US7282696 Photoelectric converter device and manufacturing method thereof
10/16/2007US7282693 Camera module for compact electronic equipments
10/16/2007US7282458 Low K and ultra low K SiCOH dielectric films and methods to form the same
10/16/2007US7282452 Etching method, semiconductor and fabricating method for the same
10/16/2007US7282445 Multiple seed layers for interconnects
10/16/2007US7282444 Semiconductor chip and manufacturing method for the same, and semiconductor device
10/16/2007US7282437 Insulating tube, semiconductor device employing the tube, and method of manufacturing the same
10/16/2007US7282435 Method of forming contact for dual liner product
10/16/2007US7282434 Method of manufacturing a semiconductor device
10/16/2007US7282432 Semiconductor device, manufacturing method and apparatus for the same
10/16/2007US7282431 Single chip and stack-type chip semiconductor package and method of manufacturing the same
10/16/2007US7282422 Overlay key, method of manufacturing the same and method of measuring an overlay degree using the same
10/16/2007US7282419 Thin-film capacitor device, mounting module for the same, and method for fabricating the same
10/16/2007US7282405 Semiconductor memory device and method for manufacturing the same
10/16/2007US7282404 Inexpensive method of fabricating a higher performance capacitance density MIMcap integrable into a copper interconnect scheme
10/16/2007US7282399 Method for forming semiconductor device
10/16/2007US7282396 Method of manufacturing a semiconductor device including using a sealing resin to form a sealing body
10/16/2007US7282393 Microelectromechanical device packages with integral heaters
10/16/2007US7282392 Method of fabricating a stacked die in die BGA package
10/16/2007US7282391 Method for precision assembly of integrated circuit chip packages
10/16/2007US7282390 Stacked die-in-die BGA package with die having a recess
10/16/2007US7282389 Semiconductor device manufacturing method and manufacturing apparatus
10/16/2007US7282388 Method of manufacturing wafer level package type FBAR device
10/16/2007US7282377 Method for identifying semiconductor integrated circuit device, method for manufacturing semiconductor integrated circuit device, semiconductor integrated circuit device and semiconductor chip
10/16/2007US7282265 impregnating a porous graphitized extrudate with a molten metal and then heat-treating the resultant composite material; good dimensional stability when heated; same level as those of silicon and compound semiconductors
10/16/2007US7281866 Shunt voltage regulator and method of using
10/11/2007WO2007114983A2 Method of making a multiple crystal orientation semiconductor device
10/11/2007WO2007114790A1 Method of fabricating an interconnection for electrically connecting an electrical component to a substrate
10/11/2007WO2007114497A1 Working liquid for latent heat transport apparatus and method of operating latent heat transport apparatus
10/11/2007WO2007114392A1 Wiring board and mounting structure
10/11/2007WO2007114384A1 Signal transmitter
10/11/2007WO2007114106A1 Semiconductor device, layered type semiconductor device using the same, base substrate, and semiconductor device manufacturing method
10/11/2007WO2007113182A1 Method for applying solder particles to contact surfaces as well as solder particles suitable for this and components with contact surfaces
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