Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2007
10/18/2007DE19648309B4 Stark reflektierende Kontakte für Licht-emittierende Halbleiterbauelemente Highly reflective contacts for light-emitting semiconductor devices
10/18/2007DE10310329B4 Verfahren zur Herstellung einer integrierten Schaltungsvorrichtung, nach dem Verfahren hergestellte integrierte Schaltungsvorrichtung und Sicherungsbox A process for producing an integrated circuit device, integrated circuit device produced by the method and fuse
10/18/2007DE10301432B4 Zwischenverbindungsstruktur in einer Waferebenenpackung und Herstellungsverfahren Interconnect structure in a wafer level package and manufacturing method
10/18/2007DE102006017695A1 Verfahren zur Herstellung von Kohlenstoffnanoröhrchen in einer Wirbelschicht A process for producing carbon nanotubes in a fluidized bed
10/18/2007DE102006017668A1 Verfahren zur Herstellung von Leistungshalbleiterbauteilen und Verwendung von Farbstoffen A process for the production of power semiconductor components and use of dyes
10/18/2007DE102006017115A1 Halbleiterbauteil mit einem Kunststoffgehäuse und Verfahren zu seiner Herstellung A semiconductor device comprising a plastic housing and method for its preparation
10/18/2007DE102006017101A1 Rigid-flexible printed circuit board for electrical device, has sliding bow fastened to contact of multi-contact components e.g. unpackaged power semiconductor, with conductive adhesive that is applied by dosing machine
10/18/2007DE102006017059A1 Halbleiter-Bauelement-System, sowie Verfahren zum Modifizieren eines Halbleiterbauelements Semiconductor component system, as well as methods for modifying a semiconductor device
10/18/2007DE102006016529A1 Semiconductor radiation source of high power output density for hardening adhesives, coatings/sealing compounds, comprises a carrier cooled by a flow of coolant, and temperature sensors contacted with a cooling medium
10/18/2007DE102006016419A1 Chipkartenmodul und Verfahren zum Schützen eines Chipkartenmoduls vor Überspannungen Chip card module and method for protecting a smart card module from overvoltages
10/18/2007DE102006016345A1 Halbleitermodul mit diskreten Bauelementen und Verfahren zur Herstellung desselben Of the same semiconductor module having discrete components and methods for making
10/18/2007DE102006016260A1 Mikromechanische Gehäusung mit mindestens zwei Kavitäten mit unterschiedlichem Innendruck und/oder unterschiedlicher Gaszusammensetzung sowie Verfahren zu deren Herstellung Micromechanical Gehäusung with at least two cavities having different internal pressures and / or different gas composition, as well as processes for their preparation
10/18/2007DE102006000622B4 Miniaturisiertes Multi-Chip Modul und Verfahren zur Herstellung desselben A miniaturized multi-chip module and method of manufacturing the same
10/18/2007DE102005006333B4 Halbleiterbauteil mit mehreren Bondanschlüssen und gebondeten Kontaktelementen unterschiedlicher Metallzusammensetzung und Verfahren zur Herstellung desselben Of the same semiconductor device having a plurality of bonding pads and bonded contact elements of different metal composition and methods for preparing
10/18/2007DE102004062885B4 Anordnung mit einer elektronischen Leiterplatte und mindestens einem Halbleiterbaustein und Verfahren Arrangement with an electronic circuit board and at least one semiconductor device and method
10/18/2007DE102004057485B4 Leistungshalbleiterbauelement und Verfahren zu dessen Herstellung Power semiconductor device and process for its preparation
10/18/2007DE102004035368B4 Substrat mit Leiterbahnen und Herstellung der Leiterbahnen auf Substraten für Halbleiterbauteile Substrate with conductor tracks and manufacture of the conductor tracks on substrates for semiconductor devices
10/18/2007DE102004022139B4 Verfahren zur Herstellung einer Spiralinduktivität auf einem Substrat und nach einem derartigen Verfahren hergestelltes Bauelement A method of manufacturing a spiral inductor on a substrate and produced by such a process component
10/18/2007DE102004007398B4 Konfigurierbare Gate-Array-Zelle mit erweiterter Gate-Elektrode Configurable gate array cell having an extended gate electrode
10/17/2007EP1845759A1 Conductive connecting pin and package substrate
10/17/2007EP1845558A1 Semiconductor device
10/17/2007EP1845261A2 Bearing for refrigerating compressor and refrigerating compressor
10/17/2007EP1845133A1 Silicone composition for encapsulating luminescent element and luminescent device
10/17/2007EP1845130A2 Hydrophobic crosslinkable compositions for electronic applications
10/17/2007EP1845119A1 Resin compositions, cured article obtained therefrom, and sheet
10/17/2007EP1844497A1 Semiconductor switching module
10/17/2007EP1844089A1 Amide-substituted silicones and methods for their preparation and use
10/17/2007EP1502300B1 Circuit comprising a capacitor and at least one semiconductor component, and method for designing same
10/17/2007EP1502299B1 Contacting of nanotubes
10/17/2007EP1421625B1 Method for making a colour image sensor with support substrate welded connection-on-connection
10/17/2007EP1381650B1 Addition-curable silicone gel composition
10/17/2007EP1147557B1 Integrated circuit device, electronic module for chip card using said device and method for making same
10/17/2007EP1114460B1 Semiconductor chip with surface coating
10/17/2007EP1059019A4 Components with releasable leads
10/17/2007EP1009202B1 Soldering member for printed wiring boards
10/17/2007EP0920542B1 Chemical vapor deposition of fluorocarbon polymer thin films
10/17/2007CN200962709Y Panel heat conduction type heat radiation module structure
10/17/2007CN200962704Y A heat radiation device of the thermal pipe
10/17/2007CN200962567Y Mitsubishi series commutation bridge
10/17/2007CN200962565Y A heat sink and heat radiating part
10/17/2007CN200962492Y A removable nude crystal module
10/17/2007CN200962491Y A removable nude crystal module
10/17/2007CN200962433Y Heat radiation structure of LED
10/17/2007CN200962427Y Hetero-diameter fork semiconductor part
10/17/2007CN200962426Y Circle tray semiconductor part
10/17/2007CN200962425Y Overlapping fork semiconductor part
10/17/2007CN200962424Y Cathode fork semiconductor part
10/17/2007CN200962423Y Dual LED indicator lamp
10/17/2007CN200962422Y A LED welding tray
10/17/2007CN200962421Y A metal-insulator-metal RF test structure
10/17/2007CN200962420Y Positioning device of the radiator
10/17/2007CN200962419Y A diode aluminum base board
10/17/2007CN200962418Y Led
10/17/2007CN200962417Y Encapsulation cover board and chip encapsulation structure
10/17/2007CN200961840Y Luminous diode heat-irradiation device
10/17/2007CN101057326A 半导体器件 Semiconductor devices
10/17/2007CN101057325A Lead free alloys for column/ball grid arrays, organic interposers and passive component assembly
10/17/2007CN101057324A Semiconductor device and method for manufacturing semiconductor device
10/17/2007CN101057124A Combined RF tag and saw sensor
10/17/2007CN101057114A Transient thermoelectric cooling of optoelectronic devices
10/17/2007CN101057003A Metal-based carbon fiber composite material and producing method thereof
10/17/2007CN101056900A Optical semiconductor sealing material
10/17/2007CN101056527A Heat radiator
10/17/2007CN101056525A Heat radiator
10/17/2007CN101056524A Heat radiator
10/17/2007CN101056522A Radiator and liquid-cooled heat radiator applying the same
10/17/2007CN101056521A Heat radiator of electronic device
10/17/2007CN101056520A Cooler of electronic device
10/17/2007CN101056499A Organic encapsulant compositions for protection of electronic components
10/17/2007CN101055972A Encapsulation element
10/17/2007CN101055912A Light emitting device and method for producing light emitting device
10/17/2007CN101055890A Organic electroluminescence display device
10/17/2007CN101055886A Light emitting device and method for manufacturing the same
10/17/2007CN101055883A Image sensor and its making method
10/17/2007CN101055878A Thin film transistor base board and the method for reducing the interference between the metal leads
10/17/2007CN101055876A Semiconductor device having non-volatile memory and method of fabricating the same
10/17/2007CN101055875A Nonvolatile semiconductor memory device and manufacturing method thereof
10/17/2007CN101055871A Semiconductor storage device
10/17/2007CN101055870A Wafer for realizing the chip pin compatibility and method
10/17/2007CN101055869A 电感器结构 Inductor structure
10/17/2007CN101055868A Memory module, its producing method and data processing device
10/17/2007CN101055867A Semiconductor device and method for fabricating the same
10/17/2007CN101055866A Module for optical device and manufacturing method thereof
10/17/2007CN101055865A Storage card structure and its making method
10/17/2007CN101055863A 线路板与电路结构 Circuit board and the circuit configuration
10/17/2007CN101055862A Wiring board, semiconductor device using the same, and method for manufacturing wiring board
10/17/2007CN101055861A Strip format of package board and array of the same
10/17/2007CN101055860A Lead frame encapsulation structure with the high-density pin array
10/17/2007CN101055859A Catheter core mounting composition for semiconductor component, method of component mounting and semiconductor device
10/17/2007CN101055858A Semiconductor encapsulation structure
10/17/2007CN101055857A Semiconductor apparatus and method of producing the same
10/17/2007CN101055856A Connecting device for electronic component
10/17/2007CN101055855A Combined heat dispersion device for the industrial control machine high-power consumption CPU
10/17/2007CN101055854A Making method of the pixel structure and pixel structure
10/17/2007CN101055853A Non-volatile semiconductor memory device and its making method
10/17/2007CN101055845A Coated thermal interface in integrated circuit chip
10/17/2007CN101055844A Wafer construction structure with the inductance and its construction method
10/17/2007CN101055834A Method for positioning nanoparticle on substrate and nanoparticle array
10/17/2007CN101055128A 压缩机技术信息装置 Compressor technology information system
10/17/2007CN101055110A Heat exchanger and indoor thermoelectric air conditioner possessing same
1 ... 1014 1015 1016 1017 1018 1019 1020 1021 1022 1023 1024 1025 1026 1027 1028 1029 1030 1031 1032 1033 1034 ... 2262