Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2007
10/23/2007CA2291191C Eutectic bonding of single crystal components
10/18/2007WO2007117931A2 Controlling flip-chip techniques for concurrent ball bonds in semiconductor devices
10/18/2007WO2007117844A2 Semiconductor die packages using thin dies and metal substrates
10/18/2007WO2007117307A2 Trench field plate termination for power devices
10/18/2007WO2007117000A1 Semiconductor laser module for excitation
10/18/2007WO2007116979A1 Resin composition for encapsulating filler, method of flip chip mounting with the same, and product of flip chip mounting
10/18/2007WO2007116905A1 Electronic component union, electronic circuit module utilizing the same, and process for manufacturing the same
10/18/2007WO2007116894A1 Cooling device
10/18/2007WO2007116758A1 Semiconductor device and method for manufacturing semiconductor device
10/18/2007WO2007116625A1 Hardening resin composition
10/18/2007WO2007116544A1 Composite substrate and method of manufacturing composite substrate
10/18/2007WO2007116501A1 Semiconductor device and its manufacturing method
10/18/2007WO2007116463A1 Semiconductor device
10/18/2007WO2007116461A1 Cooler
10/18/2007WO2007116345A2 Inter-layer connection for foil mems technology
10/18/2007WO2007116344A1 Elastically deformable integrated-circuit device
10/18/2007WO2007116172A1 Stand, in particular for power electronic component, power module comprising such a stand, assembly comprising the module and electrical member controlled by said module
10/18/2007WO2007115915A1 Component with a semiconductor substrate, and method for manufacturing it
10/18/2007WO2007115371A1 Method, apparatus and resulting structures in the manufacture of semiconductors
10/18/2007WO2007095381A3 A sip module with a single sided lid
10/18/2007WO2007083244A3 Package for a light emitting diode with integrated electrostatic discharge protection
10/18/2007WO2007072379A3 An electronic device, a housing part, and a method of manufacturing a housing part
10/18/2007WO2007046031A3 Device comprising an element with electrodes coupled to connections
10/18/2007WO2007045520A3 Ic component comprising a cooling arrangement
10/18/2007WO2007017803A3 Ldmos transistor
10/18/2007WO2006116249A3 Device packages having a iii-nitride based power semiconductor device
10/18/2007WO2002003422A3 Integrated circuits packaging system and method
10/18/2007US20070245276 System, method and computer program product for designing connecting terminals of semiconductor device
10/18/2007US20070245056 Processor Component
10/18/2007US20070244593 Test circuit, semiconductor product wafer having the test circuit, and method of monitoring manufacturing process using the test circuit
10/18/2007US20070244380 Analyte monitoring device and methods of use
10/18/2007US20070243715 Cleaning solution and method for selectively removing layer in a silicidation process
10/18/2007US20070243706 Method of manufacturing a through electrode
10/18/2007US20070243675 Use of silicon block process step to camouflage a false transistor
10/18/2007US20070243665 Palladium-Spot Leadframes for High Adhesion Semiconductor Devices and Method of Fabrication
10/18/2007US20070243643 Circular Test Pads on Scribe Street Area
10/18/2007US20070243464 Nanotube Position Controlling Method, Nanotube Position Controlling Flow Path Pattern and Electronic Element Using Nanotube
10/18/2007US20070243459 Method and apparatus for thin-film battery having ultra-thin electrolyte
10/18/2007US20070243409 Process for Producing Ceramic Sheet, Ceramic Substrate Utilizing The Same and Use Thereof
10/18/2007US20070243407 Machinable Metallic Composites
10/18/2007US20070243405 Electronic device with lead-free metal thin film formed on the surface thereof
10/18/2007US20070243057 Bolt and semiconductor manufacturing apparatus
10/18/2007US20070242548 Programmable Semiconductor Device
10/18/2007US20070242535 Semiconductor memory device and defect remedying method thereof
10/18/2007US20070242438 Low-Profile Thermosyphon-Based Cooling System for Computers and Other Electronic Devices
10/18/2007US20070242435 Electrical apparatus, cooling system therefor, and electric vehicle
10/18/2007US20070242427 Drive Circuit for Piezoelectric Pump and Cooling System That Uses This Drive Circuit
10/18/2007US20070241998 Electroluminescent Display Devices
10/18/2007US20070241790 Semiconductor integrated circuit
10/18/2007US20070241779 Semiconductor integrated circuit
10/18/2007US20070241466 Chip package
10/18/2007US20070241465 Multi-port memory device having serial input/output interface
10/18/2007US20070241464 Solder joint flip chip interconnection having relief structure
10/18/2007US20070241463 Electrode, manufacturing method of the same, and semiconductor device having the same
10/18/2007US20070241462 Wiring board, semiconductor device using the same, and method for manufacturing wiring board
10/18/2007US20070241461 Programmable system in package
10/18/2007US20070241460 Conductive Structures Including Titanium-Tungsten Base Layers
10/18/2007US20070241459 Devices having a cavity structure and related methods
10/18/2007US20070241458 Metal / metal nitride barrier layer for semiconductor device applications
10/18/2007US20070241457 Semiconductor apparatus and method of producing the same
10/18/2007US20070241456 Conductive structure for electronic device
10/18/2007US20070241455 Method for forming dual damascenes with supercritical fluid treatments
10/18/2007US20070241454 Capture ring
10/18/2007US20070241453 Stacked integrated circuit package-in-package system
10/18/2007US20070241452 Electronic device with a movable mechanism
10/18/2007US20070241451 Electronic component device
10/18/2007US20070241450 Semiconductor device
10/18/2007US20070241449 Apparatus for Effecting Reliable Heat Transfer of Bare Die Microelectroinc Device and Method Thereof
10/18/2007US20070241448 Electrically-isolated interconnects and seal rings in packages using a solder preform
10/18/2007US20070241447 Electronic component package
10/18/2007US20070241446 Two-sided wafer escape package
10/18/2007US20070241445 Semiconductor Device, Substrate for Producing Semiconductor Device and Method of Producing Them
10/18/2007US20070241444 Carrier board structure with chip embedded therein and method for fabricating the same
10/18/2007US20070241443 Isolating electric paths in semiconductor device packages
10/18/2007US20070241442 Stacked integrated circuit package-in-package system
10/18/2007US20070241441 Multichip package system
10/18/2007US20070241440 Overmolded semiconductor package with a wirebond cage for EMI shielding
10/18/2007US20070241439 RFID package structure
10/18/2007US20070241438 Strip format of package board and array of the same
10/18/2007US20070241437 Stacked semiconductor device and fabrication method for same
10/18/2007US20070241435 Optical display package and the method thereof
10/18/2007US20070241434 Adhesive Sheet, Semiconductor Device, and Process for Producing Semiconductor Device
10/18/2007US20070241433 Semiconductor device package with base features to reduce leakage
10/18/2007US20070241432 Etched leadframe flipchip package system
10/18/2007US20070241431 Alternative flip chip in leaded molded package design and method for manufacture
10/18/2007US20070241430 Heating unit and method of making the same
10/18/2007US20070241429 Electrically conducting track and method of manufacture thereof
10/18/2007US20070241407 Electrostatic discharge protection device and method of fabricating the same
10/18/2007US20070241406 Electrostatic discharge protector for an integrated circuit
10/18/2007US20070241391 Non-volatile semiconductor memory device having memory cell array suitable for high density and high integration
10/18/2007US20070241345 Semiconductor light-emitting device and method of fabricating the same
10/18/2007US20070241330 Semiconductor integrated circuit device and manufacture thereof
10/18/2007US20070241329 Semiconductor integrated circuit and method for manufacturing same, and mask
10/18/2007US20070241328 Process for producing power semiconductor components using a marker
10/18/2007US20070241307 Thermal interface materials
10/18/2007US20070241202 Wafer identification mark
10/18/2007US20070240869 Electronic apparatus and cooling component
10/18/2007US20070240867 Liquid-Cooling Type Cooling Plate
10/18/2007US20070240306 Post and tip design for a probe contact
10/18/2007DE4234700B4 Gehäuste Halbleiteranordnung Packaged semiconductor device
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