Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2007
10/24/2007CN101060105A 电子器件散热器 Electronics radiator
10/24/2007CN101060104A Embedded semiconductor chip carrying plate structure and its manufacture method
10/24/2007CN101060103A Semiconductor device
10/24/2007CN101060102A Nitride semiconductor substrate, method of making the same and epitaxial substrate for nitride semiconductor light emitting device
10/24/2007CN101060101A Semiconductor encapsulation structure
10/24/2007CN101060091A Method and system for providing conductive bonding material
10/24/2007CN101060088A Semiconductor package structure and its making method
10/24/2007CN101060087A Electrode, manufacturing method of the same, and semiconductor device having the same
10/24/2007CN101059324A Method for improving contact thermal resistance between large power heat pipe radiator and heating element
10/24/2007CN101059323A Plate type integral structure heat-irradiation method and device suitable for large power high efficiency heat pipe heat-radiator
10/24/2007CN101059237A LED lamp self-heat irradiation device
10/24/2007CN101058709A Epoxy resin molding material for sealing use and semiconductor device
10/24/2007CN100345473C Cooling system and method for cooling multiple electronics subsystems
10/24/2007CN100345472C Thermal-interface material and production thereof
10/24/2007CN100345466C Multilayer substrate including components therein
10/24/2007CN100345373C Multilayer ceramic frequency selective circuit
10/24/2007CN100345318C Enhanced interface thermoelectric coolers
10/24/2007CN100345296C Multichip semiconductor package with chip carrier having down stretched pin
10/24/2007CN100345295C 半导体封装构造 Semiconductor package
10/24/2007CN100345294C Fuse circuit
10/24/2007CN100345293C Semiconductor device and method for fabricating the same
10/24/2007CN100345292C Chip pressing structure and its shaping method and electronic installation
10/24/2007CN100345291C Semiconductor device and electronic device, and methods for manufacturing thereof
10/24/2007CN100345290C Semiconductor apparatus
10/24/2007CN100345289C Hot-piping radiator
10/24/2007CN100345288C Radiating fin and fin assembly
10/24/2007CN100345287C Heat radiation module
10/24/2007CN100345286C 半导体装置 Semiconductor device
10/24/2007CN100345285C High-frequency device
10/24/2007CN100345279C Component built-in module and method of manufacturing the same
10/24/2007CN100345275C Interconnection method of forming through lining
10/24/2007CN100345268C 半导体装置 Semiconductor device
10/24/2007CN100345267C Integrated circuit chip encapsulation and encapsulation method therefor
10/24/2007CN100345228C Capacitor having improved electrodes
10/24/2007CN100345084C Heat dissipation device
10/23/2007US7287115 Multi-chip package type memory system
10/23/2007US7286386 Semiconductor device
10/23/2007US7286367 Printed circuit board with a built-in passive device, manufacturing method of the printed circuit board, and elemental board for the printed circuit board
10/23/2007US7286362 Heat dissipating apparatus
10/23/2007US7286361 Heatsink
10/23/2007US7286360 Heat radiating system and method for a mobile communication terminal
10/23/2007US7286359 Use of thermally conductive vias to extract heat from microelectronic chips and method of manufacturing
10/23/2007US7286350 Length-adjustable fan duct device
10/23/2007US7286346 Peripheral device and electronic device
10/23/2007US7286202 Image display and manufacturing method thereof having particular internal wiring structure
10/23/2007US7285867 Wiring structure on semiconductor substrate and method of fabricating the same
10/23/2007US7285866 Surface mounted package with die bottom spaced from support board
10/23/2007US7285865 Micro-package, multi-stack micro-package, and manufacturing method therefor
10/23/2007US7285864 Stack MCP
10/23/2007US7285863 Pad structures including insulating layers having a tapered surface
10/23/2007US7285862 Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film
10/23/2007US7285860 Method and structure for defect monitoring of semiconductor devices using power bus wiring grids
10/23/2007US7285859 Semiconductor device
10/23/2007US7285858 Semiconductor device and its manufacture method capable of preventing short circuit of electrodes when semiconductor device is mounted on sub-mount substrate
10/23/2007US7285856 Package for semiconductor devices
10/23/2007US7285855 Packaged device and method of forming same
10/23/2007US7285854 Wire bonding method and semiconductor device
10/23/2007US7285853 Multilayer anti-reflective coating for semiconductor lithography and the method for forming the same
10/23/2007US7285852 Semiconductor device capsule
10/23/2007US7285851 Liquid immersion cooled multichip module
10/23/2007US7285850 Support elements for semiconductor devices with peripherally located bond pads
10/23/2007US7285849 Semiconductor die package using leadframe and clip and method of manufacturing
10/23/2007US7285848 Carrier for stacked type semiconductor device and method of fabricating the same
10/23/2007US7285847 Chip stack package, connecting board, and method of connecting chips
10/23/2007US7285846 Integrated circuit package with ESD protection
10/23/2007US7285845 Lead frame for semiconductor package
10/23/2007US7285844 Multiple internal seal right micro-electro-mechanical system vacuum package
10/23/2007US7285843 Electromagnetic wave shielding sheet
10/23/2007US7285842 Siloxane epoxy polymers as metal diffusion barriers to reduce electromigration
10/23/2007US7285837 Electrostatic discharge device integrated with pad
10/23/2007US7285828 Electrostatic discharge protection device for digital circuits and for applications with input/output bipolar voltage much higher than the core circuit power supply
10/23/2007US7285827 Back-to-back NPN/PNP protection diodes
10/23/2007US7285803 Light-emitting diode lamp having a terminal portion with a notch portion
10/23/2007US7285734 Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same
10/23/2007US7285731 EMI gasket
10/23/2007US7285730 Ceramic circuit board and method for manufacturing the same
10/23/2007US7285728 Electronic parts packaging structure and method of manufacturing the same
10/23/2007US7285602 Granular epoxy resin, production method thereof, and granular epoxy resin package
10/23/2007US7285502 Forming a layer of organic polymer on a semiconductor device structure; polymerizing the organic polymer to form solid matrix; forming voids in the organic polymer, includin gembedding microcapsule, exposing the semiconductor device structure to a catalyst to substantially remove the filler
10/23/2007US7285490 Method for the producing an integrated circuit bar arrangement, in particular comprising a capacitor assembly, in addition to an integrated circuit arrangement
10/23/2007US7285489 Dual damascene process for forming a multi-layer low-k dielectric interconnect
10/23/2007US7285488 Method of fabricating strained channel field effect transistor pair having underlapped dual liners
10/23/2007US7285478 Method for micro-electromechanical system package
10/23/2007US7285448 Power delivery using an integrated heat spreader
10/23/2007US7285446 Mounting structure of semiconductor chip, semiconductor device and method of making the semiconductor device
10/23/2007US7285445 Direct cooling of LEDs
10/23/2007US7285444 Method of manufacturing semiconductor device
10/23/2007US7285443 Stacked semiconductor module
10/23/2007US7285442 Stackable ceramic FBGA for high thermal applications
10/23/2007US7285439 Method for manufacturing semiconductor device having shielding case, electronic equipment using the semiconductor device, and shielding case attaching method
10/23/2007US7285429 Mounting device for high frequency microwave devices
10/23/2007US7285321 Vaiations in glass transition temperature between layers; electroconductive layer
10/23/2007US7285305 Producing the board having an interlayer insulation film between the wiring layers that is deposited using a liquid drop discharge system and an interlayer conducting post for conducting between the wiring patterns the interlayer insulation film
10/23/2007US7284976 Moulding assembly for forming at least one protective cap
10/23/2007US7284916 Dual stage modular optical devices with insert digital diagnostics component
10/23/2007US7284600 Process of making a lightweight thermal heat transfer apparatus
10/23/2007US7284596 Heatsink assembly and method of manufacturing the same
10/23/2007US7284324 Method of making photolithographically-patterned out-of-plane coil structures
10/23/2007US7284317 Method of producing printed circuit board with embedded resistor
10/23/2007US7284311 Multilayer wiring board, manufacturing method therefor and test apparatus thereof
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