Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2007
10/25/2007US20070246790 Transistor process using a double-epitaxial layer for reduced capacitance
10/25/2007US20070246778 Electrostatic discharge panel protection structure
10/25/2007US20070246772 MOSFET power package
10/25/2007US20070246731 Semiconductor device using semiconductor chip
10/25/2007US20070246725 Semiconductor display device
10/25/2007US20070246447 Method for laser annealing to form an epitaxial growth layer
10/25/2007US20070246208 Heat release sheet and heat sink
10/25/2007US20070246133 Method for Electroplating and Contact Projection Arrangement
10/25/2007US20070245554 Fabrication Method For Electronic System Modules
10/25/2007DE60123178T2 Halbleiterbauelement Semiconductor device
10/25/2007DE112005003099T5 Träger für elektrische Bauteile mit angelötetem Kühlkörper Support for electrical components with soldered heat sink
10/25/2007DE10345186B4 Verfahren zur Herstellung eines Metall-Oxid-Halbleiter Feldeffekttransistors und Metall-Oxid-Halbleiter Feldeffekttransistor A method for producing a metal-oxide-semiconductor field-effect transistor and metal oxide semiconductor field effect transistor
10/25/2007DE10241344B4 Waferebenengehäuse mit Siliziumdichtung Wafer-level housing with silicon seal
10/25/2007DE102007015293A1 Wärmeabstrahlkörper Heat radiating
10/25/2007DE102007015292A1 Verfahren zur Herstellung eines Metall/Keramik-Verbindungssubstrats A method for producing a metal / ceramic bonding substrate
10/25/2007DE102007015115A1 Lötschicht und Substrat bzw. Submount zum Kontaktieren von elektronischen Bauelementen unter Verwendung derselben Solder layer and substrate or submount for contacting electronic components using the same
10/25/2007DE102007013737A1 Direkte Stromabgabe in eine elektronische Baugruppe Direct current output into an electronic module
10/25/2007DE102006020503A1 Arrangement for heat exchanger elements, has Peltier element having warmth receiver and warmth delivering side, where multiple elements are connected with one another by connecting element, and substrate plates lie in common level
10/25/2007DE102006020502A1 Heat exchanger unit arrangement, has substrate plate forming cover of channel, where flowing fluid in guiding channel running parallel to substrate plate is guided by substrate plate
10/25/2007DE102006019244A1 Nutzen und Halbleiterbauteil aus einer Verbundplatte mit Halbleiterchips und Kunststoffgehäusemasse sowie Verfahren zur Herstellung desselben The same benefits and semiconductor component of a composite plate with semiconductor chips and plastic housing composition and methods of making
10/25/2007DE102006018874A1 Schaltungsanordnung zur Koppelung einer Spannungsversorgung an ein Halbleiterbauelement, Verfahren zur Herstellung der Schaltungsanordnung sowie Datenverarbeitungsgerät umfassend die Schaltungsanordnung Circuit arrangement for coupling a voltage supply to a semiconductor device, method for manufacturing the circuit arrangement as well as data processing apparatus comprising the circuit arrangement
10/25/2007DE102006018765A1 Leistungshalbleiterbauelement, Leistungshalbleiterbauteil sowie Verfahren zu deren Herstellung Power semiconductor device, power semiconductor device and process for their preparation
10/25/2007DE102006018716A1 Anordnung zur Kontaktierung von Leistungshalbleitern an einer Kühlfläche Arrangement for contacting power semiconductors on a cooling surface
10/25/2007DE102006018491A1 Flexible plasmapolymere Produkte, entsprechende Artikel, Herstellverfahren und Verwendung Flexible plasma polymer products, corresponding products, manufacturing processes and use
10/25/2007DE102006018161A1 Elektronisches Bauelementmodul Electronic component module
10/25/2007DE102004026100B4 ESD-Schutzstrukturen für Halbleiterbauelemente ESD protection structures for semiconductor devices
10/25/2007CA2649039A1 Transfer tape strap process
10/24/2007EP1848036A2 Power module
10/24/2007EP1848035A1 Semiconductor device with integrated heat spreader
10/24/2007EP1848034A2 Electronic component device
10/24/2007EP1848030A2 Method of manufacturing semiconductor apparatus
10/24/2007EP1848029A1 Carrying structure of electronic components
10/24/2007EP1846950A2 Electronic component protected against the attacks
10/24/2007EP1846949A1 Thermally and electrically conductive apparatus
10/24/2007EP1846788A1 Optical data transceivers
10/24/2007EP1846713A1 Cooler
10/24/2007EP1523229B1 Semiconductor exercising apparatus, test socket apparatus and method of making thereof
10/24/2007EP1371090A4 HYBRID LOW-k INTERCONNECT STRUCTURE COMPRISED OF 2 SPIN-ON DIELECTRIC MATERIALS
10/24/2007EP1355745A4 Bond enhancement antitarnish coatings
10/24/2007EP0978542B1 Semiconductor sealing resin composition, semiconductor device sealed with the same, and process for preparing semiconductor device
10/24/2007EP0795200B1 Mounting electronic components to a circuit board
10/24/2007CN200966203Y Heat radiator
10/24/2007CN200966201Y High efficient fan-free heat radiation device
10/24/2007CN200966198Y Heat radiator
10/24/2007CN200965890Y LED element and its device
10/24/2007CN200965887Y Ultrahigh brightness light-emitting diode
10/24/2007CN200965886Y LED light source package structure for low temperature co-fired ceramic with thermo separation design
10/24/2007CN200965883Y In-line plug-in type semiconductor device
10/24/2007CN200965882Y Multi-chip package LED
10/24/2007CN200965881Y Semiconductor encapsulation structure
10/24/2007CN200965880Y LED structure
10/24/2007CN200965879Y Led
10/24/2007CN200965878Y Semiconductor package welding materials
10/24/2007CN200965877Y Flash memory card package structure
10/24/2007CN200965876Y Integrated circuit package structure
10/24/2007CN200965875Y Semiconductor element
10/24/2007CN200965874Y High power IC chip cooling device
10/24/2007CN200965873Y Heating tube holder
10/24/2007CN200965872Y A heat dissipation component module for memory
10/24/2007CN200965871Y CPU heat dissipation device
10/24/2007CN200965870Y A CPU radiator
10/24/2007CN200965869Y A chip radiator
10/24/2007CN200965665Y Heat radiation module
10/24/2007CN200965664Y Heat radiator
10/24/2007CN200965437Y Heat dissipation fin plate with the junction fixing structure
10/24/2007CN200965218Y Heat irradiation structure of LED lamp
10/24/2007CN101061589A Method of making light emitting device with silicon-containing encapsulant
10/24/2007CN101061581A Analogue measurement of alignment between layers of a semiconductor device
10/24/2007CN101061580A Insulating circuit board and insulating circuit board provided with cooling sink section
10/24/2007CN101061577A Flip-chip system and method of making same
10/24/2007CN101060768A Mixed ceramic foam cold plate
10/24/2007CN101060767A Ceramic foam electronic component cooling
10/24/2007CN101060766A Thin heat radiation machine
10/24/2007CN101060765A Liquid-cooled heat radiator
10/24/2007CN101060764A Heat radiator
10/24/2007CN101060763A Heat radiator
10/24/2007CN101060762A Heat radiator
10/24/2007CN101060158A Surface mounting light emitting diode device
10/24/2007CN101060157A Light emitting diode package and fabrication method thereof
10/24/2007CN101060153A A side LED and its manufacture process
10/24/2007CN101060152A A sheet-type LED
10/24/2007CN101060141A MIM structure and method of forming same
10/24/2007CN101060127A Pixel structure and manufacture method and photoelectronic device with the pixel structure and manufacture method
10/24/2007CN101060126A Thin film transistor and pixel structure and its manufacture method
10/24/2007CN101060125A Film transistor array substrate and fabricating method thereof
10/24/2007CN101060124A A TFT LCD array base plate and manufacture method
10/24/2007CN101060123A A TFT LCD array base plate and its manufacture method
10/24/2007CN101060120A 半导体集成电路 The semiconductor integrated circuit
10/24/2007CN101060119A An integral circuit structure and its manufacture method
10/24/2007CN101060118A LED module
10/24/2007CN101060117A Chip overlap structure and wafer structure for manufacturing the chip stack structure
10/24/2007CN101060116A Led package
10/24/2007CN101060113A Chip package structure
10/24/2007CN101060112A Baseplate alignment system and its alignment method
10/24/2007CN101060111A Operation method of fuse structure
10/24/2007CN101060110A Semiconductor integrated circuit and method for manufacturing same, and mask
10/24/2007CN101060109A Butted contact structure and its forming method
10/24/2007CN101060108A Anchored damascene structures
10/24/2007CN101060107A Light-emitting crystal growth base structure
10/24/2007CN101060106A Improved ball grid array package
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