Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2007
10/30/2007US7288606 Useful for casting out optoelectronic components; acid anhydride-curable epoxy compounds, particularly bisphenol A-diglycidyl ether, contains multi-functional epoxy novolak resins, particularly an epoxy cresol novolak
10/30/2007US7288475 Sacrificial inorganic polymer intermetal dielectric damascene wire and via liner
10/30/2007US7288474 Suspension for filling via holes in silicon and method for making the same
10/30/2007US7288471 Bumping electronic components using transfer substrates
10/30/2007US7288466 Processing method, manufacturing method of semiconductor device, and processing apparatus
10/30/2007US7288460 Capacitor having an anodic metal oxide substrate
10/30/2007US7288449 Method of manufacturing an ESD protection device with the same mask for both LDD and ESD implantation
10/30/2007US7288446 Single and double-gate pseudo-FET devices for semiconductor materials evaluation
10/30/2007US7288442 Method for manufacturing contact structures of wirings
10/30/2007US7288441 Method for two-stage transfer molding device to encapsulate MMC module
10/30/2007US7288440 Method of manufacturing a semiconductor device
10/30/2007US7288439 Leadless microelectronic package and a method to maximize the die size in the package
10/30/2007US7288436 Semiconductor chip package manufacturing method including screen printing process
10/30/2007US7288434 Method for making semiconductor multi-package module having inverted second package and including additional die or package stacked on second package
10/30/2007US7288433 Method of making assemblies having stacked semiconductor chips
10/30/2007US7288432 Electronic devices with small functional elements supported on a carrier
10/30/2007US7288426 Automatically adjusting serial connections of thick and thin layers and method for the production thereof
10/30/2007US7287326 Methods of forming a contact pin assembly
10/30/2007US7287323 Materials and structure for a high reliability BGA connection between LTCC and PB boards
10/30/2007US7287320 Method for programming a routing layout design through one via layer
10/25/2007WO2007121114A2 Transfer tape strap process
10/25/2007WO2007120662A2 Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers
10/25/2007WO2007120295A2 Esd protection for passive integrated devices
10/25/2007WO2007120124A1 Method and apparatus for improving thermal energy dissipation in a direct-chip-attach coupling configuration of an integrated circuit and a circuit board
10/25/2007WO2007120078A2 Polymer anisotropic electroconductive gluing material and a gluing method
10/25/2007WO2007119783A1 Cooling apparatus and power converter
10/25/2007WO2007119608A1 Printed circuit board, packaging board, and electronic device
10/25/2007WO2007119544A1 Laptop personal computer cooling plate and laptop personal computer cooling method using same
10/25/2007WO2007119517A1 Metal oxide particle-containing polysiloxane composition and method for producing same
10/25/2007WO2007119507A1 Sheet for forming protection film for chip
10/25/2007WO2007119278A1 Semiconductor device
10/25/2007WO2007095916A3 Device for aligning and machining a wafer
10/25/2007WO2007075678A3 Microelectronic assemblies having very fine pitch stacking
10/25/2007WO2007052234A3 Surface treatments for contact pads used in semiconductor chip packages and methods of providing such surface treatments
10/25/2007WO2006132822A3 Method for making electronic devices
10/25/2007WO2006130816A3 In-chip structures and methods for removing heat from integrated circuits
10/25/2007WO2006091802A3 Norbornene-type polymers, compositions thereof and lithographic processes using such compositions
10/25/2007WO2002063680A3 Compact stacked electronic package
10/25/2007US20070249920 Analyte monitoring device and methods of use
10/25/2007US20070249919 Analyte monitoring device and methods of use
10/25/2007US20070249177 Method for Hard Mask CD Trim
10/25/2007US20070249163 Semiconductor device and method of manufacturing the same
10/25/2007US20070249162 Semiconductor device
10/25/2007US20070249161 Anisotropic conductive sheet and method of manufacturing the same
10/25/2007US20070249158 Semiconductor device and manufacturing method thereof
10/25/2007US20070249157 Semiconductor device and method for manufacturing same
10/25/2007US20070249101 Method for fabricating semiconductor package free of substrate
10/25/2007US20070249095 Semiconductor package and method of manufacturing the same
10/25/2007US20070249093 Semiconductor device and method of manufacturing the semiconductor device
10/25/2007US20070249091 Micro device encapsulation
10/25/2007US20070249067 Method for Applying Rewiring to a Panel While Compensating for Position Errors of Semiconductor Chips in Component Positions of the Panel
10/25/2007US20070248898 Targets for alignment of semiconductor masks
10/25/2007US20070247821 Surface Mounting Electronic Component and Manufacturing Method Thereof
10/25/2007US20070247534 Solid-State Imageing Device, Its Production Method, Camera with the Solid-State Imaging Device, and Light Receiving Chip
10/25/2007US20070247258 Filter Device Substrate and Filter Device
10/25/2007US20070246844 Multi-layer registration and dimensional test mark for scatterometrical measurement
10/25/2007US20070246843 Pattern registration mark designs for use in photolithography and methods of using the same
10/25/2007US20070246842 Semiconductor device, electronic apparatus and semiconductor device fabricating method
10/25/2007US20070246841 Semiconductor device
10/25/2007US20070246840 Integrated circuit devices with stacked package interposers
10/25/2007US20070246839 Method of proximity pin manufacture
10/25/2007US20070246838 Power Semiconductor Component, Power Semiconductor Device As Well As Methods For Their Production
10/25/2007US20070246837 IC chip package with minimized packaged-volume
10/25/2007US20070246836 Electric terminal device and method of connecting the same
10/25/2007US20070246835 Semiconductor device
10/25/2007US20070246834 Post passivation interconnection schemes on top of the IC chips
10/25/2007US20070246833 Semiconductor power module
10/25/2007US20070246832 Electro-resistance element and electro-resistance memory using the same
10/25/2007US20070246831 Method for manufacturing a layer arrangement and layer arrangement
10/25/2007US20070246830 Long-lifetime interconnect structure and method for making
10/25/2007US20070246829 Semiconductor device and method for producing the same
10/25/2007US20070246828 Semiconductor device and method of manufacturing the same
10/25/2007US20070246827 Semiconductor integrated circuit and method of designing semiconductor integrated circuit
10/25/2007US20070246826 Wafer level semiconductor module and method for manufacturing the same
10/25/2007US20070246825 High frequency module using metal-wall and method of manufacturing the same
10/25/2007US20070246824 Heat sink design using clad metal
10/25/2007US20070246823 Thermally enhanced BGA package with ground ring
10/25/2007US20070246822 Hard disk drive preamp heat dissipation methods
10/25/2007US20070246821 Utra-thin substrate package technology
10/25/2007US20070246820 Die protection process
10/25/2007US20070246819 Semiconductor components and systems having encapsulated through wire interconnects (TWI) and wafer level methods of fabrication
10/25/2007US20070246818 Semiconductor module featuring solder balls having lower melting point than that of solder electrode terminals of electronic device containing additional metal powder component
10/25/2007US20070246817 Solder ball assembly for a semiconductor device and method of fabricating same
10/25/2007US20070246816 Semiconductor integrated circuit device and method for fabricating the same
10/25/2007US20070246815 Stackable semiconductor package
10/25/2007US20070246814 Ball Grid array package structure
10/25/2007US20070246813 Embedded integrated circuit package-on-package system
10/25/2007US20070246812 High reliability power module
10/25/2007US20070246811 Stack structure of semiconductor packages and method for fabricating the stack structure
10/25/2007US20070246810 Leadframe enhancement and method of producing a multi-row semiconductor package
10/25/2007US20070246809 Package for optical device and method of manufacturing the same
10/25/2007US20070246808 Power semiconductor module having surface-mountable flat external contacts and method for producing the same
10/25/2007US20070246807 Semiconductor device having charge accumulation layers and control gates and memory circuit system
10/25/2007US20070246806 Embedded integrated circuit package system
10/25/2007US20070246805 Multi-die inductor
10/25/2007US20070246804 Organic insulating film, manufacturing method thereof, semiconductor device using such organic insulating film and manufacturing method thereof
10/25/2007US20070246803 Semiconductor constructions, and methods of forming semiconductor constructions
10/25/2007US20070246802 Semiconductor device and methods thereof
10/25/2007US20070246797 Fuse corner pad for an integrated circuit
10/25/2007US20070246791 Power Semiconductor Device
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