Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2007
10/31/2007CN200969725Y Heat radiator
10/31/2007CN200969717Y Fixer for heat radiator
10/31/2007CN200969357Y Luminous diode component
10/31/2007CN200969349Y Luminous diode structure
10/31/2007CN200969348Y Package structure for luminous diode chip
10/31/2007CN200969346Y Wind-collecting ring type radiator
10/31/2007CN200968795Y 热管散热器 Heat pipe radiator
10/31/2007CN101066004A Method for producing substrate having through hole filled with conductive material
10/31/2007CN101066001A Wiring board, method for manufacturing same and semiconductor device
10/31/2007CN101065843A Method for manufacturing an electronics module
10/31/2007CN101065842A Electronic component and its manufacturing method
10/31/2007CN101065836A Film forming method, semiconductor device manufacturing method, semiconductor device, program and recording medium
10/31/2007CN101065415A Curable diamantane compound
10/31/2007CN101065001A Heat radiating device
10/31/2007CN101064991A High heat dissipating efficiency diamond circuit board module group structure
10/31/2007CN101064990A Impedance matched photodetector module
10/31/2007CN101064485A Electric circuit device, electric circuit module, and power converter
10/31/2007CN101064340A Display device and manufacturing method of the same
10/31/2007CN101064337A Light emitting device
10/31/2007CN101064334A Display device module
10/31/2007CN101064331A Phase change memory fabricated using self-aligned processing
10/31/2007CN101064329A Optical apparatus and optical module using the same
10/31/2007CN101064325A CMOS image sensor pixels
10/31/2007CN101064324A Cmos图像传感器 Cmos image sensor
10/31/2007CN101064318A Thin film transistor array panel for display and manufacturing method of the same
10/31/2007CN101064311A Semiconductor memory device
10/31/2007CN101064306A Semiconductor integrated circuit and system lsi including the same
10/31/2007CN101064305A Semiconductor device and method for manufacturing the same
10/31/2007CN101064304A Semiconductor device and method for manufacturing the same
10/31/2007CN101064303A Semiconductor component and its making method
10/31/2007CN101064302A Semiconductor device and semiconductor device layout designing method
10/31/2007CN101064300A Mosfet power package
10/31/2007CN101064299A Power semiconductor module in pressure contact layout
10/31/2007CN101064298A Tungstein plug as fuse for ic device
10/31/2007CN101064297A Memory cell array and memory cell
10/31/2007CN101064296A Semiconductor devices and fabrication method thereof
10/31/2007CN101064295A Semiconductor device and its making method
10/31/2007CN101064294A Circuit device and method for manufacturing circuit device
10/31/2007CN101064293A Package for optical device and method of manufacturing the same
10/31/2007CN101064292A Optical display packaging structure and its method
10/31/2007CN101064291A Semiconductor chip package and its packaging method
10/31/2007CN101064290A Semiconductor chip having minuteness space projection and its projection
10/31/2007CN101064289A Power inverter
10/31/2007CN101064288A Leadless integrated circuit protection device
10/31/2007CN101064277A Display device module and method for manufacturing the same
10/31/2007CN101064273A Wiring substrate, display device and manufacturing method thereof
10/31/2007CN101064270A Manufacturing method of semiconductor device
10/31/2007CN101064261A Semiconductor package and its array arranged substrate structure and production method
10/31/2007CN101064259A Semiconductor package and its chip bearing structure and production method
10/31/2007CN101064241A Method of forming selectively a catalyst for nanoscale conductive structure and method of forming the nanoscale conductive structure
10/31/2007CN101063888A Automatic control device for core and ambient temperature detection and the method thereof
10/31/2007CN100346678C Enhancement of current-carrying capacity of a multilayer circuit board
10/31/2007CN100346495C Encapsulated display device
10/31/2007CN100346476C Semiconductor device and mixed integrated circuit device
10/31/2007CN100346475C Flat plate heat transferring apparatus and manufacturing method thereof
10/31/2007CN100346474C Power module and its connecting method
10/31/2007CN100346473C Millimeter band module with built-in semiconductor
10/31/2007CN100346467C Circuit rewiring method and circuit structure
10/31/2007CN100346466C Semiconductor device and method of fabricating the same
10/31/2007CN100346460C Method for forming crystal grain packaging protective layer
10/31/2007CN100346458C Apparatus for separating cull of semiconductor package molding system
10/31/2007CN100346452C Electronic components and their manufacture
10/31/2007CN100346218C Thin film transistor array panel and producing method thereof
10/31/2007CN100346217C Reflection type liquid crystal display device and method of manufacturing the same
10/31/2007CN100346204C Electro-optical device and electronic apparatus
10/31/2007CN100346168C Magnetic sensor producing method and lead wire frame
10/31/2007CN100346004C Method and apparatus for controlling deposition on predetermined portions of a workpiece
10/31/2007CN100345931C Dry thermal interface material
10/30/2007US7289785 Method and systems for providing information to a home system regarding a wireless unit roaming in a visited system
10/30/2007US7289332 Mirror image electrical packages and system for using same
10/30/2007US7289326 Direct contact cooling liquid embedded package for a central processor unit
10/30/2007US7289325 Power converter cooling
10/30/2007US7289213 Apparatus and methods for detecting overlay errors using scatterometry
10/30/2007US7288954 Compliant contact pin test assembly and methods thereof
10/30/2007US7288953 Method for testing using a universal wafer carrier for wafer level die burn-in
10/30/2007US7288848 Overlay mark for measuring and correcting alignment errors
10/30/2007US7288847 Assembly including a circuit and an encapsulation frame, and method of making the same
10/30/2007US7288846 Semiconductor chip having pads with plural junctions for different assembly methods
10/30/2007US7288845 Fabrication of wire bond pads over underlying active devices, passive devices and/or dielectric layers in integrated circuits
10/30/2007US7288844 Semiconductor device, semiconductor circuit and method for producing semiconductor device
10/30/2007US7288843 Integrated circuit chip support substrate for placing in a mold, and associated method
10/30/2007US7288842 Power semiconductor module with auxiliary connection
10/30/2007US7288841 Laminated semiconductor package
10/30/2007US7288840 Structure for cooling a surface
10/30/2007US7288839 Apparatus and methods for cooling semiconductor integrated circuit package structures
10/30/2007US7288838 Circuit board for mounting a semiconductor chip and manufacturing method thereof
10/30/2007US7288837 Semiconductor device and its writing method
10/30/2007US7288835 Integrated circuit package-in-package system
10/30/2007US7288834 Semiconductor device, carrier, card reader, methods of initializing and checking authenticity
10/30/2007US7288833 Stress-free lead frame
10/30/2007US7288832 Chip-mounted film package
10/30/2007US7288831 Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof
10/30/2007US7288824 Microelectromechanical systems, and devices having thin film encapsulated mechanical structures
10/30/2007US7288820 Low voltage NMOS-based electrostatic discharge clamp
10/30/2007US7288799 Semiconductor device and fabrication method thereof
10/30/2007US7288786 Integrated circuit configuration with analysis protection and method for producing the configuration
10/30/2007US7288739 Method of forming an opening or cavity in a substrate for receiving an electronic component
10/30/2007US7288729 Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same
10/30/2007US7288728 Electronic package and packaging method
10/30/2007US7288724 Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate
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