Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2007
11/07/2007CN101068456A Radiating device
11/07/2007CN101068064A Optical device package and optical semiconductor device using the same
11/07/2007CN101068035A White light Light-emitting diode
11/07/2007CN101068025A 显示装置 Display device
11/07/2007CN101068024A Thermal isolation of phase change memory cells
11/07/2007CN101068020A Memory unit array and fabrication process
11/07/2007CN101068018A 半导体装置 Semiconductor device
11/07/2007CN101068015A Devices and methods for constructing electrically programmable integrated fuses for low power applications
11/07/2007CN101068014A Method for forming metal wiring, method for manufacturing active matrix substrate, and appratus
11/07/2007CN101068013A Semiconductor structure and its production method
11/07/2007CN101068012A Bump structure, method of forming bump structure, and semiconductor apparatus using the same
11/07/2007CN101068011A Semiconductor device
11/07/2007CN101068010A 半导体器件 Semiconductor devices
11/07/2007CN101068009A Power module
11/07/2007CN101068008A Cpu散热器 Cpu heatsink
11/07/2007CN101068005A Semiconductor device package leadframe formed from multiple metal layers
11/07/2007CN101067068A Light resistant primer composition, light emitting semiconductor device and method of producing the same
11/07/2007CN100348082C Method for manufacturing plate stacks, particularly coolers or cooler elements made up of plate stacks
11/07/2007CN100348077C Plasma treatment device and substrate surface treatment device
11/07/2007CN100347857C Power semiconductor device
11/07/2007CN100347855C Triggering of an ESD NMOS through the use of an n-type buried layer
11/07/2007CN100347854C Semiconductor device and method of manufacturing the same
11/07/2007CN100347853C Lead frame and its manufacturing method and semiconductor device
11/07/2007CN100347852C Heat tube device and heat-tube heat exchanger
11/07/2007CN100347851C Semiconductor device with components embedded in backside diamond layer
11/07/2007CN100347850C Heat sink having folded fin heat exchanger core
11/07/2007CN100347849C Inverter device and method of manufacturing the device thereof, and electric automobile incorporating the inverter device thereof
11/07/2007CN100347848C Combined multi-flow-direction radiator
11/07/2007CN100347847C Acceleration sensor and method of manufacturing acceleration sensor
11/07/2007CN100347842C Integrated circuit and method of measurement and preparation of measurement structure
11/07/2007CN100347841C Semiconductor wafer with process control modules
11/07/2007CN100347839C Equipment for arranging and distributing welding flux column according to array
11/07/2007CN100347837C Semiconductor substrate structure and process method thereof
11/07/2007CN100347831C Deposition method and semiconductor device
11/07/2007CN100347636C A liquid cooling device for a notebook computer
11/07/2007CN100347635C Mainboard setting method for improving computer performance and its mainboard
11/06/2007US7292455 Multilayered power supply line for semiconductor integrated circuit and layout method thereof
11/06/2007US7292444 Heat sink fastener
11/06/2007US7292381 Method for conforming a micro-electronic array to arbitrary shapes
11/06/2007US7291976 Light emitting device having a particular sealing structure
11/06/2007US7291968 Active matrix electroluminescent display devices, and their manufacture
11/06/2007US7291931 Semiconductor device, semiconductor substrate and fabrication process of a semiconductor device
11/06/2007US7291930 Input and output circuit of an integrated circuit chip
11/06/2007US7291929 Semiconductor device and method of manufacturing thereof
11/06/2007US7291928 Electric power semiconductor device
11/06/2007US7291927 Dual chips stacked packaging structure
11/06/2007US7291926 Multi-chip package structure
11/06/2007US7291925 Stack package using anisotropic conductive film (ACF) and method of making same
11/06/2007US7291924 Flip chip stacked package
11/06/2007US7291923 Tapered signal lines
11/06/2007US7291922 Substrate with many via contact means disposed therein
11/06/2007US7291920 Semiconductor structures
11/06/2007US7291919 Three-dimensionally polymerized polymer, formed by polymerizing first cross-linking a three-dimensional molecule containing an adamantine ring in its backbone, and second, two-dimensional cross-linking molecules; pores formed by the polymerization of the first and second cross-linking molecules
11/06/2007US7291918 Layout structure of electrostatic discharge protection circuit
11/06/2007US7291917 Integrated circuitry
11/06/2007US7291916 Signal transmission structure and circuit substrate thereof
11/06/2007US7291915 Circuit board and method of manufacturing the same
11/06/2007US7291914 Power semiconductor module
11/06/2007US7291913 System and method for high performance heat sink for multiple chip devices
11/06/2007US7291912 Circuit board
11/06/2007US7291911 Semiconductor device and manufacturing method thereof
11/06/2007US7291910 Semiconductor chip assemblies, methods of making same and components for same
11/06/2007US7291909 BGA type semiconductor device and electronic equipment using the same
11/06/2007US7291908 Quad flat no-lead package structure and manufacturing method thereof
11/06/2007US7291907 Chip stack employing a flex circuit
11/06/2007US7291906 Stack package and fabricating method thereof
11/06/2007US7291905 Lead frame, semiconductor device produced by using the same and method of producing the semiconductor device
11/06/2007US7291904 Downsized package for electric wave device
11/06/2007US7291903 Memory card
11/06/2007US7291902 Chip component and method for producing a chip component
11/06/2007US7291901 Packaging method, packaging structure and package substrate for electronic parts
11/06/2007US7291900 Lead frame-based semiconductor device packages incorporating at least one land grid array package
11/06/2007US7291897 One mask high density capacitor for integrated circuits
11/06/2007US7291896 Voltage droop suppressing active interposer
11/06/2007US7291888 ESD protection circuit using a transistor chain
11/06/2007US7291887 Protection circuit for electrostatic discharge
11/06/2007US7291875 Semiconductor device with double barrier film
11/06/2007US7291870 Electrostatic protection circuit
11/06/2007US7291869 Electronic module with stacked semiconductors
11/06/2007US7291791 Resin substrate
11/06/2007US7291789 Copper paste and wiring board using the same
11/06/2007US7291684 Curable epoxidized phenolic resins containing biphenylene groups, an inorganic filler, a curing accelerator, a silane coupler, and and a dihydroxyaromatic compound; low viscosity for improved flowability without deterioration of curing; fireproofing; heat resistance (soldering); anticracking agents
11/06/2007US7291551 Sub-milliohm on-chip interconnection
11/06/2007US7291549 Method and structure to reduce risk of gold embrittlement in solder joints
11/06/2007US7291543 Thin flip-chip method
11/06/2007US7291542 Semiconductor wafer and manufacturing method thereof
11/06/2007US7291518 Electronic package of photo-image sensors in cellular phone camera modules, and the fabrication and assembly thereof
11/06/2007US7291235 Thermal dissipating capacitor and electrical component comprising same
11/01/2007WO2007124410A2 Thermally enhanced bga package with ground ring
11/01/2007WO2007124282A1 Silicon structures with improved resistance to radiation events
11/01/2007WO2007123778A1 Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same
11/01/2007WO2007123695A2 Nanoclays in polymer compositions, articles containing same, processes of making same, and systems containing same
11/01/2007WO2007123195A1 Jig for transferring solder bump and method for forming solder bump
11/01/2007WO2007122821A1 Semiconductor device
11/01/2007WO2007122516A2 Apparatus and method for use in mounting electronic elements
11/01/2007WO2007122263A1 Regulator with a cooling body for an electric machine
11/01/2007WO2007121737A1 Element with optical marking, method for production and use thereof
11/01/2007WO2007097891A3 Method for providing and removing discharging interconnect for chip-on-glass output leads and structures thereof
11/01/2007WO2007094759A9 Semiconductor package with plated connection
11/01/2007WO2007062345A3 Method and system for iteratively, selectively tuning a parameter of a doped workpiece using a pulsed laser
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