H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2007
11/08/2007	WO2007015701A3 Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics
11/08/2007	WO2006104583A3 Method and system for increasing tensile stress in a thin film using multi-frequency electromagnetic radiation
11/08/2007	US20070260848 Power mangement integrated circuit
11/08/2007	US20070259533 Semiconductor device and method for fabricating the same
11/08/2007	US20070259481 Process for fabricating chip package structure
11/08/2007	US20070259289 Thin film transistor array panel, manufacturing method thereof, and mask therefor
11/08/2007	US20070259280 Photomask, exposure control method and method of manufacturing a semiconductor device
11/08/2007	US20070259186 Carbon particles dispersed in a graphite-based matrix in which the c axis of the graphene layers of the graphite are parallel, thermal conductivity kappa short-parallel perpendicular to the c axis is at least 400-1000 W/mk, and the thermal conductivity kappa bottom parallel to the c axis is 10-100 W/mk
11/08/2007	US20070258500 Light-Emitting Semiconductor Component Comprising a Protective Diode
11/08/2007	US20070258225 Printed circuit board and method of manufacturing printed ciruit board
11/08/2007	US20070258215 High-power ball grid array package, heat spreader used in the bga package and method for manufacturing the same
11/08/2007	US20070257683 Protection circuit for semiconductor device and semiconductor device including the same
11/08/2007	US20070257625 Apparatus and Method of Power Control
11/08/2007	US20070257388 Aerosol method and apparatus, particulate products, and electronic devices made therefrom
11/08/2007	US20070257377 Package structure
11/08/2007	US20070257376 Semiconductor module
11/08/2007	US20070257374 Semiconductor chip and semiconductor device
11/08/2007	US20070257372 Method for Forming Ti Film and Tin Film, Contact Structure, Computer Readable Storing Medium and Computer Program
11/08/2007	US20070257371 Semiconductor device having a guard ring
11/08/2007	US20070257370 Multilayer electrode structures including capacitor structures having aluminum oxide diffusion barriers and methods of forming the same
11/08/2007	US20070257369 Reducing resistivity in interconnect structures of integrated circuits
11/08/2007	US20070257367 Dielectric trenches, nickel/tantalum oxide structures,and chemical mechanical polishing techniques
11/08/2007	US20070257365 Packaged Semiconductor Chip Comprising An Integrated Circuit Chip Ablated With Laser And Cut With Saw Blade From Wafer
11/08/2007	US20070257364 Methods of reactive composite joining with minimal escape of joining material
11/08/2007	US20070257363 Semiconductor device
11/08/2007	US20070257361 Chip package
11/08/2007	US20070257360 Apparatus and method for precise alignment of packaging caps on a substrate
11/08/2007	US20070257359 Thermal Management Device For A Memory Module
11/08/2007	US20070257357 Forcing gas trapped between two components into cavities
11/08/2007	US20070257355 Soldering structure of through hole
11/08/2007	US20070257354 Code installation decisions for improving aggregate functionality
11/08/2007	US20070257353 Semiconductor chip having a crack test circuit and method of testing a crack of a semiconductor chip using the same
11/08/2007	US20070257352 Test pads on flash memory cards
11/08/2007	US20070257351 Power module for low thermal resistance and method of fabricating the same
11/08/2007	US20070257350 Wafer level stack structure for system-in-package and method thereof
11/08/2007	US20070257349 Leaded Package Integrated Circuit Stacking
11/08/2007	US20070257348 Multiple chip package module and method of fabricating the same
11/08/2007	US20070257347 Chip structure and fabricating process thereof
11/08/2007	US20070257346 Semiconductor device and method for manufacturing same
11/08/2007	US20070257345 Package structure to reduce warpage
11/08/2007	US20070257344 Flip chip type LED lighting device manufacturing method
11/08/2007	US20070257343 Die-on-leadframe (dol) with high voltage isolation
11/08/2007	US20070257341 Structure of a lead-frame matrix of photoelectron devices
11/08/2007	US20070257340 System and method for routing signals between side-by-side die in lead frame type system in a package (SIP) devices
11/08/2007	US20070257339 Shield structures
11/08/2007	US20070257337 Shield substrate, semiconductor package, and semiconductor device
11/08/2007	US20070257324 Semiconductor Devices Having Gate Structures and Contact Pads that are Lower than the Gate Structures
11/08/2007	US20070257316 Semiconductor device
11/08/2007	US20070257258 Semiconductor evaluation device and evaluation method using the same
11/08/2007	US20070257191 Contact opening metrology
11/08/2007	US20070256825 Methodology for the liquid cooling of heat generating components mounted on a daughter card/expansion card in a personal computer through the use of a remote drive bay heat exchanger with a flexible fluid interconnect
11/08/2007	US20070256517 Aerosol method and apparatus, particulate products, and electronic devices made therefrom
11/08/2007	DE19808193B4 Leadframevorrichtung und entsprechendes Herstellungsverfahren Leadframe device and corresponding manufacturing method
11/08/2007	DE112004002981T5 Entwicklungsunterstützungsvorrichtung für Halbleiterbauelemente Development support apparatus for semiconductor devices
11/08/2007	DE10332829B4 Halbleiterchipstapel Semiconductor chip stack
11/08/2007	DE10245533B4 Teststruktur zum Bestimmen eines Dotierbereiches eines Elektrodenanschlusses zwischen einem Grabenkondensator und einem Auswahltransistor in einem Speicherzellenfeld Test structure for determining a doping region of the electrode terminal between a grave capacitor and a select transistor in a memory cell array
11/08/2007	DE102006041535A1 Electronic component e.g. silicon semiconductor chip, reliability e.g. mechanical stability, improving device for use in automobile industry, has semiconductor chip surrounded or enclosed by two molding compound layers
11/08/2007	DE102006011995B3 Power semiconductor module, has base plate connected with substrate in material-coherent manner, and contact layer of substrate divided into segments for providing material-coherent connection with base plate
11/08/2007	DE102005058121B4 Verfahren zum Herstellen keramischer Bauteile, insbesondere elektrisch isolierender Bauteile A method for producing ceramic components, in particular electrically insulating components
11/08/2007	DE102005046280B4 Halbleiterbauteil mit einem Halbleiterchip sowie Verfahren zur Herstellung desselben Of the same semiconductor device with a semiconductor chip and method for producing
11/08/2007	DE102004004532B4 Halbleitervorrichtung Semiconductor device
11/08/2007	DE10101086B4 Leistungs-Moduleinheit Power module unit
11/07/2007	EP1853099A1 A cooling device and use thereof
11/07/2007	EP1852913A1 Macro-component designed to be installed in a pressed stack assembly and pressed stack assembly comprising such a macro-component
11/07/2007	EP1852912A1 Device and method of centring a semiconductor element designed to be inserted in a pressed stack assembly and pressed stack assembly comprising such a device
11/07/2007	EP1852910A1 Mounting substrate and manufacturing method thereof
11/07/2007	EP1852906A2 Sheet to form a protective film for chips and process for producing semiconductor chips
11/07/2007	EP1852893A2 Capacitor and method of manufacturing the same
11/07/2007	EP1851800A2 Semiconductor package with low and high-speed signal paths
11/07/2007	EP1851799A1 Integrated circuit chip package and method
11/07/2007	EP1851798A1 Microelectronic assemblies having compliancy
11/07/2007	EP1851797A1 Device and method for fabricating double-sided soi wafer scale package with through via connections
11/07/2007	EP1851791A2 Method of manufacturing a hermetic chamber with electrical feedthroughs
11/07/2007	EP1668687A4 Fabrication of conductive metal layer on semiconductor devices
11/07/2007	EP1652232B1 Multichip circuit module and method for the production thereof
11/07/2007	EP1547456A4 Heat sink having folded fin heat exchanger core
11/07/2007	EP1287553A4 Chip scale surface mounted device and process of manufacture
11/07/2007	EP1264349A4 A die attachment surface having pedestals for receiving components and method of using the attachment
11/07/2007	EP1190450B1 Electrostatic discharge protection of integrated circuits
11/07/2007	EP1051745B1 A method for generating electrical conducting or semiconducting structures in two or three dimensions, a method for erasing the same structures and an electric field generator/modulator for use with the method for generating
11/07/2007	EP0642699B1 Process for the manufacture of a solid-state device including at least one chip, and corresponding device
11/07/2007	CN200973227Y Cooling device
11/07/2007	CN200973226Y Water-cooled device
11/07/2007	CN200973223Y Forced air-cooled cabinet
11/07/2007	CN200973221Y 固定装置 Fixtures
11/07/2007	CN200973217Y Metal-ceramic insulator sealed case of electronic component
11/07/2007	CN200972867Y Cooling device of LED
11/07/2007	CN200972865Y Package structure of high power LED
11/07/2007	CN200972860Y High power LED
11/07/2007	CN200972859Y Fibre radiation fin
11/07/2007	CN200972858Y Crimping heat-conducting structure for CPU/VGA chip and heat pipe of note-book computer
11/07/2007	CN200972857Y Chip sealing device of preventing adhesive spilling
11/07/2007	CN200972856Y Sealing structure of case of semiconductor separator
11/07/2007	CN101069459A Multilayer printed wiring board and process for producing the same
11/07/2007	CN101069284A Spray cooling with spray deflection
11/07/2007	CN101069283A Encased thermal management device and method of making such a device
11/07/2007	CN101069279A Semiconductor device and its manufacturing method
11/07/2007	CN101068942A Non-evaporable getter alloys for hydrogen sorption
11/07/2007	CN101068846A 环氧树脂组合物及半导体器件 Epoxy resin composition and semiconductor device
11/07/2007	CN101068457A Rediating device

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