Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2007
11/14/2007CN100349287C Method and apparatus for electronically aligning capacitively coupled chip pads
11/14/2007CN100349286C Thyratron transistor valve water-cooling radiator
11/14/2007CN100349285C Circulation flowing pulsating heat pipe for cooling electronic device
11/14/2007CN100349281C Method for forming interconnection line in semiconductor device and interconnection line structure
11/14/2007CN100349280C Layer arrangement and process for producing a layer arrangement
11/14/2007CN100349236C Mounting for electrical circuit in particular electrial breaker
11/14/2007CN100349044C Display device and manufacturing method of the same
11/14/2007CN100349038C Method and devoce for arranging conductive metal wire on display faceplate possessing point discharge
11/13/2007US7296299 Tamper-evident and/or tamper-resistant electronic components
11/13/2007US7295453 Semiconductor device
11/13/2007US7295445 Holder for surface mount device during reflow
11/13/2007US7295439 Heat sink fastening assembly
11/13/2007US7295411 Semiconductor integrated circuit device
11/13/2007US7294937 Apparatus and method for manufacturing a semiconductor wafer with reduced delamination and peeling
11/13/2007US7294935 Integrated circuits protected against reverse engineering and method for fabricating the same using an apparent metal contact line terminating on field oxide
11/13/2007US7294934 Low-K dielectric structure and method
11/13/2007US7294933 Semiconductor wafer, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
11/13/2007US7294932 Semiconductor device
11/13/2007US7294931 Method and apparatus for selective deposition
11/13/2007US7294930 Semiconductor device and manufacturing process therefor
11/13/2007US7294929 Solder ball pad structure
11/13/2007US7294928 Components, methods and assemblies for stacked packages
11/13/2007US7294927 Semiconductor chip package and manufacturing method thereof
11/13/2007US7294926 Chip cooling system
11/13/2007US7294925 Optical scanner package having heating dam
11/13/2007US7294924 Flat panel display device and method of fabricating the same
11/13/2007US7294923 Metallization scheme including a low modulus structure
11/13/2007US7294922 Semiconductor device and method of manufacturing the same
11/13/2007US7294921 System-on-a-chip with multi-layered metallized through-hole interconnection
11/13/2007US7294920 Wafer-leveled chip packaging structure and method thereof
11/13/2007US7294919 Device having a complaint element pressed between substrates
11/13/2007US7294918 Memory card with connecting portions for connection to an adapter
11/13/2007US7294917 IC tag
11/13/2007US7294916 Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip
11/13/2007US7294915 Underfill and mold compounds including siloxane-based aromatic diamines
11/13/2007US7294914 Interconnect structure
11/13/2007US7294913 Cathodic lead insulator
11/13/2007US7294912 Semiconductor device
11/13/2007US7294911 Ultrathin leadframe BGA circuit package
11/13/2007US7294910 Electronic component with multilayered rewiring plate and method for producing the same
11/13/2007US7294909 Electronic package repair process
11/13/2007US7294907 Solid-state imaging device and method for manufacturing the same
11/13/2007US7294905 Thin film capacitor and electronic circuit component
11/13/2007US7294904 Integrated circuit package with improved return loss
11/13/2007US7294901 Semiconductor device with improved resurf features including trench isolation structure
11/13/2007US7294900 Compound semiconductor device and manufacturing method thereof
11/13/2007US7294892 Multi-transistor layout capable of saving area
11/13/2007US7294891 Semiconductor integrated circuit having transistors formed on an insulating substrate
11/13/2007US7294886 Power semiconductor device
11/13/2007US7294884 Passivation of power semiconductor device
11/13/2007US7294881 Nonvolatile semiconductor memory having a charge accumulation layer connected to a gate
11/13/2007US7294871 Top layers of metal for high performance IC's
11/13/2007US7294870 Top layers of metal for high performance IC's
11/13/2007US7294855 Contact structure of semiconductor device, manufacturing method thereof, thin film transistor array panel including contact structure, and manufacturing method thereof
11/13/2007US7294853 Substrate for mounting a semiconductor
11/13/2007US7294587 Component built-in module and method for producing the same
11/13/2007US7294584 Siloxane-based resin and a semiconductor interlayer insulating film using the same
11/13/2007US7294570 Contact integration method
11/13/2007US7294565 Method of fabricating a wire bond pad with Ni/Au metallization
11/13/2007US7294546 Capacitor for a semiconductor device and method of fabricating same
11/13/2007US7294533 Mold compound cap in a flip chip multi-matrix array package and process of making same
11/13/2007US7294532 Method for manufacturing semiconductor device
11/13/2007US7294530 Method for encapsulating multiple integrated circuits
11/13/2007US7294529 Method for embedding a component in a base
11/13/2007US7294516 Test patterns and methods of controlling CMP process using the same
11/13/2007US7294408 Hermetic sealing, heat resistance, shockproof; sapphire or ceramic layers with manganese silicate interface; sintering fusion
11/13/2007US7294389 Microstructure array and a microlens array
11/13/2007US7294381 spliced film carrier tape
11/13/2007US7294217 Oxidizing a surface of the at least one metallic interconnect element;forming on at least one of interconnect elements, bonding surface layer comprising copper nitride to inhibit oxidation of underlying metallic layers; forming an electrically conductive bond
11/13/2007US7293998 Electronic device and circuit module device
11/13/2007CA2280115C Low temperature method and compositions for producing electrical conductors
11/13/2007CA2176880C Scaled adaptive lithography
11/08/2007WO2007127931A2 Methods of reactive composite joining with minimal escape of joining material
11/08/2007WO2007127816A2 Method for forming c4 connections on integrated circuit chips and the resulting devices
11/08/2007WO2007127770A2 Improved cmos diodes with dual gate conductors, and methods for forming the same
11/08/2007WO2007127739A2 Three-dimensional packaging scheme for package types utilizing a sacrificail metal base
11/08/2007WO2007127304A2 High reliability power module
11/08/2007WO2007127289A2 Centrifugal condenser
11/08/2007WO2007126687A2 Event evaluation using extrinsic state information
11/08/2007WO2007126683A2 Code installation decisions for improving aggregate functionality
11/08/2007WO2007126682A2 Aggregating network activity using software provenance data
11/08/2007WO2007126090A1 Circuit board, electronic device and method for manufacturing circuit board
11/08/2007WO2007125956A1 Thermosetting composition for optical semiconductor, die bond material for optical semiconductor device, underfill material for optical semiconductor device, sealing agent for optical semiconductor device, and optical semiconductor device
11/08/2007WO2007125939A1 Clad material for wiring connection and wiring connection member processed from the clad material
11/08/2007WO2007125878A1 Aluminum/silicon carbide composite and radiating part comprising the same
11/08/2007WO2007125841A1 Semiconductor device, method for manufacturing semiconductor device, and electronic appliance having the semiconductor device
11/08/2007WO2007125802A1 Heat transfer member, protruding structural member, electronic device, and electric product
11/08/2007WO2007125785A1 Curable resin composition
11/08/2007WO2007125748A1 Film forming method, film forming device, and storage medium
11/08/2007WO2007125744A1 Semiconductor device with double-sided electrode structure and its manufacturing method
11/08/2007WO2007125635A1 Resin composition for semiconductor encapsulation and semiconductor device
11/08/2007WO2007125633A1 High-frequency semiconductor device
11/08/2007WO2007125094A1 A microwave chip supporting structure
11/08/2007WO2007124776A1 Micro-heat sink
11/08/2007WO2007124769A1 A microwave chip supporting structure
11/08/2007WO2007124652A1 Micro-slot group integrated heat-pipe radiator
11/08/2007WO2007124611A1 Method for the production of an electroluminescence apparatus and an electroluminescence apparatus produced according to said method
11/08/2007WO2007063044A3 Laser fuse structures for high power applications
11/08/2007WO2007035182A3 Field enhanced electrodes for additive-injection non-thermal plasma (ntp) processor
11/08/2007WO2007024731A3 Hermetic interconnect structure and method of fabrication
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