Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2007
11/15/2007DE202007012971U1 Vorrichtung zur Wärmeabfuhr eines Chips Apparatus for heat dissipation of a chip
11/15/2007DE10335071B4 Verfahren zur Integrierung einer Ausrichtmarkierung und Grabenvorrichtung A method for integrating an alignment device and grave
11/15/2007DE102007022428A1 Elektronisches Bauelement und Verfahren zu dessen Herstellung An electronic device and method for its production
11/15/2007DE102007019809A1 Leuchtdiodengehäuse mit direkter Leitungsrahmen-Wärmeableitung Light-emitting diodes housing with direct line frame heat dissipation
11/15/2007DE102007019686A1 Verbindungsstruktur, elektronisches Bauelement und Verfahren zur Herstellung derselben Connection structure, an electronic component and method of producing same
11/15/2007DE102006022748A1 Halbleiterbauteil mit oberflächenmontierbaren Bauelementen und Verfahren zu seiner Herstellung A semiconductor device comprising surface mount components and process for its preparation
11/15/2007DE102006022444A1 Microstructured electronic module for use in engine compartment of motor vehicle, has contact sections provided on semiconductor carrier for contacting with bonding wire, where sections are made from nickel, palladium and gold layers
11/15/2007DE102006022360A1 Abschirmvorrichtung Screening
11/15/2007DE102006022254A1 Halbleiterbauteil mit in Kunststoffgehäusemasse eingebetteten Halbleiterbauteilkomponenten Semiconductor device having embedded in plastic housing compound semiconductor device components
11/15/2007DE102006022126A1 Electronic component e.g. silicon controlled rectifier, manufacturing method, involves doping portion of body regions by introducing dopant atoms into portion through intermediate region formed between separate gate regions
11/15/2007DE102006022105A1 ESD-Schutz-Element und ESD-Schutz-Einrichtung zur Verwendung in einem elektrischen Schaltkreis ESD protection element and the ESD protection device for use in an electrical circuit
11/15/2007DE102006022067A1 Production of electronic component with semiconductor element bonded and fastened on a substrate, comprises applying a gold layer on the substrate surface and spray coating of the element and/or the surface with hardening/ curing component
11/15/2007DE102006022066A1 Electrostatic discharge-protective circuit for e.g. microprocessors, has high frequency line dimensioned, so that current path is transformed from low impedance to another impedance, which is very high with respect to system impedance
11/15/2007DE102006021959A1 Leistungshalbleiterbauteil und Verfahren zu dessen Herstellung Power semiconductor device and process for its preparation
11/15/2007DE102006021829A1 Thermal radiator has thermoelectric cooler, and multiple thermal radiator module comprises thermal radiator module with set of cooling fin, where thermal conduction is connected with each fin of this set by cooling fins
11/15/2007DE102006021412B3 Leistungshalbleitermodul The power semiconductor module
11/15/2007DE102006008632B4 Leistungshalbleiterbauteil und Verfahren zu dessen Herstellung Power semiconductor device and process for its preparation
11/15/2007DE10102353B4 LED-Signalmodul LED signal module
11/15/2007CA2685971A1 Optically-enabled integrated circuit package
11/15/2007CA2652218A1 Led work light
11/14/2007EP1855516A1 Ceramic multilayer board and method for manufacturing same
11/14/2007EP1855318A1 Compact high performance semiconductor module with connecting device
11/14/2007EP1855317A2 Heating device for electronic components in military vehicles, in particular tanks
11/14/2007EP1855316A1 Stackable integrated circuit package
11/14/2007EP1855313A1 Process for producing modified porous silica film, modified porous silica film obtained by the process, and semiconductor device employing the modified porous silica film
11/14/2007EP1854819A1 Epoxy resin composition, cured object obtained therefrom, semiconductor-encapsulating material, novel phenolic resin, and novel epoxy resin
11/14/2007EP1854133A2 Low cost, high volume lead frame production
11/14/2007EP1854132A2 A method for pattern metalization of substrates
11/14/2007EP1853676A1 Method of bonding substrates
11/14/2007EP1570513A4 Microelectronic packaging and components
11/14/2007EP1297571B1 Layout and process for a device with segmented ball limited metallurgy for the inputs and outputs
11/14/2007EP1035583B1 Semiconductor element and fabricating method thereof
11/14/2007CN200976726Y Heat conducting medium protective cap
11/14/2007CN200976721Y Fastener group for heat radiator
11/14/2007CN200976358Y Vane-shaped heat dissipating cross pipe dedicated for semiconductor refrigeration equipment
11/14/2007CN200976357Y SMD diode support structure having community
11/14/2007CN200976356Y Surface adhibited device diode support structure having crystal fixing basement
11/14/2007CN200976350Y Liquid insulation heat conductive material embedding module
11/14/2007CN200976349Y LED package bracket
11/14/2007CN200976348Y Novel structure for diode
11/14/2007CN200976347Y Power electronic power device gate electrode device
11/14/2007CN200976346Y 775CPU baseboard
11/14/2007CN200976345Y 芯片封装结构 Chip package
11/14/2007CN200976344Y Foot base structure for radiating module of CPU
11/14/2007CN101073152A Electronic package having down-set leads and method
11/14/2007CN101073151A Semiconductor package structure having enhanced thermal dissipation characteristics
11/14/2007CN101073150A Semiconductor package structure having enhanced thermal dissipation characteristics
11/14/2007CN101073147A Device having enhanced stress state and related methods
11/14/2007CN101072808A Method for producing acid anhydride based epoxy resin curing agent, acid anhydride based epoxy resin curing agent, epoxy resin composition, cured article therefrom and optical semiconductor device
11/14/2007CN101072807A 热固性环氧树脂组合物及其用途 Thermosetting epoxy resin composition and use thereof
11/14/2007CN101072490A Support column with porous structure
11/14/2007CN101072487A Fan fixing device
11/14/2007CN101072486A 散热器固定装置 Sink fixtures
11/14/2007CN101072485A Radiating device
11/14/2007CN101072484A Radiating device
11/14/2007CN101072483A Radiating device
11/14/2007CN101072482A Radiating device and radiating system using same
11/14/2007CN101072481A 散热器 Heat sink
11/14/2007CN101071839A 发光装置 Light-emitting device
11/14/2007CN101071838A 发光装置 Light-emitting device
11/14/2007CN101071817A Cover glass for semiconductor package and method for producing same
11/14/2007CN101071816A Poly-silicon thin film transistor array substrate and method for fabricating the same
11/14/2007CN101071814A Semiconductor memory device having layout area reduced
11/14/2007CN101071813A Structure and method for determining gradient field of process environment
11/14/2007CN101071811A Semiconductor device, related method and printed circuit board
11/14/2007CN101071810A 半导体器件 Semiconductor devices
11/14/2007CN101071809A Power semiconductor device
11/14/2007CN101071808A Optimized wire bonding of an integrated modulator and laser diode on a mount
11/14/2007CN101071807A Connecting module structure with passive element and its manufacturing method
11/14/2007CN101071806A 封装结构 Package
11/14/2007CN101071805A System-level packaging module and its preparing method
11/14/2007CN101071804A Semiconductor system
11/14/2007CN101071803A 配线和有机晶体管及其制造方法 Wiring and an organic transistor and manufacturing method thereof
11/14/2007CN101071802A Semiconductor device and method for cutting electric fuse
11/14/2007CN101071801A 集成电路的结构 Structure of the integrated circuit
11/14/2007CN101071800A Tape carrier, semiconductor apparatus, and semiconductor module apparatus
11/14/2007CN101071799A Manufacturing method of resin-molding type semiconductor device, and wiring board therefor
11/14/2007CN101071798A Semiconductor packaging substrate and semiconductor package with same
11/14/2007CN101071797A Effective packaging method for improving component-device sub-layer of semiconductor plastic package
11/14/2007CN101071796A Lead frame and semiconductor device using the same
11/14/2007CN101071795A Semiconductor device of chip constitution and manufacturing method thereof
11/14/2007CN101071794A III-V crystal and production method
11/14/2007CN101071789A Multilayer interconnect structure containing air gaps and method for making
11/14/2007CN101071788A Method for forming metal wiring line, method for manufacturing active matrix substrate, device, electro-optical device, and electronic apparatus
11/14/2007CN101071781A Wafer level packaging method and its structure
11/14/2007CN101071780A Chip structure and its manufacturing process
11/14/2007CN101071779A Semiconductor package stacking structure and its preparing method
11/14/2007CN101071776A Common drain dual semiconductor chip scale package and method of fabricating same
11/14/2007CN101071756A Methods of forming a diamond micro-channel structure and resulting devices
11/14/2007CN101071652A Heat exchanger, light source apparatus, and projector
11/14/2007CN101071243A Thin film transistor substrate, liquid crystal display panel including the same, and method of manufacturing liquid crystal display panel
11/14/2007CN101070429A Heat-curable silicone composition
11/14/2007CN101069922A Method for making radiator supporting column
11/14/2007CN101069921A Radiator and making method
11/14/2007CN100349370C Commutating crystal brake tube power-phase module of impacted integrated gate pole
11/14/2007CN100349303C Ic device and transistor device and micro-electronic device and their manufacture
11/14/2007CN100349291C Electrostatic discharge protecting circuit
11/14/2007CN100349290C Semiconductor device and its manufacture
11/14/2007CN100349289C Semiconductor packaging structure and its manufacturing method
11/14/2007CN100349288C External pin less packaging structure
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