Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2007
11/15/2007WO2007130938A2 Semiconductor package-on-package system including integrated passive components
11/15/2007WO2007130643A2 Die-on-leadframe (dol) with high voltage isolation
11/15/2007WO2007130557A2 Methodology for the liquid cooling of heat generating components mounted on a daughter card/expansion card in a personal computer through the use of a remote drive bay heat exchanger with a flexible fluid interconnect
11/15/2007WO2007129983A1 Anodic bonding of polymers to glass, silicon or other materials
11/15/2007WO2007129715A1 Aluminum-silicon carbide composite body and method for processing the same
11/15/2007WO2007129662A1 Insulating material, process for producing electronic part/device, and electronic part/device
11/15/2007WO2007129496A1 Electronic component and method for manufacturing same
11/15/2007WO2007129486A1 Semiconductor device and method for manufacturing same
11/15/2007WO2007129132A1 Semiconductor package and method of assembling a semiconductor package
11/15/2007WO2007128797A1 Use of coated silicone elastomers as membranes
11/15/2007WO2007128773A1 A cooling device and use thereof
11/15/2007WO2007128126A1 Work light
11/15/2007WO2007128118A1 Optically-enabled integrated circuit package
11/15/2007WO2007101694A3 Device comprising a gas cooler and evaporator for cooling, in particular, electronic components
11/15/2007WO2007096018A3 Method for selectively producing film laminates for packaging and for insulating unpackaged electronic components and functional patterns and corresponding device
11/15/2007WO2007095369A3 Quasi-radial heatsink with rectangular form factor and uniform fin length
11/15/2007WO2007092591A3 Multi-layered probes
11/15/2007WO2007089885A3 Passive impedance equalization of high speed serial links
11/15/2007WO2007087406A3 Porous silicon dielectric
11/15/2007WO2007069224A3 Enhanced substrate using metamaterials
11/15/2007WO2007056599A3 Liquid cooling for backlit displays
11/15/2007WO2007030345A3 Die pad for semiconductor packages
11/15/2007WO2006110750A3 Multilayer, multicomponent high-k films and methods for depositing the same
11/15/2007WO2006104585A3 Conducting metal oxide with additive as p-mos device electrode
11/15/2007WO2006050127A3 Semiconductor device package with bump overlying a polymer layer
11/15/2007US20070266129 Three-dimensional networking structure
11/15/2007US20070264848 Connector
11/15/2007US20070264817 Via Line Barrier and Etch Stop Structure
11/15/2007US20070264813 Process for producing a film carrier tape for mounting an electronic part
11/15/2007US20070264756 Method and apparatus for manufacture and inspection of semiconductor device
11/15/2007US20070264754 Method of fabricating a semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion
11/15/2007US20070264751 Super High Density Module with Integrated Wafer Level Packages
11/15/2007US20070264519 Copper-pillar plugs for semiconductor die
11/15/2007US20070262871 Tag device, antenna, and portable card
11/15/2007US20070262475 Polysilicon hard mask for enhanced alignment signal
11/15/2007US20070262474 Semiconductor device and method of manufacturing same
11/15/2007US20070262473 Integrated circuit package system with contoured encapsulation
11/15/2007US20070262472 High Withstand Voltage Semiconductor Device Covered with Resin and Manufacturing Method Therefor
11/15/2007US20070262471 Plated antenna for high frequency devices
11/15/2007US20070262470 Module With Built-In Semiconductor And Method For Manufacturing The Module
11/15/2007US20070262469 Method for fabricating semiconductor package with multi-layer die contact and external contact
11/15/2007US20070262468 Semiconductor device and method of manufacturing the same
11/15/2007US20070262467 Semiconductor Device Having a Chip Stack on a Rewiring Plate
11/15/2007US20070262466 Semiconductor device
11/15/2007US20070262465 Semiconductor Device and Method of Fabricating the Same
11/15/2007US20070262464 Method of forming vias in semiconductor substrates and resulting structures
11/15/2007US20070262463 Semiconductor substrate-based interconnection assembly for semiconductor device bearing external elements
11/15/2007US20070262462 Manufacturing method of resin-molding type semiconductor device, and wiring board therefor
11/15/2007US20070262461 Semiconductor device and method of producing the same
11/15/2007US20070262460 Top layers of metal for high performance IC's
11/15/2007US20070262459 Top layers of metal for high performance IC's
11/15/2007US20070262458 Top layers of metal for high performance IC's
11/15/2007US20070262457 Top layers of metal for high performance IC's
11/15/2007US20070262456 Top layers of metal for high performance IC's
11/15/2007US20070262455 Top layers of metal for high performance IC's
11/15/2007US20070262454 Semiconductor device and wiring auxiliary pattern generating method
11/15/2007US20070262453 Semiconductor device including triple-stacked structures having the same structure
11/15/2007US20070262452 Electronic component built-in substrate and method of manufacturing the same
11/15/2007US20070262451 Recessed workfunction metal in CMOS transistor gates
11/15/2007US20070262450 ELECTRIC FUSES USING CNTs (CARBON NANOTUBES)
11/15/2007US20070262449 Coating method and solutions for enhanced electromigration resistance
11/15/2007US20070262448 Semiconductor Device, Power Supply Apparatus Using Same, and Electronic Device
11/15/2007US20070262447 Circuit board, method for manufacturing the same, and semiconductor device
11/15/2007US20070262446 Stacked bump structure and manufacturing method thereof
11/15/2007US20070262445 Stack MCP and manufacturing method thereof
11/15/2007US20070262444 Semiconductor device and chip structure thereof
11/15/2007US20070262443 Electronic Device with Integrated Heat Distributor
11/15/2007US20070262442 Packaged electronic component
11/15/2007US20070262441 Heat sink structure for embedded chips and method for fabricating the same
11/15/2007US20070262440 Sealing structure and method of manufacturing the sealing structure
11/15/2007US20070262439 COB type IC package to enhanced bondibility of bumps embedded in substrate and method for fabricating the same
11/15/2007US20070262438 System and method of silicon switched power delivery using a package
11/15/2007US20070262437 Semiconductor device with temperature cycle life improved
11/15/2007US20070262436 Microelectronic devices and methods for manufacturing microelectronic devices
11/15/2007US20070262435 Three-dimensional packaging scheme for package types utilizing a sacrificial metal base
11/15/2007US20070262434 Interconnected ic packages with vertical smt pads
11/15/2007US20070262433 Semiconductor Component with Surface Mountable Devices and Method for Producing the Same
11/15/2007US20070262432 Semiconductor device comprising semiconductor device components embedded in plastic housing composition
11/15/2007US20070262431 Semiconductor device
11/15/2007US20070262430 Electric component, method of producing the same, substrate with built-in electric component, and method of producing the same
11/15/2007US20070262427 Semiconductor device
11/15/2007US20070262426 Semiconductor Housings Having Coupling Coatings
11/15/2007US20070262425 Tape carrier, semiconductor apparatus, and semiconductor module apparatus
11/15/2007US20070262424 Methods for forming through-wafer interconnects and devices and systems having at least one dam structure
11/15/2007US20070262423 Integrated circuit encapsulation system with vent
11/15/2007US20070262422 Shielding device
11/15/2007US20070262421 Thermoset polyimides for microelectronic applications
11/15/2007US20070262420 Manufacturing Method for Semiconductor Chips, and Semiconductor Chip
11/15/2007US20070262419 Semiconductor Device
11/15/2007US20070262418 Integrated passive devices
11/15/2007US20070262409 Lead frame and semiconductor device using the same
11/15/2007US20070262388 Bridge Resistance Random Access Memory Device and Method With A Singular Contact Structure
11/15/2007US20070262387 Power semiconductor module
11/15/2007US20070262386 ESD protection element and ESD protection device for use in an electrical circuit
11/15/2007US20070262383 Soi substrate and semiconductor integrated ciruit device
11/15/2007US20070262306 Semiconductor device having microstructure and method of manufacturing microstructure
11/15/2007US20070262305 Integrated circuit protection from esd damage during fabrication
11/15/2007US20070262286 Potassium formate solution, polyphosphate salt and dicyandiamide, effective for silicon and aluminum, aluminum alloys, copper, and other components of microprocessor cooling systems; thermal performance of computer systems
11/15/2007US20070261883 Methods For Improving The Flux Compatibility Of Underfill Formulations
11/15/2007US20070261635 Spray coating apparatus and fixtures
1 ... 1003 1004 1005 1006 1007 1008 1009 1010 1011 1012 1013 1014 1015 1016 1017 1018 1019 1020 1021 1022 1023 ... 2262