Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2007
11/21/2007CN101075599A Method for improving device lamination inside semiconductor plastic packer
11/21/2007CN101075598A Method for improving device lamination inside semiconductor plastic packer efficiently
11/21/2007CN101075597A Method for packing against semiconductor plastic sealer internal device lamination
11/21/2007CN101075596A Piled semiconductor packing structure and its production
11/21/2007CN101075595A Semiconductor wafer welding material projected block structure and its production
11/21/2007CN101075594A Semiconductor chip, method for manufacturing semiconductor chip and package of semiconductor chip
11/21/2007CN101075593A Circulating hot-pipe electronic device radiator
11/21/2007CN101075592A Hot-piping electronic device radiator
11/21/2007CN101075591A Chip packing structure, chip structure and method for forming chip
11/21/2007CN101075590A Package component
11/21/2007CN101075589A Structure and method for constructing air-tight microelectronic component
11/21/2007CN101075588A Semiconductor structure, semiconductor chip and manufacturing method thereof
11/21/2007CN101075587A Structure and method for packing semiconductor
11/21/2007CN101075584A Method of manufacturing LCD apparatus by using halftone exposure method
11/21/2007CN101075579A Conducting-wire structure, pixel structure, display panel, photoelectric device and its forming method
11/21/2007CN101075568A Packing component of semiconductor and its production
11/21/2007CN101075566A Packer of semiconductor and its production
11/21/2007CN101075565A Packer of semiconductor and its production
11/21/2007CN101075300A Card-typed circuit module and its production
11/21/2007CN101075033A Transmissible reflective type diode substrate and a method for fabricating the same
11/21/2007CN100350630C Optical semiconductor device
11/21/2007CN100350618C 半导体装置 Semiconductor device
11/21/2007CN100350611C 半导体集成电路器件 The semiconductor integrated circuit device
11/21/2007CN100350610C Semiconductor and its manufacture
11/21/2007CN100350609C Electronic control apparatus
11/21/2007CN100350608C Multi-chip packaging body
11/21/2007CN100350607C Semiconductor device and producing method thereof
11/21/2007CN100350606C Voltage variable material for direct application and devices employing same
11/21/2007CN100350605C Semiconductor device with alignment mark
11/21/2007CN100350604C Seiconductor interconnection with double-cover and its mfg. method
11/21/2007CN100350603C Encapsulation of pin solder for maintaining accuracy in pin position
11/21/2007CN100350602C High performance, low cost microelectronic circuit package with interposer
11/21/2007CN100350601C Multi-row leadframe
11/21/2007CN100350600C Semiconductor wafer package and its packaging method
11/21/2007CN100350599C Heat spreader ball grid array package its forming method
11/21/2007CN100350598C Semiconductor device having a pair of heat sinks and method for manufacturing the same
11/21/2007CN100350597C Strap for forming resin pull-rod and resin
11/21/2007CN100350591C Method for forming metal wire of semiconductor device
11/21/2007CN100350586C Test region layout for shallow trench isolation
11/21/2007CN100350581C Integrated wiring and inverse packaged chip structure and process
11/21/2007CN100350580C Semiconductor wafer package and its packaging method
11/21/2007CN100350557C Semiconductor package and method for manufacturing the same
11/21/2007CN100350303C LCD device
11/21/2007CN100350256C Voltage measuring apparatus
11/21/2007CN100350064C Cu-Ni-Si-Mg series copper alloy strip
11/21/2007CN100349981C Porous mebrane shaping composition, porous membrane manufacturing method, porous membrane, intercalation insulating film and semiconductor device
11/21/2007CN100349966C Resin containing dielectric filler for formation of built-in capactor layer of printed wiring board, copper double clad laminate having dielectric layer formed with resin containing dielectric filler
11/20/2007US7299443 Method for designing wiring connecting section and semiconductor device
11/20/2007US7298656 Process monitoring by comparing delays proportional to test voltages and reference voltages
11/20/2007US7298618 Cooling apparatuses and methods employing discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled
11/20/2007US7298616 Cooling device capable of reducing thickness of electronic apparatus
11/20/2007US7298052 Micro chip-scale-package system
11/20/2007US7298050 Semiconductor device, method of manufacturing the same, capacitor structure, and method of manufacturing the same
11/20/2007US7298049 Submount for mounting semiconductor device
11/20/2007US7298047 Electronic circuit device
11/20/2007US7298046 Semiconductor package having non-ceramic based window frame
11/20/2007US7298045 Stacked semiconductor device
11/20/2007US7298044 Electronic device with heat dissipation module
11/20/2007US7298043 Semiconductor device
11/20/2007US7298042 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
11/20/2007US7298040 Wire bonding method and apparatus for integrated circuit
11/20/2007US7298039 Electronic circuit device
11/20/2007US7298038 Integrated circuit package system including die stacking
11/20/2007US7298037 Stacked integrated circuit package-in-package system with recessed spacer
11/20/2007US7298036 Scaling of functional assignments in packages
11/20/2007US7298034 Multi-chip semiconductor connector assemblies
11/20/2007US7298033 Stack type ball grid array package and method for manufacturing the same
11/20/2007US7298032 Semiconductor multi-chip package and fabrication method
11/20/2007US7298031 Multiple substrate microelectronic devices and methods of manufacture
11/20/2007US7298030 Structure and method of making sealed capped chips
11/20/2007US7298029 Semiconductor devices and manufacturing method therefor
11/20/2007US7298028 Printed circuit board for thermal dissipation and electronic device using the same
11/20/2007US7298027 SMT three phase inverter package and lead frame
11/20/2007US7298026 Large die package and method for the fabrication thereof
11/20/2007US7298025 Microelectronic component assemblies and microelectronic component lead frame structures
11/20/2007US7298024 Transparent amorphous carbon structure in semiconductor devices
11/20/2007US7298023 Electronic device with organic insulator
11/20/2007US7298022 Semiconductor sensor
11/20/2007US7298021 Electronic device and method for manufacturing the same
11/20/2007US7298010 Radiation-hardened transistor and integrated circuit
11/20/2007US7297998 Semiconductor devices having a buried and enlarged contact hole and methods of fabricating the same
11/20/2007US7297981 Electro-optical device having a light-shielding film comprising alternating layers of silicide and nitrided silicide
11/20/2007US7297971 Alignment systems and methods for lithographic systems
11/20/2007US7297878 High frequency laminated component and its manufacturing method
11/20/2007US7297876 Circuit board and method of manufacturing the same
11/20/2007US7297631 Methods of forming electronic structures including conductive shunt layers and related structures
11/20/2007US7297630 Methods of fabricating via hole and trench
11/20/2007US7297614 Method for fabricating circuitry component
11/20/2007US7297606 Metal-oxide-semiconductor device including a buried lightly-doped drain region
11/20/2007US7297575 System semiconductor device and method of manufacturing the same
11/20/2007US7297574 Multi-chip device and method for producing a multi-chip device
11/20/2007US7297573 Methods and apparatus for particle reduction in MEMS devices
11/20/2007US7297572 Fabrication method for electronic system modules
11/20/2007US7297563 Method of making contact pin card system
11/20/2007US7297561 Pattern for improved visual inspection of semiconductor devices
11/20/2007US7297024 Universal-serial-bus (USB) flash-memory device with metal wrap formed over plastic housing
11/20/2007US7296618 Liquid cooling system and electronic apparatus using the same
11/20/2007US7296617 Heat sink
11/15/2007WO2007131095A2 Thermal management device for a memory module
11/15/2007WO2007131046A2 Dielectric trenches, nickel/tantalum oxide structures, and chemical mechanical polishing techniques
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