H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2007
11/22/2007	US20070267744 Manufacturing a bump electrode with roughened face
11/22/2007	US20070267743 Semiconductor device having low dielectric insulating film and manufacturing method of the same
11/22/2007	US20070267742 Dual mosfet package
11/22/2007	US20070267741 Liquid submersion cooling system
11/22/2007	US20070267740 Method and apparatus for cooling semiconductor device hot blocks and large scale integrated circuit (IC) using integrated interposer for IC packages
11/22/2007	US20070267739 Power Semiconductor Module
11/22/2007	US20070267738 Stack-type semiconductor device having cooling path on its bottom surface
11/22/2007	US20070267737 Packaged devices and methods for forming packaged devices
11/22/2007	US20070267736 Semiconductor device and method of manufacturing the same
11/22/2007	US20070267735 Dielectric interlayer, antidiffusion film, copper seed layer; vapor deposition; atomic layer deposition
11/22/2007	US20070267734 No-lead IC packages having integrated heat spreader for electromagnetic interference (EMI) shielding and thermal enhancement
11/22/2007	US20070267733 Symmetrical MIMCAP capacitor design
11/22/2007	US20070267732 Circuit card module and method for fabricating the same
11/22/2007	US20070267731 Integrated circuit package system with different mold locking features
11/22/2007	US20070267730 Wafer level semiconductor chip packages and methods of making the same
11/22/2007	US20070267729 Electronic Component Having a Semiconductor Power Device
11/22/2007	US20070267728 Flip chip mlp with folded heat sink
11/22/2007	US20070267727 Copper straps
11/22/2007	US20070267726 Dual side cooling integrated power device module and methods of manufacture
11/22/2007	US20070267725 Semiconductor chip, method of manufacturing the semiconductor chip and semiconductor chip package
11/22/2007	US20070267724 Integrated circuit having stress tuning layer and methods of manufacturing same
11/22/2007	US20070267723 Double-sided integrated circuit chips
11/22/2007	US20070267714 Top layers of metal for high performance IC's
11/22/2007	US20070267712 Solid state imaging device, semiconductor wafer, optical device module, method of solid state imaging device fabrication, and method of optical device module fabrication
11/22/2007	US20070267700 Esd protection element
11/22/2007	US20070267651 Semiconductor device having a fuse and method of forming thereof
11/22/2007	US20070267632 Apparatus and Method for Test Structure Inspection
11/22/2007	US20070267631 System and Method for Increasing Productivity of Combinatorial Screening
11/22/2007	US20070267218 Multilayer Electronic Component, Electronic Device, and Method for Manufacturing Multilayer Electronic Component
11/22/2007	US20070267136 Method for Manufacturing an Electronics Module
11/22/2007	DE10241589B4 Verfahren zur Lötstopp-Strukturierung von Erhebungen auf Wafern A method for solder resist patterning of bumps on wafers
11/22/2007	DE10222608B4 Halbleitervorrichtung und Verfahren zum Herstellen derselben A semiconductor device and method of manufacturing the same
11/22/2007	DE102006037554B3 Verfahren zur Einstellung eines Bezugspotentials eines Stromfühlers und Anordnung zur Bestimmung des Bezugspotentials einer Leistungshalbleitereinrichtung Method for setting a reference potential and a current sensor arrangement for determining a reference potential of a power semiconductor device
11/22/2007	DE102006028692A1 Elektrisch leitende Verbindung mit isolierendem Verbindungsmedium Electrically conductive connection with insulating compound medium
11/22/2007	DE102006023701A1 Micromechanical unit, has substrate with front side and back side, cover substrate connected with front side of substrate, and contact surfaces electrically contacting part of micromechanical structure and provided on back side of substrate
11/22/2007	DE102006023429A1 ESD-Schutz-Element und ESD-Schutz-Einrichtung zur Verwendung in einem elektrischen Schaltkreis, Verfahren zum Herstellen eines ESD-Schutz-Elementes ESD protection element and the ESD protection device for use in an electrical circuit, method for manufacturing an ESD protection element
11/22/2007	DE102006023168A1 Herstellungsverfahren für eine elektronische Schaltung und elektronische Schaltung in einer Package-in-Package-Ausführung Manufacturing method for an electronic circuit and electronic circuit in a package-on-package execution
11/22/2007	DE102006022985A1 Schaltungsanordnung mit einer seriellen Testschnittstelle bzw. serielles Testbetriebsverfahren Circuitry with a serial test interface or serial test operating procedures
11/22/2007	DE102006021847A1 Schaltungsanordnung zum Schutz vor elektrostatischen Entladungen und Verfahren zur Ableitung von elektrostatischen Entladungen Circuitry to protect against electrostatic discharges and method for the derivation of electrostatic discharges
11/22/2007	DE102005031836B4 Halbleiterleistungsmodul mit SiC-Leistungsdioden und Verfahren zur Herstellung desselben The semiconductor power module of the same with SiC power diode and methods for preparing
11/22/2007	DE10109531B4 Keramik mit Hochfrequenzeigenschaften, Verfahren zu ihrer Herstellung und ihre Verwendung Ceramic having high-frequency properties, process for their preparation and their use
11/22/2007	CA2651649A1 Method for fixing an electronic component on a printed circuit board and system comprising a printed circuit board and at least one electronic component
11/21/2007	EP1858313A1 Power inverter
11/21/2007	EP1858081A1 Silicon integrated circuit operating in hyperfrequency and manufacturing method
11/21/2007	EP1858080A2 No-lead ic packages having integrated heat spreader for electromagnetic interference (emi) shielding and thermal enhancement
11/21/2007	EP1858079A2 Assembly for cooling SMD high performance components on a PCB
11/21/2007	EP1858078A1 Member for semiconductor device and method for manufacture thereof
11/21/2007	EP1858077A2 Heat sink electronic package having compliant pedestal
11/21/2007	EP1858076A2 Method and apparatus for cooling semiconductor device hot blocks and large scale integrated circuit (ic) using integrated interposer for ic packages
11/21/2007	EP1857488A1 Highly heat-resistant synthetic polymer compound and high withstand voltage semiconductor device
11/21/2007	EP1856745A2 Systems and methods for producing white-light light emitting diodes
11/21/2007	EP1856739A1 Device for supplying an integrated circuit with power
11/21/2007	EP1856738A1 An integrated circuit device package with an additional contact pad, a lead frame and an electronic device
11/21/2007	EP1856737A1 An integrated circuit package device with improved bond pad connections, a leadframe and an electronic device
11/21/2007	EP1856736A1 Copper bonding or superfine wire with improved bonding and corrosion properties
11/21/2007	EP1856735A2 Low k dielectric cvd film formation process with in-situ imbedded nanolayers to improve mechanical properties
11/21/2007	EP1856734A1 Micro-heat exchanger
11/21/2007	EP1856733A2 Method for micropackaging of leds and micropackage
11/21/2007	EP1856729A1 Method for establishing an electrical and mechanical connection between chip contact surfaces and antenna contact surfaces and transponder
11/21/2007	EP1856728A2 A method of manufacturing semiconductor packages and packages made
11/21/2007	EP1856727A2 Junction-isolated vias
11/21/2007	EP1747588B1 Illuminable gaas switching component with a transparent housing, and microwave circuit therewith
11/21/2007	EP1671339A4 Method and apparatus for performing power routing on a voltage island within an integrated circuit chip
11/21/2007	EP1514304B1 Method for the production of an nrom memory cell arrangement
11/21/2007	EP1170793B1 Support matrix with a bonding channel for an integrated circuit and manufacturing method thereof
11/21/2007	CN200980219Y A dense junction structure of foot in radiator with heat pipe
11/21/2007	CN200980214Y A locking joint structure of clip in heat sink group
11/21/2007	CN200979889Y A wing radiant pipe especially for a semiconductor chiller plant
11/21/2007	CN200979888Y LED structure
11/21/2007	CN200979887Y A brightness-improving bracket structure of a SMD diode and encapsulation structure
11/21/2007	CN200979885Y A power device with anti-explosion device
11/21/2007	CN200979882Y A plane power device with single silicon and double metal layers
11/21/2007	CN200979880Y A non-touching intelligent card and an encapsulated module for an intelligent label
11/21/2007	CN200979879Y A CPU heat sink
11/21/2007	CN200979139Y LED lamp heat-irradiation module
11/21/2007	CN101076892A Power module, manufacturing method therefor, and air conditioner
11/21/2007	CN101076891A Semiconductor structure comprising a stress sensitive element and method of measuring a stress in a semiconductor structure
11/21/2007	CN101076890A Structure with metal trace interconnect component embedded in surface of dielectric material and its manufacturing method
11/21/2007	CN101076883A Structure and method of making interconnect element, and multilayer wiring board including the interconnect element
11/21/2007	CN101076239A Method for combining radiating fin with heat-transfer pipe
11/21/2007	CN101076237A Radiator
11/21/2007	CN101076236A Radiator
11/21/2007	CN101076235A Radiator with rotation-speed indication function
11/21/2007	CN101076231A Buckle structure
11/21/2007	CN101076229A Method for producing printing-circuit board conducting hole
11/21/2007	CN101075650A Light-emitting diodes for crystal-coated package and its production
11/21/2007	CN101075627A Solid-state image sensing device
11/21/2007	CN101075621A Semiconductor device and its manufacturing method
11/21/2007	CN101075620A Non-volatile memory integrated circuit device and method of fabricating the same
11/21/2007	CN101075618A Nonvolatile memory unit array
11/21/2007	CN101075614A Semiconductor apparatus
11/21/2007	CN101075613A Semiconductor device with pad switch
11/21/2007	CN101075612A Light emitting device and method for fabricating the same
11/21/2007	CN101075611A 主动阵列装置 Active array device
11/21/2007	CN101075609A Structure and method for packing LED chip
11/21/2007	CN101075607A Surge protector for containing packed semiconductor
11/21/2007	CN101075606A Power semiconductor module
11/21/2007	CN101075602A Semiconductor device and method for cutting electric fuse
11/21/2007	CN101075601A Method for improving device lamination inside semiconductor plastic packer
11/21/2007	CN101075600A Method against device lamination inside semiconductor plastic packer

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