Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2007
11/27/2007US7301771 Heat-receiving apparatus and electronic equipment
11/27/2007US7301769 Fan holder
11/27/2007US7301748 Universal energy conditioning interposer with circuit architecture
11/27/2007US7301244 Semiconductor device
11/27/2007US7301243 High-reliable semiconductor device using hermetic sealing of electrodes
11/27/2007US7301242 Programmable system in package
11/27/2007US7301241 Semiconductor device for preventing defective filling of interconnection and cracking of insulating film
11/27/2007US7301240 Semiconductor device
11/27/2007US7301239 Wiring structure to minimize stress induced void formation
11/27/2007US7301238 Structure and method of forming an enlarged head on a plug to eliminate the enclosure requirement
11/27/2007US7301237 Semiconductor device
11/27/2007US7301236 Increasing electromigration lifetime and current density in IC using vertically upwardly extending dummy via
11/27/2007US7301235 Semiconductor device module with flip chip devices on a common lead frame
11/27/2007US7301234 Stack type semiconductor package module utilizing solder coated stacking protrusions and method for manufacturing the same
11/27/2007US7301233 Semiconductor chip package with thermoelectric cooler
11/27/2007US7301232 Integrated circuit package with carbon nanotube array heat conductor
11/27/2007US7301231 Reinforced bond pad for a semiconductor device
11/27/2007US7301230 Circuit board with a thin-film layer configured to accommodate a passive element
11/27/2007US7301229 Electrostatic discharge (ESD) protection for integrated circuit packages
11/27/2007US7301228 Semiconductor device, method for manufacturing same and thin plate interconnect line member
11/27/2007US7301227 Package lid or heat spreader for microprocessor packages
11/27/2007US7301226 Conductor substrate, semiconductor device and production method thereof
11/27/2007US7301225 Multi-row lead frame
11/27/2007US7301224 Surface acoustic wave device and manufacturing method of the same
11/27/2007US7301223 High temperature electronic devices
11/27/2007US7301222 Apparatus for forming a pre-applied underfill adhesive layer for semiconductor wafer level chip-scale packages
11/27/2007US7301218 Parallel capacitor of semiconductor device
11/27/2007US7301216 Fuse structure
11/27/2007US7301199 Nanoscale wires and related devices
11/27/2007US7301190 Structures and methods to enhance copper metallization
11/27/2007US7301178 Pressed-contact type semiconductor device
11/27/2007US7301176 Semiconductor light emitting device and fabrication method thereof
11/27/2007US7301169 Semiconductor substrate and semiconductor device fabrication method
11/27/2007US7301108 Multi-layered interconnect structure using liquid crystalline polymer dielectric
11/27/2007US7301107 Semiconductor device having reduced intra-level and inter-level capacitance
11/27/2007US7300897 porcelain composition comprising oxides of calcium, magnesium, silicon, bismuth, lithium, and optionally co-sintered with silver, gold and copper, having a low dielectric constant and loss for high frequency use in semiconductors or printed circuits
11/27/2007US7300888 Methods of manufacturing integrated circuit devices having an encapsulated insulation layer
11/27/2007US7300871 Method of doping a conductive layer near a via
11/27/2007US7300864 Method for forming solder bump structure
11/27/2007US7300863 Circuit chip connector and method of connecting a circuit chip
11/27/2007US7300860 Integrated circuit with metal layer having carbon nanotubes and methods of making same
11/27/2007US7300853 Thin layer semi-conductor structure comprising a heat distribution layer
11/27/2007US7300825 Customizing back end of the line interconnects
11/27/2007US7300822 Low warpage flip chip package solution-channel heat spreader
11/27/2007US7300819 Semiconductor device, method for mounting the same, and method for repairing the same
11/27/2007US7300816 Method of sensor packaging
11/27/2007US7300807 Structure and method for providing precision passive elements
11/27/2007US7300607 Conductive sintered compact for fixing electrodes in electronic device envelope
11/27/2007US7300217 Optical semiconductor device, optical connector and electronic equipment
11/27/2007US7299973 Semiconductor device and an information management system therefor
11/27/2007US7299967 Method for manufacturing plate stacks, particularly coolers or cooler elements made up of plate stacks
11/27/2007US7299861 Water-cooling heat exchanger and heat-dissipating device for the same
11/27/2007US7299647 Spray cooling system for transverse thin-film evaporative spray cooling
11/27/2007US7299639 Thermoelectric module
11/27/2007US7299545 Alignment method and mounting method using the alignment method
11/27/2007US7299544 Apparatus for separating cull of semiconductor package molding system
11/27/2007US7299537 Method of making an integrated inductor
11/22/2007WO2007134317A1 Downhill wire bonding for semiconductor device
11/22/2007WO2007133350A1 Substrate for a microelectronic package and method of fabricating thereof
11/22/2007WO2007132879A1 Semiconductor device, semiconductor device manufacturing method and semiconductor manufacturing apparatus
11/22/2007WO2007132827A1 Sealing agent for cof mounting and semiconductor component sealed by using the same
11/22/2007WO2007132771A1 Ceramic powder and method of using the same
11/22/2007WO2007132770A1 Ceramic powder and method of using the same
11/22/2007WO2007132683A2 Power semiconductor module
11/22/2007WO2007132560A1 High frequency device module and method for manufacturing the same
11/22/2007WO2007132423A2 Assembly, chip and method of operating
11/22/2007WO2007131967A1 Integrated low-loss capacitor-arrray structure
11/22/2007WO2007131823A1 Chip housing with reduced coupled-in vibration
11/22/2007WO2007131334A1 Multi-pixel light emitting module
11/22/2007WO2007101282A3 Composite material and method for production thereof
11/22/2007WO2007099575A3 Use of non-evaporable getter alloys for the sorption of hydrogen in vacuum and in inert gases
11/22/2007WO2007091210A3 Circuit arrangement, data processing device comprising such circuit arrangement as well as method for identifying an attack on such circuit arrangement
11/22/2007WO2007084572A3 Thermal interconnect and interface systems, methods of production and uses thereof
11/22/2007WO2007062310A3 Shaped structural member, method of producing the member and a portable communication device including the member
11/22/2007WO2007050101A3 Packaging systems incorporating thin film liquid crystal polymer (lcp) and methods of manufacture
11/22/2007WO2006121487A3 Circuit module with thermal casing systems and methods
11/22/2007WO2006105015A3 Flip chip interconnection having narrow interconnection sites on the substrate
11/22/2007WO2006099102A3 Power semiconductor package
11/22/2007WO2006076210A3 Systems and methods for producing white-light light emitting diodes
11/22/2007WO2006065986A3 Aerodynamic jetting of aerosolized fluids for fabrication of passive structures
11/22/2007WO2006039236A3 Gap-change sensing through capacitive techniques
11/22/2007WO2005038989A3 Fretting and whisker resistant coating system and method
11/22/2007US20070270555 Silicone composition which can be crosslinked to give an adhesive gel
11/22/2007US20070270536 Conductive adhesive composition
11/22/2007US20070269997 Electronic components with plurality of contoured microelectronic spring contacts
11/22/2007US20070269909 Method for processing an integrated circuit
11/22/2007US20070268677 System and method for processor power delivery and thermal management
11/22/2007US20070267759 Semiconductor device with a distributed plating pattern
11/22/2007US20070267758 Semiconductor package
11/22/2007US20070267757 Semiconductor device
11/22/2007US20070267756 Integrated circuit package and multi-layer lead frame utilized
11/22/2007US20070267755 Integrated circuit having pads and input/output (i/o) cells
11/22/2007US20070267754 Microfeature workpieces and methods for forming interconnects in microfeature workpieces
11/22/2007US20070267753 Substantially l-shaped silicide for contact and related method
11/22/2007US20070267752 Semiconductor Device having Pad Structure for Preventing and Buffering Stress of Silicon Nitride Film
11/22/2007US20070267751 Structure and method for creating reliable via contacts for interconnect applications
11/22/2007US20070267750 Semiconductor device including interconnect layer made of copper
11/22/2007US20070267749 Metallization layer for a power semiconductor device
11/22/2007US20070267748 Integrated circuit having pads and input/output (i/o) cells
11/22/2007US20070267746 Dual-sided chip attached modules
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