Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2007
11/28/2007CN200983364Y A testing structure for improving calibration precision in integrated circuit making
11/28/2007CN200983363Y Led
11/28/2007CN200983362Y A BGA chip encapsulation device
11/28/2007CN200983361Y Package device for FPGA
11/28/2007CN200983360Y Integrated circuit adaptor
11/28/2007CN200983359Y Novel chip heat radiation device
11/28/2007CN101080816A Flip chip contact(PCC) power package
11/28/2007CN101080813A Multilayer wiring structure and method for forming same
11/28/2007CN101080800A Semiconductor package having non-ceramic based window frame
11/28/2007CN101080160A Cooling apparatus, cooled electronic module and methods of fabrication thereof
11/28/2007CN101080159A A wind channel heat radiator
11/28/2007CN101080158A Heat radiator
11/28/2007CN101080157A Heat radiator
11/28/2007CN101080156A Heat radiator
11/28/2007CN101080150A Buckler and heat radiation device using this buckler
11/28/2007CN101079467A Covered devices in a semiconductor package
11/28/2007CN101079461A Lighting device
11/28/2007CN101079460A Lighting device
11/28/2007CN101079459A Lighting device
11/28/2007CN101079458A Lighting device
11/28/2007CN101079441A Semiconductor device and its forming method
11/28/2007CN101079440A 介电层与薄膜晶体管 Dielectric layer and a thin film transistor
11/28/2007CN101079439A Wiring board, electronic device, electrooptical device, and electronic apparatus
11/28/2007CN101079438A Single-mask phase change memory element
11/28/2007CN101079436A Solid-state imaging device, method of manufacturing the same and camera module
11/28/2007CN101079431A Semiconductor device and active matrix display device
11/28/2007CN101079430A Semiconductor device and method of manufacturing same
11/28/2007CN101079429A Thin film transistor array substrate and method for fabricating the same
11/28/2007CN101079421A Semiconductor device and method of manufacturing the same
11/28/2007CN101079420A Semiconductor device
11/28/2007CN101079419A Method and structure for reducing contact resistance
11/28/2007CN101079418A Electrostatic discharge circuit and method for reducing input capacitance of semiconductor chip including same
11/28/2007CN101079415A LED encapsulation structure
11/28/2007CN101079413A Semiconductor device
11/28/2007CN101079412A System in package module
11/28/2007CN101079411A Electronic encapsulation part resisting electromagnetic interference
11/28/2007CN101079410A Semiconductor device and method for manufacturing same
11/28/2007CN101079409A Interconnection structure and its making method
11/28/2007CN101079408A Double-inlay structure and its making method
11/28/2007CN101079407A Wiring board, method for manufacturing the same, and semiconductor device
11/28/2007CN101079406A Semiconductor device
11/28/2007CN101079405A 半导体芯片结构 Semiconductor chip structures
11/28/2007CN101079404A 半导体器件 Semiconductor devices
11/28/2007CN101079403A Heat sink
11/28/2007CN101079402A Electronic encapsulation component
11/28/2007CN101079401A Electronic encapsulation part
11/28/2007CN101079400A Thermal tube electronic chip radiator
11/28/2007CN101079399A Electronic apparatus
11/28/2007CN101079398A Optoelectronic device chip and method for making same
11/28/2007CN101079394A Semiconductor structure and method of forming the same
11/28/2007CN101079387A Device package and methods for the fabrication and testing thereof
11/28/2007CN101079385A Device and a method and mask for forming a device
11/28/2007CN101079078A Method of designing semiconductor device
11/28/2007CN101078508A Super large power LED combined lamp wick
11/28/2007CN101078473A Large power LED road lamp
11/28/2007CN101078472A High power LED road lamp
11/28/2007CN101077967A Epoxy resin composition for enveloping semiconductor and semiconductor device
11/28/2007CN100352319C Circuit board with pin made of resin
11/28/2007CN100352317C Electronic component mounting board, method of manufacturing the same, electronic component module, and communications equipment
11/28/2007CN100352073C Thermoelectric element
11/28/2007CN100352071C Light-emitting diode lamp
11/28/2007CN100352069C LED illumination light source
11/28/2007CN100352057C Packaging base plate of improving thermolysis structure, and electronic device
11/28/2007CN100352055C Method of preventing electrostatic discharging of drive
11/28/2007CN100352054C Polysilicon boundary step resetter
11/28/2007CN100352053C Semiconductor device
11/28/2007CN100352052C Internal on-line structure using diagonal layout
11/28/2007CN100352051C External power supply ring with multiple slender tapes for decreasing voltage drop of integrated circuit
11/28/2007CN100352050C Semiconductor with multiple rows of bond pads
11/28/2007CN100352049C Optimized electronic package
11/28/2007CN100352048C Semiconductor device and method of manufacturing the same
11/28/2007CN100352047C Unmolded package for semiconductor device
11/28/2007CN100352046C Split integrated heat pipe radiator for heating electronic component
11/28/2007CN100352045C Cu-W thin film coating integrated composite heat sink
11/28/2007CN100352044C Heat sink for semiconductor components or similar devices, method for producing the same and tool for carrying out said method
11/28/2007CN100352043C Flat power semiconductor device, its radiator pressure mounting method and apparatus
11/28/2007CN100352042C Semiconductor device and package with high heat radiation effect
11/28/2007CN100352041C Method and apparatus for controlling die attach fillet height to reduce die shear stress
11/28/2007CN100352036C Semiconductor device and its making method
11/28/2007CN100352035C Boron-doped titanium nitride layer for high aspect artio semiconductor devices
11/28/2007CN100352028C Semiconductor device and its mfg.method
11/28/2007CN100352027C Method for manufacturing an electronic circuit device and electronic circuit device
11/28/2007CN100352023C Semiconductor device and method and apparatus for making same
11/28/2007CN100352019C Semiconductor module, electronic device and electronic equipment, and method for manufacturing semiconductor module
11/28/2007CN100352009C CMOS process with an integrated, high performance, silicide agglomeration fuse
11/28/2007CN100351999C Semiconductor device and manufacturing process therefore
11/28/2007CN100351995C Method for producing and testing a corrosion-resistant channel in a silicon device
11/28/2007CN100351863C Method for making a microcircuit card
11/28/2007CN100351841C Semiconductor IC with inclined wiring and its wiring method and wiring diagram designing program
11/28/2007CN100351692C Pattern forming method and method for producing liquid crystal display using the method
11/28/2007CN100351602C Foil sheet groove liquid sucking core of heat pipe radiator
11/28/2007CN100351077C 改进的热界面材料 Improved thermal interface material
11/28/2007CN100351075C Thermal interface materials
11/27/2007US7302247 Spread spectrum isolator
11/27/2007US7302125 Optical device and optical apparatus
11/27/2007US7301781 Semiconductor module
11/27/2007US7301779 Electronic chip and electronic chip assembly
11/27/2007US7301774 Universal locking device for heat sink
11/27/2007US7301773 Semi-compliant joining mechanism for semiconductor cooling applications
11/27/2007US7301772 Three dimensional packaging and cooling of mixed signal, mixed power density electronic modules
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