Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2007
11/29/2007US20070273049 Interconnect structure and formation for package stacking of molded plastic area array package
11/29/2007US20070273048 Shapes-based migration of aluminum designs to copper damascene
11/29/2007US20070273047 Printed wiring board and manufacturing method thereof
11/29/2007US20070273046 Semiconductor component with connecting elements and method for producing the same
11/29/2007US20070273045 Printed wiring board, method for forming the printed wiring board, and board interconnection structure
11/29/2007US20070273044 Adhesion enhancement for metal/dielectric interface
11/29/2007US20070273043 Wire Bonding Structure and Method that Eliminates Special Wire Bondable Finish and Reduces Bonding Pitch on Substrates
11/29/2007US20070273042 Copper-filled trench contact for transistor performance improvement
11/29/2007US20070273041 Top layers of metal for high performance IC's
11/29/2007US20070273040 Top layers of metal for high performance IC's
11/29/2007US20070273039 Top layers of metal for high performance IC's
11/29/2007US20070273038 Top layers of metal for high performance IC's
11/29/2007US20070273037 Top layers of metal for high performance IC's
11/29/2007US20070273036 Top layers of metal for high performance IC's
11/29/2007US20070273035 Top layers of metal for high performance IC's
11/29/2007US20070273034 Top layers of metal for high performance IC's
11/29/2007US20070273033 Top layers of metal for high performance IC's
11/29/2007US20070273032 Top layers of metal for high performance IC's
11/29/2007US20070273031 Method of wire bonding over active area of a semiconductor circuit
11/29/2007US20070273030 Semiconductor device having metal lines with slits
11/29/2007US20070273029 Photo mask set for forming multi-layered interconnection lines and semiconductor device fabricated using the same
11/29/2007US20070273028 Semiconductor integrated circuit device comprising different level interconnection layers connected by conductor layers including conductor layer for redundancy
11/29/2007US20070273027 Method of forming dual damascene pattern
11/29/2007US20070273026 Semiconductor package substrate
11/29/2007US20070273025 Device Comprising Circuit Elements Connected By Bonding Bump Structure
11/29/2007US20070273024 Cooling System with a Bubble Pump
11/29/2007US20070273023 Integrated circuit package having exposed thermally conducting body
11/29/2007US20070273022 Semiconductor device
11/29/2007US20070273021 Semiconductor package
11/29/2007US20070273020 Semiconductor device
11/29/2007US20070273019 Semiconductor package, chip carrier structure thereof, and method for fabricating the chip carrier
11/29/2007US20070273018 Semiconductor apparatus and method for manufacturing the same
11/29/2007US20070273017 Quad flat no-lead chip carrier with stand-off
11/29/2007US20070273016 Double sided semiconduction device with edge contact and package therefor
11/29/2007US20070273015 Semiconductor device
11/29/2007US20070273014 System in package module
11/29/2007US20070273013 Packaging for Micro Electro-Mechanical Systems and Methods of Fabricating Thereof
11/29/2007US20070273012 Semiconductor device
11/29/2007US20070273011 Method for fabricating a module having an electrical contact-connection
11/29/2007US20070273010 Design and Method for Attaching a Die to a Leadframe in a Semiconductor Device
11/29/2007US20070273009 Highly efficient both-side-cooled discrete power package, especially basic element for innovative power modules
11/29/2007US20070273008 Multilayer Dielectric Substrate and Semiconductor Package
11/29/2007US20070272999 Voltage Sustaining Layer with Opposite-Doped Islands for Semiconductor Power Devices
11/29/2007US20070272991 Method And Device For Alternately Contacting Two Wafers
11/29/2007US20070272983 Active device array substrate
11/29/2007US20070272940 Semiconductor device with a light emitting semiconductor die
11/29/2007US20070272924 Integrated circuit (ic) testing device with conduction interface
11/29/2007US20070272923 Charge pump with reduced turn-off time and phase locked loop including the same
11/29/2007US20070272529 Integrated Circuit With Analog Connection Matrix
11/29/2007US20070272441 Palladium-Plated Lead Finishing Structure For Semiconductor Part And Method Of Producing Semiconductor Device
11/29/2007US20070272391 Heat dissipation device
11/29/2007US20070272390 Heat Conduction Device
11/29/2007US20070271782 Electrical Multilayer Component with Solder Contact
11/29/2007US20070271781 High density integrated circuit apparatus, test probe and methods of use thereof
11/29/2007DE4434846B4 Keramisches Formteil mit einem Prägemuster, Verfahren zu dessen Herstellung sowie seine Verwendung Ceramic molding with an embossing pattern, to processes for its preparation and its use
11/29/2007DE202007012779U1 Kühlmodul Cooling module
11/29/2007DE10393851B4 Halbleiterelement-Wärmeableitungselement sowie Halbleitervorrichtung, in der dieses eingesetzt wird und Verfahren zu dessen Herstellung Semiconductor element heat dissipating element and the semiconductor device in which it is used and process for its preparation
11/29/2007DE10353676B4 Verfahren zur Herstellung eines ultradünnen Moduls mit rauen Kontakten A process for producing an ultra-thin module with rough contacts
11/29/2007DE10303455B4 Leiterrahmenband und Verfahren zum Herstellen einer Mehrzahl von Leiterrahmen-basierten Leuchtdiodenbauelementen Lead frame strip and method of manufacturing a plurality of lead-frame-based light-emitting devices
11/29/2007DE102007015728A1 Ansteuerschaltung Drive circuit
11/29/2007DE102006028721B3 Semiconductor protection structure e.g. electrostatic discharge protection structure, has drain regions of conductive type formed within area of body and connected with one another, where each region has separate transition
11/29/2007DE102006024495A1 Semiconductor arrangement for isolating e.g. insulated gate bipolar transistor, has conducting structure with semiconductor material, where conducting structure conductively connects one region with other region
11/29/2007DE102006024460A1 Motor vehicle radar system`s circuit structure, has coupling/decoupling device for coupling test resonator structure with circuit section having negative resistance during testing and for decoupling structure from section after testing
11/29/2007DE102006024147B3 Elektronisches Modul mit Halbleiterbauteilgehäuse und einem Halbleiterchip und Verfahren zur Herstellung desselben An electronic module with the semiconductor device housing and a semiconductor chip and method of manufacturing the same
11/29/2007DE102005043808B4 Außenkontaktmaterial für Außenkontakte eines Halbleiterbauteils und Verfahren zur Herstellung des Außenkontaktmaterials External contact material for external contacts of a semiconductor device and method of manufacturing the outer contact material
11/29/2007DE10122363B4 Halbleitermodul Semiconductor module
11/29/2007DE10110005B4 Elektronisches Bauteil mit einem Halbleiterchip und Verfahren zu seiner Herstellung Electronic component having a semiconductor chip and method for its preparation
11/29/2007DE10065965B4 Fertigungsverfahren für einen Stromsensor der Mikrosystemtechnik Manufacturing method for a current sensor microsystem technology
11/29/2007DE10005536B4 Sensor mit eingebauten Schaltungen Sensor with integrated circuits
11/28/2007EP1860697A2 Semiconductor device
11/28/2007EP1860696A1 Semiconductor module
11/28/2007EP1860695A2 System and method of jet impingement cooling with extended surfaces
11/28/2007EP1860694A1 Semiconductor device, semiconductor device manufacturing method and cover frame
11/28/2007EP1860691A1 Electronic circuit and method for manufacturing same
11/28/2007EP1860394A1 Domed heat exchanger (porcupine)
11/28/2007EP1860170A1 Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device
11/28/2007EP1860165A1 Organic coated metallic substrate with enhanced heat transfer properties and method of production thereof
11/28/2007EP1859483A1 Magnetic self-assembly for integrated circuit packages
11/28/2007EP1859482A1 Thin film getter protection
11/28/2007EP1859475A2 Method of fabrication of ai/ge bonding in a wafer packaging environment and a product produced therefrom
11/28/2007EP1859259A1 Device, in particular, for measuring humidity, comprising corrosion-protected connections
11/28/2007EP1858983A1 Curable silicone composition and electronic device produced therefrom
11/28/2007EP1858950A1 Thermosetting composition for solder resist and cured product thereof
11/28/2007EP1779052B1 Heat transfer assembly
11/28/2007EP1741131B1 Level realignment following an epitaxy step
11/28/2007EP1682841B1 Flow distributing unit and cooling unit
11/28/2007EP1488458B9 Automatically adjusting serial connections of thick and thin layers and method for the production thereof
11/28/2007EP1442081B1 Curable organopolysiloxane composition, use of the cured product of the composition, and semiconductor device
11/28/2007EP1352424B1 Method for mounting a semiconductor component in a housing
11/28/2007EP1342294B1 I-channel surface-mount connector
11/28/2007EP1021835B1 Method of manufacturing a bipolar power transistor
11/28/2007EP0922300B1 Process for producing semiconductor device provided with low melting point metal bumps
11/28/2007CN200983740Y Water cooling heat radiator of integrated heating electronic part
11/28/2007CN200983739Y Array radiation flow micro heat exchanger
11/28/2007CN200983738Y Improved radiator structure
11/28/2007CN200983735Y 散热器 Heat sink
11/28/2007CN200983729Y Fixing structure of heat radiation device
11/28/2007CN200983549Y A plate large-capacity part thermal tube heat radiator for engine rectifier
11/28/2007CN200983369Y Heat radiation machine of ultra-high brightness LED
11/28/2007CN200983368Y High heat radiation package base plate of high brightness LED
1 ... 998 999 1000 1001 1002 1003 1004 1005 1006 1007 1008 1009 1010 1011 1012 1013 1014 1015 1016 1017 1018 ... 2262