Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2007
12/04/2007US7304827 ESD protection circuits for mixed-voltage buffers
12/04/2007US7304485 Analysis of the quality of contacts and vias in multi-metal fabrication processes of semiconductor devices, method and test chip architecture
12/04/2007US7304418 Light source apparatus with light-emitting chip which generates light and heat
12/04/2007US7304417 Package for electronic device, base substrate, electronic device and fabrication method thereof
12/04/2007US7304395 Semiconductor chip package
12/04/2007US7304394 Semiconductor device and method for manufacturing same
12/04/2007US7304393 System and method for coupling internal circuitry of an integrated circuit to the integrated circuit's package pins
12/04/2007US7304392 Die for forming an optical element, and production method as well as regeneration method of the same
12/04/2007US7304391 Modified chip attach process and apparatus
12/04/2007US7304390 Anisotropic conductive sheet and manufacture thereof
12/04/2007US7304389 Semiconductor device and supporting plate
12/04/2007US7304388 Method and apparatus for an improved air gap interconnect structure
12/04/2007US7304387 Semiconductor integrated circuit device
12/04/2007US7304386 Semiconductor device having a multilayer wiring structure
12/04/2007US7304385 Semiconductor chip capable of implementing wire bonding over active circuits
12/04/2007US7304384 Semiconductor device with a barrier film which contains manganese
12/04/2007US7304383 TFT substrate for liquid crystal display apparatus and method of manufacturing the same
12/04/2007US7304382 Managed memory component
12/04/2007US7304381 Package and method for attaching an integrated heat spreader
12/04/2007US7304380 Integrated circuit cooling and insulating device and method
12/04/2007US7304379 Semiconductor device with pipe for passing refrigerant liquid
12/04/2007US7304378 Aluminum/ceramic bonding substrate
12/04/2007US7304377 Package substrate, integrated circuit apparatus, substrate unit, surface acoustic wave apparatus, and circuit device
12/04/2007US7304376 Microelectronic assemblies with springs
12/04/2007US7304375 Castellation wafer level packaging of integrated circuit chips
12/04/2007US7304374 Wireless coupling of semiconductor dies
12/04/2007US7304373 Power distribution within a folded flex package method and apparatus
12/04/2007US7304372 Semiconductor package
12/04/2007US7304371 Lead frame having a lead with a non-uniform width
12/04/2007US7304370 Electronic device having wiring substrate and lead frame
12/04/2007US7304369 Integral charge storage basement and wideband embedded decoupling structure for integrated circuit
12/04/2007US7304365 Semiconductor device and method of producing the same
12/04/2007US7304364 Embossed mask lithography
12/04/2007US7304363 Interacting current spreader and junction extender to increase the voltage blocked in the off state of a high power semiconductor device
12/04/2007US7304362 Molded integrated circuit package with exposed active area
12/04/2007US7304354 Buried guard ring and radiation hardened isolation structures and fabrication methods
12/04/2007US7304351 Active matrix substrate
12/04/2007US7304349 Power semiconductor component with increased robustness
12/04/2007US7304326 Light emitting device and sealing material
12/04/2007US7304323 Test mask structure
12/04/2007US7304249 Bonding pads for a printed circuit board
12/04/2007US7304247 Circuit board with at least one electronic component
12/04/2007US7304120 Preparing a curable compound, or adduct, or epoxy resins of anthrahydroquinone and epichlorohydrin; cured product is used for semiconductor encapsulation; solid, low melt viscosity, flame retardance, halogen-free; mechanical strength, heat and moisture resistance
12/04/2007US7304102 Process for making encapsulant for opto-electronic devices
12/04/2007US7303987 Contact structure of a wires and method manufacturing the same, and thin film transistor substrate including the contact structure and method manufacturing the same
12/04/2007US7303986 Semiconductor device and a method of manufacturing the same
12/04/2007US7303985 Zeolite-carbon doped oxide composite low k dielectric
12/04/2007US7303978 Board for mounting BGA semiconductor chip thereon, semiconductor device, and methods of fabricating such board and semiconductor device
12/04/2007US7303944 Microelectronic devices having underfill materials with improved fluxing agents
12/04/2007US7303942 Semiconductor device and method for manufacturing the same
12/04/2007US7303940 Semiconductor component having at least one organic semiconductor layer and method for fabricating the same
12/04/2007US7303932 Support body for semiconductor element, method for manufacturing the same and semiconductor device
12/04/2007US7303928 Process monitor and system for producing semiconductor
12/04/2007US7303698 Thick film conductor case compositions for LTCC tape
12/04/2007US7303645 Method and system for hermetically sealing packages for optics
12/04/2007US7303639 Method for producing Z-axis interconnection assembly of printed wiring board elements
12/04/2007US7303406 Device for controlling a vehicle
12/04/2007US7303400 Package of a semiconductor device with a flexible wiring substrate and method for the same
12/04/2007US7303244 Method for the printing of homogeneous electronic material with a multi-ejector print head
12/04/2007US7303243 Pattern drawing apparatus and pattern drawing method for forming patterns, that have mirror image relationship to each other with respect to a substrate, on both sides of the substrate, and test apparatus for use in the pattern drawing apparatus
12/04/2007US7303113 Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers
12/04/2007US7303109 Stud bumping apparatus
12/04/2007US7302998 Normal-flow heat exchanger
12/04/2007US7302757 Micro-bumps to enhance LGA interconnections
12/04/2007US7302756 Bond finger on via substrate, process of making same, package made thereby, and method of assembling same
11/2007
11/29/2007WO2007137221A2 Dual side cooling integrated transistor module and methods of manufacture
11/29/2007WO2007137049A2 Double-sided integrated circuit chips
11/29/2007WO2007136941A2 Flip chip mlp with folded heat sink
11/29/2007WO2007136932A2 Integrated circuit having pads and input/output (i/o) cells
11/29/2007WO2007136928A2 Low profile managed memory component
11/29/2007WO2007136927A2 High density memory card system and method
11/29/2007WO2007136917A2 Managed memory component
11/29/2007WO2007136651A2 Semiconductor device with a distributed plating pattern
11/29/2007WO2007135906A1 Method for dry-etching interlayer insulating film
11/29/2007WO2007135763A1 Semiconductor device having low dielectric insulating film and manufacturing method of the same
11/29/2007WO2007135620A1 Method of increasing the quality factor of an inductor in a semiconductor device
11/29/2007WO2007135148A1 Electrical device with screen
11/29/2007WO2007134905A1 Symmetrical mim capacitor design
11/29/2007WO2007134904A1 Adjustable on-chip sub-capacitor design
11/29/2007WO2007084982A3 Dual-damascene process to fabricate thick wire structure
11/29/2007WO2007082199A3 Structure and method for making high density mosfet circuits with different height contact lines
11/29/2007WO2006110266A3 Method and system for fabricating semiconductor components with through wire interconnects
11/29/2007WO2005109501A3 ESD PROTECTION STRUCTURE WITH SiGe BJT DEVICES
11/29/2007US20070275650 Quiescent computer casing
11/29/2007US20070275572 Connector for making electrical contact at semiconductor scales
11/29/2007US20070275568 UV stabilizer, Beige pigment, anti-block, low density polyethylene, polypropylene, and anti-slip butylene-ethylene-styrene block terpolymer; KRATON.RTM. MD6649; low in cost and helps prevent water from penetrating the primary roofing material; anti-skid surface upon which an individual may safely walk
11/29/2007US20070275565 Full removal of dual damascene metal level
11/29/2007US20070275554 Semiconductor device with interconnection structure for reducing stress migration
11/29/2007US20070275506 Semiconductor device and a method of manufacturing the same
11/29/2007US20070275488 Method for Manufacturing Backside-Illuminated Optical Sensor
11/29/2007US20070275260 Palladium-containing particles, method and apparatus of manufacturing palladium-containing devices made therefrom
11/29/2007US20070274357 Methods And Devices Comprising Soluble Conjugated Polymers
11/29/2007US20070274060 Wiring board, semiconductor device, and method for manufacturing wiring board
11/29/2007US20070274058 Integrated Circuit, a Method and an Assembly for Manufacturing the Integrated Circuit, and a Mobile Phone Having the Integrated Circuit
11/29/2007US20070274055 Surface Mountable Device
11/29/2007US20070274047 Ai/Ain Joint Material, Base Plate For Power Module, Power Module, And Manufacturing Method Of Ai/Ain Joint Material
11/29/2007US20070274044 Cooling Device For an Electronic Component, Especially for a Microprocessor
11/29/2007US20070274027 Housing for High Performance Components
11/29/2007US20070273051 Semiconductor elements encapsulated in a cured product of an polysiloxane with Si-bonded alkenyl and aryl groups, a hydrogenalkylpolysiloxane, and a di- to octasiloxane with alkenyl and aryl groups; superior optical transmittance exhibiting little heat-induced yellowing
11/29/2007US20070273050 Semiconductor Device And Method Of Manufacturing Thereof
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