Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2007
12/05/2007CN200987254Y Electronic device and heat radiating device
12/05/2007CN200987252Y Pipe-type radiator
12/05/2007CN200987251Y Buckle type radiating fin
12/05/2007CN200987250Y Buckle type radiating fin
12/05/2007CN200987038Y Laser diode package structure
12/05/2007CN200986921Y Overpressure resistant layer structure and SOI power device with dual-medium buried layer
12/05/2007CN200986920Y Dual-medium SOI overpressure resistant structure with windows and SOI power device thereof
12/05/2007CN200986917Y Open type semiconductor package structure
12/05/2007CN101084622A A power device and a method for controlling a power device
12/05/2007CN101084578A 半导体开关模块 Semiconductor switch modules
12/05/2007CN101084321A Iron-nickel alloy strip for the manufacture of support grids for integrated circuits
12/05/2007CN101084287A Working fluid for heat transfer
12/05/2007CN101084250A Modified phenolic resin, epoxy resin composition containing the same, and prepreg containing the composition
12/05/2007CN101083894A Electronic device and heat radiating module
12/05/2007CN101083893A Heat radiator
12/05/2007CN101083892A Heat radiator
12/05/2007CN101083891A Heat radiating module
12/05/2007CN101083890A Heat radiating device
12/05/2007CN101083889A Heat radiating device
12/05/2007CN101083888A Heat radiating device
12/05/2007CN101083885A Fastener and heat radiating device assembly using the same
12/05/2007CN101083384A Electronic component, laser device, optical writing device and image forming apparatus
12/05/2007CN101083278A Pressure resistant layer structure having dual-medium buried layer and SOI power device using the same
12/05/2007CN101083277A 显示装置及其制造方法 Display device and manufacturing method
12/05/2007CN101083276A Wiring method for detection wire of organic electroluminescent display device
12/05/2007CN101083272A Package structure and method for image sensor
12/05/2007CN101083270A Array substrate and display panel having the same
12/05/2007CN101083268A Metal line layout in a memory cell
12/05/2007CN101083260A Semiconductor chip having tube core section
12/05/2007CN101083258A 半导体器件 Semiconductor devices
12/05/2007CN101083257A 半导体装置 Semiconductor device
12/05/2007CN101083256A Semiconductor device
12/05/2007CN101083255A Device package and methods for the fabrication and testing thereof
12/05/2007CN101083254A Optically coupled semiconductor device and electronic device
12/05/2007CN101083251A Semiconductor device
12/05/2007CN101083250A Semiconductor device cutting fusing wire and method
12/05/2007CN101083249A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
12/05/2007CN101083248A Interconnection structure design for low rc delay and leakage
12/05/2007CN101083247A Board strip and method of manufacturing semiconductor package using the same
12/05/2007CN101083246A Electric connection distributing structure for passive element
12/05/2007CN101083245A Semiconductor package structure for integrated passive element
12/05/2007CN101083244A Semiconductor package, manufacturing method of semiconductor package and manufacturing method of stacked type semiconductor device
12/05/2007CN101083243A Interconnect structure and formation for package stacking of molded plastic area array package
12/05/2007CN101083242A Electric element and method for sealing electric element
12/05/2007CN101083241A Semiconductor device and its manufacturing method
12/05/2007CN101083240A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
12/05/2007CN101083239A Copper bonding compatible bond pad structure and method
12/05/2007CN101083238A Microelectronic element with elastic conductive projection and method of manufacture
12/05/2007CN101083237A Packed integrated circuit element
12/05/2007CN101083236A Electronic device and method of manufacturing and electronic device
12/05/2007CN101083235A Semiconductor device having high cooling efficiency and method for manufacturing the same
12/05/2007CN101083234A Heat dissipation structure with aligned carbon nanotube arrays and methods for manufacturing and use
12/05/2007CN101083233A Semiconductor device encapsulated with resin composition
12/05/2007CN101083232A Rfid tag and method of manufacturing the same
12/05/2007CN101083231A Leadframe ic packages having top and bottom integrated heat spreaders
12/05/2007CN101083226A Semiconductor device having a contact structure with a contact spacer and method of fabricating the same
12/05/2007CN101083224A Method of forming line of semiconductor device
12/05/2007CN101083220A Substrate, substrate inspecting method and methods of manufacturing an element and a substrate
12/05/2007CN101083215A Electronic component package and manufacturing method thereof
12/05/2007CN101083213A Method and structure for preparing printed circuit board for light emitting diode
12/05/2007CN101082964A RFID tag and method of manufacturing the same
12/05/2007CN101082963A RFID tag and method of manufacturing the same
12/05/2007CN101082962A RFID tag and method of manufacturing the same
12/05/2007CN101082961A RFID tag and method of manufacturing the same
12/05/2007CN101082749A 液晶显示装置及其制造方法 A liquid crystal display device and manufacturing method
12/05/2007CN101082414A Luminous diode lighting appararatus with high power and high heat sinking efficiency
12/05/2007CN101081910A Sealing material, application and production process
12/05/2007CN101081909A Sealing material, application and production process
12/05/2007CN100353817C Pin-free socket compatible with optical-electrical interconnects
12/05/2007CN100353623C Optical device and method for fabricating the same
12/05/2007CN100353561C Metal-over-metal devices and the method for manufacturing same
12/05/2007CN100353552C Device and method for providing shielding in radio frequency integrated circuits to reduce noise coupling
12/05/2007CN100353547C Multi-chip circuit module and method for producing the same
12/05/2007CN100353546C Packing semiconductor device
12/05/2007CN100353545C Lower profile package with power supply in package
12/05/2007CN100353544C 功率放大器器件 PA devices
12/05/2007CN100353543C Semiconductor assembly and its mfg.method
12/05/2007CN100353542C Integrated circuit, its forming method, and electronic assembly
12/05/2007CN100353541C Mold type semiconductor device and method for manufacturing the same
12/05/2007CN100353540C Contact structure of semiconductor device and method of manufacturing the same
12/05/2007CN100353539C LSI packaging and assembly method thereof
12/05/2007CN100353538C Non-lead semiconductor packaging structure with inverse bonding chip and producing method
12/05/2007CN100353537C Heat elimination / cooling set of ultrasonic spray
12/05/2007CN100353536C Semicoductor radiating substrate and production method therefor and package
12/05/2007CN100353535C Method for fabricating radiator and fastener integratedly
12/05/2007CN100353534C Method for making electric-heating radiator and electric-heating radiator thereby
12/05/2007CN100353533C Semiconductor device and its manufacturing method
12/05/2007CN100353532C 半导体装置 Semiconductor device
12/05/2007CN100353531C 半导体器件 Semiconductor devices
12/05/2007CN100353522C Novel device structure having enhanced surface adhesion and failure mode analysis
12/05/2007CN100353514C Method for stimulating defect chip and defect testing
12/05/2007CN100353499C Semiconductor element and its producing method, semiconductor
12/05/2007CN100353494C Improvement for ESD transistor source leaked capacitance
12/05/2007CN100353489C Optical coupler and electronic equipment using same
12/05/2007CN100353135C Unit radiator, its mfg. method and integral radiator constituted therefrom
12/05/2007CN100352858C Uvioresistant epoxy composition and its preparing method and use
12/05/2007CN100352847C Resin composition for encapsulating semiconductor chip and semiconductor device therewith
12/04/2007USRE39932 Semiconductor interconnect formed over an insulation and having moisture resistant material
12/04/2007US7305117 Methods and tangible objects employing machine readable data
12/04/2007US7304842 Apparatuses and methods for cooling electronic devices in computer systems
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