| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 12/11/2007 | US7307775 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
| 12/11/2007 | US7307773 Micro-optoelectromechanical system packages for a light modulator and methods of making the same |
| 12/11/2007 | US7307497 Method for producing a coplanar waveguide system on a substrate, and a component for the transmission of electromagnetic waves fabricated in accordance with such a method |
| 12/11/2007 | US7307475 RF generator with voltage regulator |
| 12/11/2007 | US7307441 Integrated circuit chips and wafers including on-chip test element group circuits, and methods of fabricating and testing same |
| 12/11/2007 | US7307425 Receiver electronics proximate antenna |
| 12/11/2007 | US7307354 Integrated circuit (IC) carrier assembly incorporating an integrated circuit (IC) retainer |
| 12/11/2007 | US7307353 Technique for attaching die to leads |
| 12/11/2007 | US7307352 Semiconductor package having changed substrate design using special wire bonding |
| 12/11/2007 | US7307351 Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument |
| 12/11/2007 | US7307350 Integrated circuit chip bonding sheet and integrated circuit package |
| 12/11/2007 | US7307349 Semiconductor device of chip-on-chip structure, assembling process therefor, and semiconductor chip to be bonded to solid surface |
| 12/11/2007 | US7307348 Semiconductor components having through wire interconnects (TWI) |
| 12/11/2007 | US7307347 Resin-encapsulated package, lead member for the same and method of fabricating the lead member |
| 12/11/2007 | US7307346 Final passivation scheme for integrated circuits |
| 12/11/2007 | US7307345 Crossbar-array designs and wire addressing methods that tolerate misalignment of electrical components at wire overlap points |
| 12/11/2007 | US7307344 Semiconductor device including a discontinuous film and method for manufacturing the same |
| 12/11/2007 | US7307343 Low dielectric materials and methods for making same |
| 12/11/2007 | US7307342 Interconnection structure of integrated circuit chip |
| 12/11/2007 | US7307341 Integrated packaged having magnetic components |
| 12/11/2007 | US7307340 Wafer-level electronic modules with integral connector contacts |
| 12/11/2007 | US7307339 Semiconductor device having curved leads offset from the center of bonding pads |
| 12/11/2007 | US7307338 Three dimensional polymer memory cell systems |
| 12/11/2007 | US7307337 Resin-molded semiconductor device having posts with bumps and method for fabricating the same |
| 12/11/2007 | US7307330 Reverse blocking semiconductor device and a method for manufacturing the same |
| 12/11/2007 | US7307319 High-voltage protection device and process |
| 12/11/2007 | US7307307 Non-volatile semiconductor memory device having memory cell array suitable for high density and high integration |
| 12/11/2007 | US7307295 Method and an apparatus for a hard-coded bit value changeable in any layer of metal |
| 12/11/2007 | US7307293 Direct-connect integrated circuit signaling system for bypassing intra-substrate printed circuit signal paths |
| 12/11/2007 | US7307289 Pressed-contact type semiconductor device |
| 12/11/2007 | US7307288 Semiconductor device and manufacturing method thereof |
| 12/11/2007 | US7307286 epoxy resin complex comprising an epoxy resin matrices containing silicon dioxide nanoparticles dispersions, and optionally curing agent and glass powders, used as seals for light emitting diodes; reliability and transparency within a broad temperature range |
| 12/11/2007 | US7307128 A curable compound, or adduct, or epoxy resins of anthrahydroquinone and epichlorohydrin; phenolic resin as curing agents; cured product is used for semiconductor encapsulation; solid, low melt viscosity, flame retardance, halogen-free; mechanical strength, heat resistance, moisture resistance |
| 12/11/2007 | US7307032 Glass: 46 to 60 mass % SiO2, 0.5 to 5 % B2O3, 6 to 17.5 % Al2O3, and 25 to 45 % alkaline earth metal oxide at least 60 % of which is SrO; alumina, titania and cordierite; controlled coefficient of linear thermal expansion; high dielectric constant; reduced warpage of fired product |
| 12/11/2007 | US7307020 Membrane 3D IC fabrication |
| 12/11/2007 | US7307011 Structure and method for forming a dielectric chamber and electronic device including the dielectric chamber |
| 12/11/2007 | US7307003 Method of forming a multi-layer semiconductor structure incorporating a processing handle member |
| 12/11/2007 | US7307000 Method of fabricating a capacitor for a semiconductor device |
| 12/11/2007 | US7306984 Method of manufacture of a semiconductor integrated circuit device including a plurality of columnar laminates having different spacing in different directions |
| 12/11/2007 | US7306974 Microelectronic devices and methods for manufacturing and operating packaged microelectronic device assemblies |
| 12/11/2007 | US7306973 Method for making a semiconductor multipackage module including a processor and memory package assemblies |
| 12/11/2007 | US7306972 Semiconductor device and manufacturing method of the same |
| 12/11/2007 | US7306971 Semiconductor chip packaging method with individually placed film adhesive pieces |
| 12/11/2007 | US7306965 Oxygen ion conductor device, method for fabricating oxygen ion conductor device, and oxygen concentration control system |
| 12/11/2007 | US7306853 Ultra-large scale integrated interconnect structures; forming via and/or line patterns in a curable caged polysilsesquioxane, curing and filling the patterns with a conductor; combines the functions of a photoresist and a conventional low-k dielectric into a single material |
| 12/11/2007 | US7306674 Nucleation of diamond films using higher diamondoids |
| 12/11/2007 | US7306671 Diamondoid-containing low dielectric constant materials |
| 12/11/2007 | US7305843 Heat pipe connection system and method |
| 12/11/2007 | US7305761 Method for manufacturing wiring substrate |
| 12/06/2007 | WO2007139852A2 Highly efficient both-side-cooled discrete power package, especially basic element for innovative power modules |
| 12/06/2007 | WO2007139594A1 Microelectronic element chips |
| 12/06/2007 | WO2007139098A1 Electronic component and method for manufacturing same |
| 12/06/2007 | WO2007138922A1 Electronic component, semiconductor package and electronic device |
| 12/06/2007 | WO2007138786A1 Method for reducing thickness of substrate, lamination system, and substrate thickness reduction system |
| 12/06/2007 | WO2007138771A1 Semiconductor device, electronic parts module, and method for manufacturing the semiconductor device |
| 12/06/2007 | WO2007138681A1 Resin-sealed semiconductor device and electronic device using such semiconductor device |
| 12/06/2007 | WO2007138535A1 Method and system for composite bond wires |
| 12/06/2007 | WO2007138409A1 Organic coated metallic substrate with enhanced heat transfer properties and method of production thereof |
| 12/06/2007 | WO2007137742A1 Method for the production of an electronic subassembly, associated subassembly, and assembly comprising at least one such subassembly |
| 12/06/2007 | WO2007120697A3 Methods and apparatus for integrated circuit having multiple dies with at least one on chip capacitor |
| 12/06/2007 | WO2007115292A3 Method and structure for eliminating aluminum terminal pad material in semiconductor devices |
| 12/06/2007 | WO2007033243A3 Semiconductor package having plate interconnections |
| 12/06/2007 | WO2007027762A8 Metal interconnect structure for integrated ciruits and a design rule therefor |
| 12/06/2007 | WO2006127047A3 High current electrical switch and method |
| 12/06/2007 | WO2005112102A3 Chemical-enhanced package singulation process |
| 12/06/2007 | US20070281468 Top layers of metal for high performance IC's |
| 12/06/2007 | US20070281467 Top layers of metal for high performance IC's |
| 12/06/2007 | US20070281465 Semiconductor device and method for fabricating the same |
| 12/06/2007 | US20070281463 Top layers of metal for high performance IC's |
| 12/06/2007 | US20070281458 Top layers of metal for high performance IC's |
| 12/06/2007 | US20070281453 Electronic component, laser device, optical writing device and image forming apparatus |
| 12/06/2007 | US20070281434 Capacitor of semiconductor device applying damascene process and method of fabricating the same |
| 12/06/2007 | US20070281374 Chip stack package and manufacturing method thereof |
| 12/06/2007 | US20070281156 Nanoscale wires and related devices |
| 12/06/2007 | US20070281077 Method for packaging integrated circuit dies |
| 12/06/2007 | US20070281050 Resin-Sealed Mold And Resin-Sealed Device |
| 12/06/2007 | US20070279974 Forming heaters for phase change memories with select devices |
| 12/06/2007 | US20070279879 Wiring board and semiconductor apparatus |
| 12/06/2007 | US20070279873 Thermally enhanced electronic flip-chip packaging with external-connector-side die and method |
| 12/06/2007 | US20070278701 Semiconductor package and method for fabricating the same |
| 12/06/2007 | US20070278700 Method for forming an encapsulated device and structure |
| 12/06/2007 | US20070278699 Microelectronic element chips |
| 12/06/2007 | US20070278698 Semiconductor device and semiconductor wafer and a method for manufacturing the same |
| 12/06/2007 | US20070278697 Semiconductor device |
| 12/06/2007 | US20070278696 Stackable semiconductor package |
| 12/06/2007 | US20070278694 Semiconductor device and manufacturing method thereof |
| 12/06/2007 | US20070278693 Metallization layer of a semiconductor device having differently thick metal lines and a method of forming the same |
| 12/06/2007 | US20070278692 Structure of semiconductor substrate and molding method |
| 12/06/2007 | US20070278691 Top layers of metal for high performance IC's |
| 12/06/2007 | US20070278690 Top layers of metal for high performance IC's |
| 12/06/2007 | US20070278689 Top layers of metal for high performance IC's |
| 12/06/2007 | US20070278688 Top layers of metal for high performance IC's |
| 12/06/2007 | US20070278687 Top layers of metal for high performance IC's |
| 12/06/2007 | US20070278686 Top layers of metal for high performance IC's |
| 12/06/2007 | US20070278685 Top layers of metal for high performance IC's |
| 12/06/2007 | US20070278684 Top layers of metal for high performance IC's |
| 12/06/2007 | US20070278683 Interlayer Dielectric and Pre-Applied Die Attach Adhesive Materials |
| 12/06/2007 | US20070278682 Self-assembled mono-layer liner for cu/porous low-k interconnections |
| 12/06/2007 | US20070278681 Interconnection structure design for low RC delay and leakage |
| 12/06/2007 | US20070278680 Method and device for concentrating light in optoelectronic devices using resonant cavity modes |