Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2007
12/13/2007DE102004036889B4 Detektorschaltung und Zugriffdetektionsverfahren für eine Chipkarte And access detection circuit detecting method for a chip card
12/13/2007DE102004036520B4 Bauelementanordnung mit einer Auswerteschaltung zur Detektion eines Verschleißes von Anschlussverbindungen und Verfahren zur Detektion eines Verschleißes von Anschlussverbindungen The component arrangement having an evaluation circuit for the detection of wear of terminal compounds and methods for the detection of wear of connections
12/13/2007DE102004031623B4 Leistungs-Halbleitermodul mit federndem Anschlusskontakt Power semiconductor module with spring terminal contact
12/13/2007DE102004024924B4 Verfahren zum Herstellen polykristallinen Siliciums, Verfahren zum Herstellen einer Ausrichtungsmarkierung, sowie Verfahren zum Herstellen eines Schaltelements A method for producing polycrystalline silicon, methods of making an alignment mark, as well as methods for producing a switching element
12/12/2007EP1865553A2 Thermally conductive body and method of manufacturing the same
12/12/2007EP1865552A1 Heat transfer sheet, radiation structure and method for using heat transfer sheet
12/12/2007EP1864557A1 Method for producing an electronic appliance, and corresponding electronic appliance
12/12/2007EP1864346A1 Using thin film, thermal batteries to provide security protection for electronic systems
12/12/2007EP1864328A2 Method and system for output matching of rf transistors
12/12/2007EP1864327A2 Anisotropic electrically conductive structure
12/12/2007EP1864326A1 Low- thickness electronic module comprising a pile of electronic package provided with connection balls
12/12/2007EP1864325A2 Wafer level package including a device wafer integrated with a passive component
12/12/2007EP1864324A2 Device and method for determining the temperature of a heat sink
12/12/2007EP1864323A1 Refractory solid, adhesive composition, and device, and associated method
12/12/2007EP1864097A1 Semiconductor integrated circuit
12/12/2007EP1863874A1 Resin compositions and methods of use thereof
12/12/2007EP1741325B1 Cooling and mounting plate with fixation means for electronic components
12/12/2007EP1698664B1 Curable resin composition
12/12/2007EP1695383A4 Bipolar and cmos integration with reduced contact height
12/12/2007EP1498013B1 Flexible interconnect structures for electrical devices and light sources incorporating the same
12/12/2007EP1410700B1 Integrated circuit carrier with recesses
12/12/2007EP1402763B1 apparatus for non-destructive testing of leaded packages
12/12/2007EP1401641A4 Interface materials and methods of production and use thereof
12/12/2007EP1386333A4 Capacitor having improved electrodes
12/12/2007EP1104025B1 Semiconductor device
12/12/2007EP1030369B1 Multichip module structure and method for manufacturing the same
12/12/2007EP1016106A4 Ceramic multilayer printed circuit boards with embedded passive components
12/12/2007CN200990754Y Radiating device
12/12/2007CN200990753Y Thermal conducting medium protection cover
12/12/2007CN200990749Y 风扇模组 Fan Module
12/12/2007CN200990748Y Wind inducing hood combination
12/12/2007CN200990387Y Large power LED chip package structure and large power LED illuminating device
12/12/2007CN200990386Y Inverted welding chip
12/12/2007CN101088161A Semiconductor chip mounting structure and method for manufacturing same
12/12/2007CN101088156A Flexible electronic circuit articles and methods of making thereof
12/12/2007CN101087987A Nanoengineered thermal materials based on carbon nanotube array composites
12/12/2007CN101087511A Thermally conductive forming body and method of manufacturing the same
12/12/2007CN101087510A Thermal pipe assembly
12/12/2007CN101087509A Heat radiator
12/12/2007CN101087508A 散热器 Heat sink
12/12/2007CN101087507A Heat radiator
12/12/2007CN101087506A Heat radiator
12/12/2007CN101087505A Heat radiator
12/12/2007CN101086997A Semiconductor device, manufacturing method thereof, electro-optical device and electric device
12/12/2007CN101086996A Thin film transistor array panel and method of manufacturing the same
12/12/2007CN101086995A Thin film transistor substrate and liquid crystal display panel having the same
12/12/2007CN101086989A Microelectronic structure and method for making same
12/12/2007CN101086988A 半导体集成电路装置及其制造方法 The semiconductor integrated circuit device and manufacturing method thereof
12/12/2007CN101086987A Integrated small thermal sediment system and its making method
12/12/2007CN101086986A Optical coupling element and electric device
12/12/2007CN101086985A Block water cooling power semiconductor part
12/12/2007CN101086984A 半导体装置 Semiconductor device
12/12/2007CN101086983A Semiconductor device and method for determining fuse state
12/12/2007CN101086982A Semiconductor device, method of cutting electrical fuse, and method of determining electrical fuse state
12/12/2007CN101086981A Semiconductor package structure and its making method
12/12/2007CN101086980A Heat radiation device of thermal conduction tube
12/12/2007CN101086979A Semiconductor device, manufacturing method of the semiconductor device, and mounting method of the semiconductor device
12/12/2007CN101086975A Sensing mechanism for crystal orientation indication mark of semiconductor wafer
12/12/2007CN101086974A Built-in testing device and method and testing device built in wafer cutting line section
12/12/2007CN101086972A Multiple row exposed leads for mlp high density packages
12/12/2007CN101086963A Method of growing gallium nitride crystale
12/12/2007CN101086952A Wafer package body and crystal circle processing method for making wafer with rubber layer
12/12/2007CN101086757A Semiconductor device, unique ID of semiconductor device and method for verifying unique ID
12/12/2007CN101086430A Heat pipe radiation method and device
12/12/2007CN101086429A Heat pipe with enlarged heated section structure and heat-radiation module
12/12/2007CN101086081A Precision electrocasting method of radiation device and the final product
12/12/2007CN101085856A Low viscosity curable compositions
12/12/2007CN101085855A Ultraviolet and high temperature aging resistant organic silicon epoxy resin composition used for luminescent diode encapsulation
12/12/2007CN100355326C Composite structure of flexible printed circuit and electronic component
12/12/2007CN100355206C Low power operation mechanism and method
12/12/2007CN100355088C Semiconductor device and producing method thereof
12/12/2007CN100355077C Semiconductor device with built-in optical receiving component, its mfg. method and optical pick-up device
12/12/2007CN100355071C Mixed analog and digital inegrated circits
12/12/2007CN100355070C High power semiconductor module
12/12/2007CN100355069C Semiconductor device and method for manufacturing thereof
12/12/2007CN100355068C Semiconductor device, and production method for manufacturing such semiconductor device
12/12/2007CN100355067C Semiconductor device and its mfg. method
12/12/2007CN100355066C Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package
12/12/2007CN100355065C Semi-conductor device and its manufacturing method
12/12/2007CN100355064C Low cost microelectronic circuit package
12/12/2007CN100355063C Chip dimention packaging and method for preparing wafer-class chip dimention packing
12/12/2007CN100355062C A cooling arrangement for an integrated circuit
12/12/2007CN100355061C In-print method and in-print device
12/12/2007CN100355049C Film carrier tape for mounting of electronic part
12/12/2007CN100355045C Support with integrated deposit of gas absorbing material for manufacturing microelectronic, microoptoelectronic or micromechanical devices
12/12/2007CN100355043C Method for forming an oxynitride spacer for a metal gate electrode using a PECVD process with a silicon-starving atmosphere
12/12/2007CN100355036C Manufacturing method of semiconductor device
12/12/2007CN100355030C Semiconductor chip and manufacturing method thereof
12/12/2007CN100355014C Topside active optical device apparatus and method
12/12/2007CN100354883C Image pickup device and production method thereof
12/11/2007US7308627 Self-timed reliability and yield vehicle with gated data and clock
12/11/2007US7308588 Memory card
12/11/2007US7308395 Simulation circuit pattern evaluation method, manufacturing method of semiconductor integrated circuit, test substrate, and test substrate group
12/11/2007US7308008 Magnetically controlled heat sink
12/11/2007US7307871 SRAM cell design with high resistor CMOS gate structure for soft error rate improvement
12/11/2007US7307852 Printed circuit board and method for manufacturing printed circuit board
12/11/2007US7307845 Multiple integrated circuit package module
12/11/2007US7307844 Heat dissipation mechanism for electronic apparatus
12/11/2007US7307841 Electronic package and method of cooling electronics
12/11/2007US7307822 Semiconductor integrated circuit apparatus
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