Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2007
12/13/2007US20070287262 Fabrication method of semiconductor integrated circuit device
12/13/2007US20070287230 Electronic device and production method thereof
12/13/2007US20070286946 Wiring module, method and apparatus for manufacturing wiring module
12/13/2007US20070285957 Magnetic Shielding for Magnetic Random Access Memory
12/13/2007US20070285920 Lighting Assembly, Heat Sink and Heat Recovery System Therefor
12/13/2007US20070285907 Wiring Board and Semiconductor Device
12/13/2007US20070285895 Cooling System For Device Having Power Semiconductors And Method For Cooling The Device
12/13/2007US20070285855 Composite integrated semiconductor device
12/13/2007US20070285123 Programming semiconductor dies for pin map compatibility
12/13/2007US20070285114 Socket For Making With Electronic Component, Particularly Semiconductor Device With Spring Packaging, For Fixturing, Testing, Burning-In Or Operating Such A Component
12/13/2007US20070284764 Sensing mechanism for crystal orientation indication mark of semiconductor wafer
12/13/2007US20070284763 Driving circuit and liquid crystal display device including the same
12/13/2007US20070284762 Semiconductor seal ring
12/13/2007US20070284761 Functional device
12/13/2007US20070284760 Chip and flat panel display apparatus comprising the same
12/13/2007US20070284759 Method For Producing Sheet With Ic Tags, Apparatus For Producing Sheet With Ic Tags, Sheet With Ic Tags, Method For Fixing Ic Chips, Apparatus For Fixing Ic Chips, And Ic Tag
12/13/2007US20070284758 Electronics package and associated method
12/13/2007US20070284757 Electronic Circuit Arrangement and Method for Producing It
12/13/2007US20070284756 Stacked chip package
12/13/2007US20070284755 Semiconductor device, manufacturing method of the semiconductor device, and mounting method of the semiconductor device
12/13/2007US20070284754 Power MOSFET contact metallization
12/13/2007US20070284753 Top layers of metal for high performance IC's
12/13/2007US20070284752 Top layers of metal for high performance IC's
12/13/2007US20070284751 Top layers of metal for high performance IC's
12/13/2007US20070284750 Top layers of metal for high performance IC's
12/13/2007US20070284749 Semiconductor device having no cracks in one or more layers underlying a metal line layer and method of manufacturing the same
12/13/2007US20070284748 Copper interconnects with improved electromigration lifetime
12/13/2007US20070284747 Integrated circuit having improved interconnect structure
12/13/2007US20070284745 Semiconductor device having a resistance for equalizing the current distribution
12/13/2007US20070284744 Apparatus for an improved air gap interconnect structure
12/13/2007US20070284743 Fabricating Memory Devices Using Sacrificial Layers and Memory Devices Fabricated by Same
12/13/2007US20070284742 Semiconductor device and active matrix display device
12/13/2007US20070284741 Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same
12/13/2007US20070284740 Semiconductor Device with Improved Contacts
12/13/2007US20070284739 Top layers of metal for high performance IC's
12/13/2007US20070284738 Wiring board method for manufacturing the same, and semiconductor device
12/13/2007US20070284737 Void Reduction in Indium Thermal Interface Material
12/13/2007US20070284736 Enhanced mechanical strength via contacts
12/13/2007US20070284735 Semiconductor Device
12/13/2007US20070284734 Integrated circuit interconnect
12/13/2007US20070284733 Method of making thermally enhanced substrate-base package
12/13/2007US20070284732 Semiconductor device, heat dissipating unit, and method for making a heat dissipating unit
12/13/2007US20070284731 Power module
12/13/2007US20070284729 Semiconductor structure and method for forming the same
12/13/2007US20070284728 Flip-chip bonding structure using multi chip module-deposited substrate
12/13/2007US20070284727 Printed circuit board with coextensive electrical connectors and contact pad areas
12/13/2007US20070284726 Integrated circuit package system with post-passivation interconnection and integration
12/13/2007US20070284725 Integrated Circuit (IC) Carrier Assembly Incorporating Serpentine Suspension
12/13/2007US20070284724 Mounting integrated circuit dies for high frequency signal isolation
12/13/2007US20070284723 Packaged integrated circuit device
12/13/2007US20070284722 Semiconductor device package utilizing proud interconnect material
12/13/2007US20070284721 Semiconductor device and method for producing the semiconductor device
12/13/2007US20070284720 Power semiconductor device and method for its production
12/13/2007US20070284719 Semiconductor device
12/13/2007US20070284718 Stacked die package system
12/13/2007US20070284717 Device embedded with semiconductor chip and stack structure of the same
12/13/2007US20070284716 Assembly Having Stacked Die Mounted On Substrate
12/13/2007US20070284715 System-in-package device
12/13/2007US20070284714 Electronic Part And Method Of Producing The Same
12/13/2007US20070284713 Sensor device
12/13/2007US20070284712 Semiconductor integrated circuit device, and method of designing and manufacturing the same
12/13/2007US20070284711 Methods and apparatus for thermal management in a multi-layer embedded chip structure
12/13/2007US20070284710 Method for fabricating flip-chip semiconductor package with lead frame as chip carrier
12/13/2007US20070284709 Semiconductor Device with Improved High Current Performance
12/13/2007US20070284708 Semiconductor Optical Device
12/13/2007US20070284707 Semiconductor device
12/13/2007US20070284706 No-wick(tm) 2 interconnections
12/13/2007US20070284705 Package structure and lead frame using the same
12/13/2007US20070284704 Methods and apparatus for a semiconductor device package with improved thermal performance
12/13/2007US20070284703 Semiconductor package structure
12/13/2007US20070284702 Semiconductor device having a bonding pad and fuse and method for forming the same
12/13/2007US20070284700 Coatings and methods for inhibiting tin whisker growth
12/13/2007US20070284699 Microfabricated Devices and Method for Fabricating Microfabricated Devices
12/13/2007US20070284698 DUV LASER ANNEALING AND STABILIZATION OF SiCOH FILMS
12/13/2007US20070284684 Semiconductor device, magnetic sensor, and magnetic sensor unit
12/13/2007US20070284681 Apparatus and method for protective covering of microelectromechanical system (mems) devices
12/13/2007US20070284678 Methods of Manufacturing Metal-Silicide Features
12/13/2007US20070284667 Electrostatic discharge protection method and device for semiconductor device
12/13/2007US20070284665 Electrostatic discharge protection device
12/13/2007US20070284664 Semiconductor power converter apparatus
12/13/2007US20070284663 System and method for i/o esd protection with polysilicon regions fabricated by processes for making core transistors
12/13/2007US20070284649 Semiconductor device and method of manufacturing same
12/13/2007US20070284625 Method for producing si1-ygey based zones with different contents in ge on a same substrate by condensation of germanium
12/13/2007US20070284611 Structure of strained silicon on insulator and method of manufacturing the same
12/13/2007US20070284602 Dielectric wafer level bonding with conductive feed-throughs for electrical connection and thermal management
12/13/2007US20070284578 Array substrate for liquid crystal display and method of testing
12/13/2007US20070284360 Heating element for microfluidic and micromechanical applications
12/13/2007US20070284139 Sawn integrated circuit package system
12/13/2007US20070284084 Radiator with buckle
12/13/2007US20070283886 Apparatus for integration of barrier layer and seed layer
12/13/2007DE202007014158U1 Wasserkühlmodul für elektronisches Gerät Water cooling module for electronic device
12/13/2007DE19801095B4 Leistungs-MOSFET Power MOSFET
12/13/2007DE10240921B4 Verfahren und Anordnung zum selektiven Metallisieren von 3-D-Strukturen Method and apparatus for selective metallization of 3-D structures
12/13/2007DE10222959B4 Mikro-elektromechanisches Bauelement und Verfahren zur Herstellung von mikro-elektromechanischen Bauelementen Micro-electro-mechanical device and method for the production of micro-electro-mechanical components
12/13/2007DE102007016651A1 Leadless integrierte Schaltungsschutzeinrichtung Leadless integrated circuit protective device
12/13/2007DE102007001191A1 Halbleitervorrichtung mit einem Widerstand zum Abgleichen der Stromverteilung A semiconductor device with a resistor for adjusting the current distribution
12/13/2007DE102006026691A1 Electronic circuit e.g. integrated circuit, protecting arrangement, has trough connection of transistor interconnected with terminal of circuit having terminal connected with ground line and virtual supply line connected with terminal
12/13/2007DE102006025959A1 Leistungshalbleiteranordnung mit gelöteter Clip-Verbindung und Verfahren zur Herstellung einer solchen A power semiconductor device with brazed clip connection and methods for producing such
12/13/2007DE102006025671A1 Verfahren zur Herstellung von dünnen integrierten Halbleitereinrichtungen A process for the production of thin semiconductor integrated devices
12/13/2007DE102006025553A1 Verfahren zum Herstellen einer elektronischen Baueinheit, zugehörige Baueinheit und Baugruppe mit mindestens einer solchen Baueinheit A method of manufacturing an electronic assembly, and related assembly module having at least one such assembly
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