| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 12/19/2007 | CN101088697A Interface materials and methods of production and use thereof |
| 12/19/2007 | CN100356823C Process for fabricating circuit assemblies using electrodepositable dielectric coating compositions |
| 12/19/2007 | CN100356822C 电路装置及其制造方法 Circuit device and manufacturing method thereof |
| 12/19/2007 | CN100356601C Thermoelectric modular packing |
| 12/19/2007 | CN100356600C 热电模块 Thermoelectric Modules |
| 12/19/2007 | CN100356568C Semiconductor device and electronic apparatus capable of detecting open wire using weak current |
| 12/19/2007 | CN100356565C Three-dimensionally mounted semiconductor module and three-dimensionally mounted semiconductor system |
| 12/19/2007 | CN100356564C Electrostatic discharge (ESD) protection for integrated circuit packages |
| 12/19/2007 | CN100356563C Semiconductor device and its manufacture |
| 12/19/2007 | CN100356562C Semiconductor apparatus and method of fabricating the same |
| 12/19/2007 | CN100356561C A power/ground configuration for low impedance integrated circuit |
| 12/19/2007 | CN100356560C Semiconductor device and method of manufacturing the device |
| 12/19/2007 | CN100356559C Crystal coated packing structure and its mfg method |
| 12/19/2007 | CN100356558C 液冷式电功率转换装置 Liquid-cooled power converter |
| 12/19/2007 | CN100356557C Method for producing heating degassing heat conducting pipes |
| 12/19/2007 | CN100356556C Thermal interfacial material and method of manufacture |
| 12/19/2007 | CN100356555C 散热器 Heat sink |
| 12/19/2007 | CN100356554C Integrated radiating base plate and making method thereof |
| 12/19/2007 | CN100356553C Thin flm bearing belt of mounting electronic parts, its prodn. method and printing screen for coating welding resistance agent |
| 12/19/2007 | CN100356549C Method of cutting semiconductor wafer and protective sheet used in the cutting method |
| 12/19/2007 | CN100356543C Semiconductor device and method for producing the same |
| 12/19/2007 | CN100356538C Joining method and joining device |
| 12/19/2007 | CN100356537C Method of manufacturing semiconductor device |
| 12/19/2007 | CN100356536C Method of microelectrode connection and connected structure of use thereof |
| 12/19/2007 | CN100356535C Flexible wiring base material and process for producing the same |
| 12/19/2007 | CN100356534C Semiconductor packing structure and production thereof |
| 12/19/2007 | CN100356532C Liquid resin dropping packaging method |
| 12/19/2007 | CN100356530C Mfg. method for semiconductor device |
| 12/19/2007 | CN100356521C Ordered two-phase dielectric film, and semiconductor device containing the same |
| 12/19/2007 | CN100356517C Semiconductor substrate and thin processing method for semiconductor substrate |
| 12/19/2007 | CN100356510C Semiconductor device and manufacturing method for the same |
| 12/19/2007 | CN100356508C LSI package, heat radiator and interface module for installation of heat radiator |
| 12/19/2007 | CN100356495C Use of non-crystal diamond material |
| 12/18/2007 | US7310458 Stacked module systems and methods |
| 12/18/2007 | US7310230 Temperature control system which sprays liquid coolant droplets against an IC-module at a sub-atmospheric pressure |
| 12/18/2007 | US7310229 Heat dissipating device |
| 12/18/2007 | US7310213 Semiconductor device provided with overheat protection circuit and electronic circuit using the same |
| 12/18/2007 | US7310211 Method for suppressing latch-ups occurring in a circuit, and systems for carrying out said method |
| 12/18/2007 | US7309997 Monitor system and method for semiconductor processes |
| 12/18/2007 | US7309925 Dicing die-bonding film |
| 12/18/2007 | US7309924 UBM for fine pitch solder ball and flip-chip packaging method using the same |
| 12/18/2007 | US7309923 Integrated circuit package having stacked integrated circuits and method therefor |
| 12/18/2007 | US7309922 Lower substrate, display apparatus having the same and method of manufacturing the same |
| 12/18/2007 | US7309920 Chip structure and process for forming the same |
| 12/18/2007 | US7309919 Sealing apparatus for semiconductor wafer, mold of sealing apparatus, and semiconductor wafer |
| 12/18/2007 | US7309918 Chip package structure |
| 12/18/2007 | US7309917 Multilayer board and a semiconductor device |
| 12/18/2007 | US7309916 Semiconductor package and method for its manufacture |
| 12/18/2007 | US7309915 Semiconductor chip having pads with plural junctions for different assembly methods |
| 12/18/2007 | US7309914 Inverted CSP stacking system and method |
| 12/18/2007 | US7309913 Stacked semiconductor packages |
| 12/18/2007 | US7309912 On-package edge-mount power decoupling and implementation with novel substrate design for FPGA and ASIC devices |
| 12/18/2007 | US7309911 Method and stacked memory structure for implementing enhanced cooling of memory devices |
| 12/18/2007 | US7309910 Micro lead frame packages and methods of manufacturing the same |
| 12/18/2007 | US7309909 Leadframes for improved moisture reliability of semiconductor devices |
| 12/18/2007 | US7309908 Standard cell, semiconductor integrated circuit device of standard cell scheme and layout design method for semiconductor integrated circuit device |
| 12/18/2007 | US7309907 Semiconductor device card methods of initializing checking the authenticity and the identity thereof |
| 12/18/2007 | US7309904 Semiconductor device, magnetic sensor, and magnetic sensor unit |
| 12/18/2007 | US7309897 Electrostatic discharge protector for an integrated circuit |
| 12/18/2007 | US7309865 Electronic device having infrared sensing elements |
| 12/18/2007 | US7309733 Organopolysiloxane composition and electronic part encapsulated therewith |
| 12/18/2007 | US7309722 Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device |
| 12/18/2007 | US7309669 Dielectric material and dielectric sintered body, and wiring board using the same |
| 12/18/2007 | US7309651 Method for improving reliability of copper interconnects |
| 12/18/2007 | US7309649 Method of forming closed air gap interconnects and structures formed thereby |
| 12/18/2007 | US7309639 Method of forming a metal trace with reduced RF impedance resulting from the skin effect |
| 12/18/2007 | US7309624 Semiconductor device and method for the fabrication thereof including grinding a major portion of the frame |
| 12/18/2007 | US7309623 Method of fabricating a stacked die in die BGA package |
| 12/18/2007 | US7309609 Applying alternating magnetic fields; generating eddy currents |
| 12/18/2007 | US7309514 Electron beam modification of CVD deposited films, forming low dielectric constant materials |
| 12/18/2007 | US7309453 Coolant capable of enhancing corrosion inhibition, system containing same, and method of manufacturing same |
| 12/18/2007 | US7309447 Method for making a microelectronic package using pre-patterned, reusable mold and method for making the mold |
| 12/18/2007 | CA2446728C Thermal management material, devices and methods therefor |
| 12/18/2007 | CA2244505C Heat sink for semiconductors and manufacturing process thereof |
| 12/13/2007 | WO2007143730A2 Semiconductor device with high current performance packaging |
| 12/13/2007 | WO2007143365A2 Multicolor led assembly with improved color mixing |
| 12/13/2007 | WO2007143260A2 Esd protection circuit with isolated diode element and method thereof |
| 12/13/2007 | WO2007143153A1 Improved metal-insulator-metal capacitors |
| 12/13/2007 | WO2007142721A1 Integrated circuit packaging |
| 12/13/2007 | WO2007142558A1 Temperature managing for electronic components |
| 12/13/2007 | WO2007142329A1 Film forming apparatus, film forming method, computer program and storage medium |
| 12/13/2007 | WO2007142273A1 Highly heat conductive, flexible sheet |
| 12/13/2007 | WO2007142261A1 Power element mounting substrate, method for manufacturing the power element mounting substrate, power element mounting unit, method for manufacturing the power element mounting unit, and power module |
| 12/13/2007 | WO2007142172A1 Multi-layered wiring manufacturing method, multi-layered wiring structure, and multi-layered wiring manufacturing apparatus |
| 12/13/2007 | WO2007142052A1 Semiconductor package, its manufacturing method, semiconductor device, and electronic device |
| 12/13/2007 | WO2007142033A1 Multilayer ceramic electronic component and method for manufacturing same |
| 12/13/2007 | WO2007141987A1 Thermal resistor, semiconductor device using the same, and electric device |
| 12/13/2007 | WO2007141909A1 Method for manufacturing light receiving apparatus |
| 12/13/2007 | WO2007141851A1 Semiconductor package and electronic apparatus |
| 12/13/2007 | WO2007141843A1 Spherical sintered ferrite particle, semiconductor sealing resin composition making use of the same and semiconductor device obtained therewith |
| 12/13/2007 | WO2007141738A1 A semiconductor fuse structure and a method of manufacturing a semiconductor fuse structure |
| 12/13/2007 | WO2007121114A3 Transfer tape strap process |
| 12/13/2007 | WO2007110799A3 Low ohmic through substrate interconnection for semiconductor carriers |
| 12/13/2007 | WO2007107601A3 Carrier body for components or circuits |
| 12/13/2007 | WO2007105158A3 Method for manufacturing a microelectronic package |
| 12/13/2007 | WO2007044305A3 Plating seed layer including an oxygen/nitrogen transition region for barrier enhancement |
| 12/13/2007 | WO2007041155A3 Microelectronic package having multiple conductive paths through an opening in a support substrate |
| 12/13/2007 | WO2006119493A3 Semiconductor device with reduced metal layer stress |
| 12/13/2007 | US20070288880 Top layers of metal for high performance IC's |
| 12/13/2007 | US20070287283 Semiconductor device capable of suppressing current concentration in pad and its manufacture method |