Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2007
12/20/2007DE102006012446B3 Speichermodul mit einem Mittel zur Kühlung, Verfahren zur Herstellung des Speichermoduls mit einem Mittel zur Kühlung sowie Datenverarbeitungsgerät umfassend ein Speichermodul mit einem Mittel zur Kühlung Memory module with a means for cooling, process for the preparation of the memory module with a means for cooling as well as data processing apparatus comprising a memory module with a means for cooling
12/20/2007DE102005036262B4 Infrarotsensor Infrared sensor
12/20/2007DE102005030465B4 Halbleiterstapelblock mit Halbleiterchips und Verfahren zur Herstellung desselben The same semiconductor stacking block with semiconductor chips and processes for making
12/20/2007DE102004032605B4 Halbleiterbauteil mit einem Halbleiterchip und elektrischen Verbindungselementen zu einer Leiterstruktur A semiconductor device comprising a semiconductor chip and electrical connecting elements to a printed circuit structure
12/20/2007DE102004017412B4 Elektrische Quantifizierung einer Verkürzung eines Leitbahnendes und Vorrichtung dafür Electrical quantification of shortening a Leitbahnendes and apparatus therefor
12/20/2007DE102004005685B4 Verfahren zum Herstellen einer elektronischen Komponente A method of manufacturing an electronic component
12/19/2007EP1868245A2 Semiconductor device and method of manufacturing semiconductor device
12/19/2007EP1868242A2 Power semiconductor module and fabrication method thereof
12/19/2007EP1868241A1 Submount and method for manufacturing same
12/19/2007EP1868240A2 Method for forming mulitlevel interconnects in semiconductor device
12/19/2007EP1867016A1 Laser diode with double sided cooling
12/19/2007EP1866963A2 Multilayer, multicomponent high-k films and methods for depositing the same
12/19/2007EP1866962A2 Carbon nanotube bond pad structure and manufacturing method thereof
12/19/2007EP1866961A2 Micro solder pot
12/19/2007EP1866960A1 Radiation curable cycloaliphatic barrier sealants
12/19/2007EP1866959A1 Flip-attached and underfilled semiconductor device and method
12/19/2007EP1866728A2 Cooling unit
12/19/2007EP1866701A1 Masking of repeated overlay and alignment marks to allow reuse of photomasks in a vertical structure
12/19/2007EP1680274A4 Sandwiched thermal solution
12/19/2007EP1602129B1 Split fin heat sink
12/19/2007EP1419523A4 Dummy structures to reduce metal recess in electropolishing process
12/19/2007EP1292970A4 Thin film forming method
12/19/2007EP1275148B1 Resin sealed semiconductor device with stress-reducing layer
12/19/2007EP1176641B1 Front-and-back electrically conductive substrate and method for manufacturing same
12/19/2007EP1030355B1 Press contact semiconductor device
12/19/2007CN200994252Y Radiating device
12/19/2007CN200994250Y Self-protecting welding machine power supply
12/19/2007CN200994248Y Radiator fastening device
12/19/2007CN200994241Y Radiating module fastener
12/19/2007CN200994240Y Radiator fixing device
12/19/2007CN200993968Y Structure improvement of light-emitting diode
12/19/2007CN200993965Y Charge coupling element packaging structure
12/19/2007CN200993964Y Image integrated circuit combination structure
12/19/2007CN200993961Y Heat pipe shovel for chip cooling
12/19/2007CN200993762Y Internal memory radiating device
12/19/2007CN200993761Y Blade server with improved radiating duct structure
12/19/2007CN200993760Y Blade server cooling device
12/19/2007CN101091424A 冷却系统和方法 Cooling systems and methods
12/19/2007CN101091313A 电子部件封装 Electronic component package
12/19/2007CN101091256A Electronic device and process for forming same
12/19/2007CN101091251A High strain glass/glass-ceramic containing semiconductor-on-insulator structures
12/19/2007CN101091250A Semiconductor component and installation structure
12/19/2007CN101091249A An anti-fuse cell and its manufacturing process
12/19/2007CN101091248A System for and method of planarizing the contact region of a via by use of a continuous inline vacuum deposition
12/19/2007CN101091247A Dual flat non-leaded semiconductor package
12/19/2007CN101091246A Microelectronic assembly with built-in thermoelectric cooler and method of fabricating same
12/19/2007CN101091245A Layer between interfaces of different components in semiconductor devices and method for preparing the same
12/19/2007CN101091243A Single mask via method and device
12/19/2007CN101091005A Method for forming tantalum nitride film
12/19/2007CN101091004A Method for forming tantalum nitride film
12/19/2007CN101091003A Method for forming tantalum nitride film
12/19/2007CN101091002A Method for forming tantalum nitride film
12/19/2007CN101091001A Method for forming tantalum nitride film
12/19/2007CN101091000A Method for forming tantalum nitride film
12/19/2007CN101090985A Al-ni-b alloy wiring material and element structure using the same
12/19/2007CN101090944A Epoxy resin composition for semiconductor encapsulation and semiconductor device
12/19/2007CN101090627A 冷却装置及投影机 Cooling device and projector
12/19/2007CN101090625A Active loop heat sink device with atomizer
12/19/2007CN101090623A Heat sink module with heat pipe
12/19/2007CN101090620A Heat sink module
12/19/2007CN101090619A Heat sink device
12/19/2007CN101090618A Fastening device for heat sink
12/19/2007CN101090605A Printed circuit board and circuit structure for power supply
12/19/2007CN101090602A Flexible printing circuit substrate and semiconductor device
12/19/2007CN101090599A 电路板 Circuit board
12/19/2007CN101090228A Auxiliary voltage source of off-line integrated circuit chip and its control detection system
12/19/2007CN101090144A Technology for package of high power luminous element and its structure
12/19/2007CN101090139A Adhesion type area sensor and display device having adhesion type area sensor
12/19/2007CN101090131A 显示装置及其制造方法 Display device and manufacturing method
12/19/2007CN101090130A Self-aligned, embedded phase change ram and manufacturing method
12/19/2007CN101090123A Film transistor with copper wire structure and its manufacturing method
12/19/2007CN101090121A Semiconductor device and a manufacturing method thereof
12/19/2007CN101090120A A nand memory device with inversion bit lines and methods for making the same
12/19/2007CN101090119A An apparatus and associated method for making a virtual ground array structure that uses inversion bit lines
12/19/2007CN101090114A 半导体装置 Semiconductor device
12/19/2007CN101090113A 半导体装置 Semiconductor device
12/19/2007CN101090112A Electrostatic discharge device circuit layout
12/19/2007CN101090111A System and method of I/O ESD protection using multi-crystal silicon area
12/19/2007CN101090109A Power semiconductor module with connection elements electrically insulated from one another
12/19/2007CN101090107A Package structure of crystal particle and manufacturing method thereof
12/19/2007CN101090106A Transmission line structure and signal transmission structure
12/19/2007CN101090105A 线路板与电路结构 Circuit board and the circuit configuration
12/19/2007CN101090104A Substrate structure for packaging electronic assembly
12/19/2007CN101090103A Chip carrier with signal collecting film and manufacturing method thereof
12/19/2007CN101090102A Semiconductor device and method of manufacturing the same
12/19/2007CN101090101A Ic chip package, and image display apparatus using same
12/19/2007CN101090100A Chip structure with lug and manufacturing method thereof
12/19/2007CN101090099A Solder lug and manufacturing method thereof
12/19/2007CN101090098A Semiconductor device and method for manufacturing the same
12/19/2007CN101090097A Heat pipe type CPU radiator and manufacturing technology
12/19/2007CN101090096A Nitride semiconductor free-standing substrate and nitride semiconductor light emitting device
12/19/2007CN101090090A Unlanded via process without plasma damage
12/19/2007CN101090081A Manufacturing method of semiconductor device
12/19/2007CN101090080A Package method for multi-chip stack and its package structure
12/19/2007CN101090079A Package method for preventing chip interference and its package structure
12/19/2007CN101090078A Semiconductor package structure and method for manufacturing the semiconduct package structure
12/19/2007CN101090077A Semiconductor package and its manufacturing method
12/19/2007CN101090075A Manufacturing method for vertical built-in capacity substrate and its structure
12/19/2007CN101090074A Printed circuit board for package of electronic components and manufacturing method thereof
12/19/2007CN101090062A Method of storing gan substrate, stored substrate and semiconductor device and method of its manufacture
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