Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2007
12/20/2007US20070293090 Versatile dual port connector element arrangement
12/20/2007US20070293062 Anisotropic conductive connector and circuit-device electrical inspection device
12/20/2007US20070293038 Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate
12/20/2007US20070293037 Top layers of metal for high performance IC's
12/20/2007US20070293036 Top layers of metal for high performance IC's
12/20/2007US20070292994 Method of manufacturing a semiconductor package using a lead frame having through holes or hollows therein
12/20/2007US20070292992 Method of aligning a contactless semiconductor device interface
12/20/2007US20070292990 Semiconductor multi-package module having wire bond interconnect between stacked packages
12/20/2007US20070291503 Light-Emitting Diode Arrangement for a High-Power Ligth-Emitting Diode and Method for Producing a Light-Emitting Diode Arrangement
12/20/2007US20070291448 Interposer containing bypass capacitors for reducing voltage noise in an ic device
12/20/2007US20070291146 Semiconductor Chip
12/20/2007US20070290379 Hydrophobic compositions for electronic applications
12/20/2007US20070290378 Novel reworkable underfills for ceramic mcm c4 protection
12/20/2007US20070290377 Three Dimensional Six Surface Conformal Die Coating
12/20/2007US20070290376 Integrated circuit (IC) package stacking and IC packages formed by same
12/20/2007US20070290375 Active device array mother substrate
12/20/2007US20070290374 Component with Encapsulation Suitable for Wlp and Production Method
12/20/2007US20070290373 Multilayer bonding ribbon
12/20/2007US20070290372 Semiconductor device having wire loop and method and apparatus for manufacturing the semiconductor device
12/20/2007US20070290371 Pad structure and method of testing
12/20/2007US20070290370 Device configured to have a nanowire formed laterally between two electrodes and methods for forming the same
12/20/2007US20070290369 Resin Paste For Die Bonding And Its Use
12/20/2007US20070290368 Top layers of metal for high performance IC's
12/20/2007US20070290367 Mold for forming conductive bump, method of fabricating the mold, and method of forming bump on wafer using the mold
12/20/2007US20070290366 Embedded chip package structure and fabricating method thereof
12/20/2007US20070290365 Electronic Device Including a Component Stack and Connecting Elements, and Connecting Elements, and Method for Producing the Electronic Device
12/20/2007US20070290364 Stacked die package for mems resonator system
12/20/2007US20070290363 Semiconductor device having interface chip including penetrating electrode
12/20/2007US20070290362 Integrated inductors and compliant interconnects for semiconductor packaging
12/20/2007US20070290361 Via layout with via groups placed in interlocked arrangement
12/20/2007US20070290360 Electrode Pad on Conductive Semiconductor Substrate
12/20/2007US20070290359 Inexpensive method of fabricating a higher performance capacitance density mimcap integrable into a copper interconnect scheme
12/20/2007US20070290358 Top layers of metal for high performance IC's
12/20/2007US20070290357 Top layers of metal for high performance IC's
12/20/2007US20070290356 Top layers of metal for high performance IC's
12/20/2007US20070290355 Top layers of metal for high performance IC's
12/20/2007US20070290354 Top layers of metal for high performance IC's
12/20/2007US20070290353 Top layers of metal for high performance IC's
12/20/2007US20070290352 Top layers of metal for high performance IC's
12/20/2007US20070290351 Top layers of metal for high performance IC's
12/20/2007US20070290350 Top layers of metal for high performance IC's
12/20/2007US20070290349 Top layers of metal for high performance IC's
12/20/2007US20070290348 Top layers of metal for high performance IC's
12/20/2007US20070290346 Method for manufacturing an electronic component and corresponding electronic component
12/20/2007US20070290345 Structure and method for producing multiple size interconnections
12/20/2007US20070290344 Printed circuit board for package of electronic components and manufacturing method thereof
12/20/2007US20070290343 Electronic component, semiconductor device employing same, and method for manufacturing electronic component
12/20/2007US20070290342 Semiconductor device
12/20/2007US20070290341 Semiconductor package and method of mounting the same
12/20/2007US20070290340 Chip structure
12/20/2007US20070290339 Bulk metallic glass solders, foamed bulk metallic glass solders, foamed-solder bond pads in chip packages, methods of assembling same, and systems containing same
12/20/2007US20070290338 Method and Apparatus for Carbon Dioxide Gettering for a Chip Module Assembly
12/20/2007US20070290337 Electrically Conductive Connection, Electronic Component and Method for Their Production
12/20/2007US20070290336 Semiconductor package having dimpled plate interconnections
12/20/2007US20070290335 High-frequency semiconductor device
12/20/2007US20070290334 High frequency semiconductor device
12/20/2007US20070290333 Chip stack with a higher power chip on the outside of the stack
12/20/2007US20070290332 Stacking structure of chip package
12/20/2007US20070290331 Thermally efficient ccd camera housing
12/20/2007US20070290330 Integrated heat sink
12/20/2007US20070290329 Semiconductor device and method of manufacturing semiconductor device
12/20/2007US20070290328 Light emitting diode module
12/20/2007US20070290327 Circuit board and method for manufacturing semiconductor modules and circuit boards
12/20/2007US20070290326 Multi-dimensional wafer-level integrated antenna sensor micro packaging
12/20/2007US20070290325 Surface mounting structure and packaging method thereof
12/20/2007US20070290324 Printed circuit board and circuit structure for power supply
12/20/2007US20070290323 On-die termination method for multi-chip packages
12/20/2007US20070290322 Thermal improvement for hotspots on dies in integrated circuit packages
12/20/2007US20070290321 Die stack capacitors, assemblies and methods
12/20/2007US20070290320 Carrier for stacked type semiconductor device and method of fabricating the same
12/20/2007US20070290319 Nested integrated circuit package on package system
12/20/2007US20070290318 Multi-chip package structure
12/20/2007US20070290317 Semiconductor device having a multi-layered semiconductor substrate
12/20/2007US20070290316 Stacked packages and systems incorporating the same
12/20/2007US20070290315 Chip system architecture for performance enhancement, power reduction and cost reduction
12/20/2007US20070290314 Contrast Interposer Stacking System And Method
12/20/2007US20070290313 Interposer stacking system and method
12/20/2007US20070290312 Carrier structure stacking system and method
12/20/2007US20070290311 Bond wireless power module wiht double-sided single device cooling and immersion bath cooling
12/20/2007US20070290310 Semiconductor Device and Method for Manufacturing the Same
12/20/2007US20070290309 System and Method for Hermetically Sealing a Package
12/20/2007US20070290308 Package of MEMS device and method for fabricating the same
12/20/2007US20070290307 Light emitting diode module
12/20/2007US20070290306 Wiring substrate and manufacturing method thereof, and semiconductor apparatus
12/20/2007US20070290305 Power Semiconductor Module and Fabrication Method Thereof
12/20/2007US20070290304 High power shunt switch with high isolation and ease of assembly
12/20/2007US20070290303 Dual leadframe semiconductor device package
12/20/2007US20070290302 IC chip package, and image display apparatus using same
12/20/2007US20070290301 Multi-chip stacked package with reduced thickness
12/20/2007US20070290287 Thin film photodetector, method and system
12/20/2007US20070290266 Turn-on-efficient bipolar structures for on-chip esd protection
12/20/2007US20070290234 High switching speed two mask schottky diode with high field breakdown
12/20/2007US20070290204 Semiconductor structure and method for manufacturing thereof
12/20/2007US20070289127 Coreless cavity substrates for chip packaging and their fabrication
12/20/2007DE20321528U1 Wärmesenke Heat sink
12/20/2007DE202007014160U1 Wasserkühlmodul für elektronisches Gerät Water cooling module for electronic device
12/20/2007DE112004002121T5 Kühlsystem für eine elektronische Komponente A cooling system for an electronic component
12/20/2007DE10345496B4 Verfahren zum Bestimmen einer lateralen Position eines Substrats in einer lithographischen Belichtungseinrichtung A method for determining a lateral position of a substrate in a lithographic exposure means
12/20/2007DE10239081B4 Verfahren zur Herstellung einer Halbleitereinrichtung A process for producing a semiconductor device
12/20/2007DE102007022486A1 Fassung für elektrische Teile Socket for electrical parts
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