H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2007
12/26/2007	CN100358145C Manuafcture of semiconductor memory device and semiconductor memory device with side wall isolating layers
12/26/2007	CN100358144C Battery-mounted integrated circuit device
12/26/2007	CN100358142C Method of calibrating marking in laser marking system
12/26/2007	CN100358141C Connection of electric internal connection line junction and semiconductor device
12/26/2007	CN100358140C Method and structure for improving adhesion between intermetal dielectric layer and cap layer
12/26/2007	CN100358139C Device for connecting an IC terminal to a reference potential
12/26/2007	CN100358138C Electronic assembly with vertically connected capacitors and manufacturing method
12/26/2007	CN100358137C Structure of pad in IC and its formation process
12/26/2007	CN100358136C Cycle refrigerating plant
12/26/2007	CN100358135C Heat elimination module and preparation method
12/26/2007	CN100358134C Heat dissipation assembly and protective cover for heat conducting media
12/26/2007	CN100358133C Wafer package with integrated heat dissipating base on chip and heat sink method oa chip
12/26/2007	CN100358132C Thermal interface material producing method
12/26/2007	CN100358131C 散热器 Heat sink
12/26/2007	CN100358130C Radiator and production thereof
12/26/2007	CN100358129C Heat abstractor and method for making same
12/26/2007	CN100358125C Semiconductor device in IC circuit and method for producing it
12/26/2007	CN100358118C Semiconductor device and method of manufacturing the same
12/26/2007	CN100358116C Method for etching polycrystalline silicon
12/26/2007	CN100358114C Method for forming penetrating electrode and chip with penerating electrode
12/26/2007	CN100358108C Semiconductor device capable of preventing pattern from damage
12/26/2007	CN100358103C Semiconductor device and multi-layer substrate used for the same semiconductor device
12/26/2007	CN100358102C Manufacturing method for semiconductor device and determination method for position of semiconductor element
12/26/2007	CN100358101C Circuit device and manufacturing method thereof
12/26/2007	CN100357967C Electronic circuit comprising conductive bridges and method for making such bridges
12/26/2007	CN100357496C Method of forming polymide coating containing dielectric filler on surface of metallic material process for producing copper clad laminate for formation of capacitor layer for printed wiring board and
12/26/2007	CN100357333C Solid silane coupling agent compsn., method for mfg. the same, and resin compsn. contg the same
12/25/2007	USRE39957 Method of making semiconductor package with heat spreader
12/25/2007	US7313253 Methods and tangible objects employing machine readable data in photo-reactive materials
12/25/2007	US7313001 Electrical switch having a mount for an electrical circuit
12/25/2007	US7312996 Heat sink for memory strips
12/25/2007	US7312536 Substrate having a built-in chip and external connection terminals on both sides and a method for manufacturing the same
12/25/2007	US7312535 Semiconductor device having an anti-oxidizing layer that inhibits corrosion of an interconnect layer
12/25/2007	US7312534 Interlayer dielectric and pre-applied die attach adhesive materials
12/25/2007	US7312533 Electronic component with flexible contacting pads and method for producing the electronic component
12/25/2007	US7312532 Dual damascene interconnect structure with improved electro migration lifetimes
12/25/2007	US7312530 Semiconductor device with multilayered metal pattern
12/25/2007	US7312529 Structure and method for producing multiple size interconnections
12/25/2007	US7312528 Semiconductor device having antenna connection electrodes
12/25/2007	US7312527 Low temperature phase change thermal interface material dam
12/25/2007	US7312526 Semiconductor device and method of manufacturing thereof
12/25/2007	US7312525 Thermally enhanced package for an integrated circuit
12/25/2007	US7312524 Method for fabricating an ultralow dielectric constant material as an intralevel or interlevel dielectric in a semiconductor device and electronic device made
12/25/2007	US7312523 Enhanced via structure for organic module performance
12/25/2007	US7312522 Mounting member of semiconductor device, mounting configuration of semiconductor device, and drive unit of semiconductor device
12/25/2007	US7312521 Semiconductor device with holding member
12/25/2007	US7312520 Interface module for connecting LSI packages, and LSI-incorporating apparatus
12/25/2007	US7312519 Stacked integrated circuit package-in-package system
12/25/2007	US7312518 Miniaturized multi-chip module and method for manufacturing the same
12/25/2007	US7312517 System-in-package type semiconductor device
12/25/2007	US7312516 Chip scale package with heat spreader
12/25/2007	US7312515 Semiconductor apparatus including a thin-metal-film resistor element and a method of manufacturing the same
12/25/2007	US7312512 Interconnect structure with polygon cell structures
12/25/2007	US7312505 Semiconductor substrate with interconnections and embedded circuit elements
12/25/2007	US7312482 Semiconductor device, power amplifier device and PC card
12/25/2007	US7312406 Sensor having metallic housing and resin connector, and method of manufacturing the same
12/25/2007	US7312404 Conductive contamination reliability solution for assembling substrates
12/25/2007	US7312261 Metal filler particles dispersed in solvent-free hybrid epoxy polymer matrix; electronics; semiconductors; heat sinks
12/25/2007	US7312164 Selective passivation of exposed silicon
12/25/2007	US7312145 Electronic member, method for making the same, and semiconductor device
12/25/2007	US7312143 Wafer level chip scale package having a gap and method for manufacturing the same
12/25/2007	US7312118 Semiconductor device and method of manufacturing the same
12/25/2007	US7312108 Method for assembling a ball grid array package with two substrates
12/25/2007	US7312107 Semiconductor device and manufacturing method thereof
12/25/2007	US7312106 Method for encapsulating a chip having a sensitive surface
12/25/2007	US7312105 Leadframe of a leadless flip-chip package and method for manufacturing the same
12/25/2007	US7312104 Comprises epoxy resin, curing agent, and inorganic composite oxide particles (silicon dioxide and group III/IV oxide); formed via stripping sheet on bump-mounting wafer
12/25/2007	US7312102 Bridge connection type of chip package and fabricating method thereof
12/25/2007	US7312101 Packaged microelectronic devices and methods for packaging microelectronic devices
12/25/2007	US7312017 Method for burying resist and method for manufacturing semiconductor device
12/25/2007	US7311967 Fusable solder particles and filler in viscoelasticity matrix
12/25/2007	US7311946 Carbiding, nitriding or metallization; vapor deposition of carbides, carbonitrides, nitrides or metal silicon nitrides or carbides from organometallic compounds in presence of adhesion promoter; forming copper film
12/25/2007	US7311881 Chips, and apparatus and method for reaction analysis
12/25/2007	US7311531 Anisotropic conductive connector, conductive paste composition, probe member, wafer inspection device and wafer inspection method
12/25/2007	US7311242 Design of an insulated cavity
12/25/2007	US7311140 Heat sink assembly with overmolded carbon matrix
12/25/2007	US7311008 Semiconductor structure comprising a stress sensitive element and method of measuring a stress in a semiconductor structure
12/21/2007	WO2007147137A2 Stacked die package for mems resonator system
12/21/2007	WO2007146728A1 Method, apparatus, and system for thin die thin thermal interface material in integrated circuit packages
12/21/2007	WO2007146642A2 Semiconductor dual guard ring arrangement
12/21/2007	WO2007146310A2 Flash memory card
12/21/2007	WO2007145925A2 Method of making thermally enhanced substrate-based array package
12/21/2007	WO2007145711A1 Electronic package and method of preparing same
12/21/2007	WO2007145599A1 Integrated circuit package system with offset stacked die
12/21/2007	WO2007145596A1 Light engine device and manufacturing method thereof
12/21/2007	WO2007145522A1 Varied pitch connection device and method
12/21/2007	WO2007145354A1 Cooler
12/21/2007	WO2007145352A1 Heat sink and cooler
12/21/2007	WO2007145303A1 Semiconductor module and method for manufacturing same
12/21/2007	WO2007145237A1 Heat dissipating wiring board and method for manufacturing same
12/21/2007	WO2007145074A1 Electronic component
12/21/2007	WO2007145049A1 Wave demultiplexer
12/21/2007	WO2007103091A3 Assemblies and methods for cooling semiconductor dies
12/21/2007	WO2007094759A3 Semiconductor package with plated connection
12/21/2007	WO2007078767A3 Method and apparatus of using an atomizer in a two-phase liquid vapor enclosure
12/21/2007	WO2007070467A3 Substrate having minimum kerf width
12/21/2007	WO2006076082A3 Method and apparatus for providing structural support for interconnect pad while allowing signal conductance
12/21/2007	WO2006068672A3 Semiconductor die positioning system and a method of bonding a semiconductor die to a substrate
12/21/2007	WO2004036620A3 Method for generating oxide layers on semiconductor substrates
12/20/2007	US20070294653 Method, Structures and Computer Program Product for Implementing Enhanced Wiring Capability for Electronic Laminate Packages

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