Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2007
12/27/2007US20070295982 Micro universal serial bus memory package and manufacturing method the same
12/27/2007US20070295786 Semiconductor device, manufacturing method and apparatus for the same
12/27/2007US20070295532 Multilayer printed wiring board
12/27/2007DE4425389B4 Gleichrichteranordnung sowie Verfahren zur Herstellung einer elektrisch und thermisch leitenden Verbindung und Anordnung zur Durchführung des Verfahrens Rectifier arrangement and methods for making an electrically and thermally conductive connection and arrangement for performing the method
12/27/2007DE202007014910U1 Packungsaufbau eines LED-Chips mit hoher Lichtausbeute in seitlicher Richtung Package structure of an LED chip with high light output in the lateral direction
12/27/2007DE19755675B4 Halbleitergehäuse und Verfahren zu dessen Herstellung Semiconductor package and method for its production
12/27/2007DE10346581B4 Verfahren zum Herstellen einer Halbleitervorrichtung A method of manufacturing a semiconductor device
12/27/2007DE10294771B4 Leistungshalbleitermodul The power semiconductor module
12/27/2007DE10255520B4 Verfahren zur elektrischen Kontaktierung mittels gefüllter Flüssigkeiten und elektronische Bauteile mit derartiger Kontaktierung Method for making electrical contact means filled with liquids and electronic components such contact
12/27/2007DE102007027378A1 Connection arrangement, has galvanically applied metallic layer extending between main surfaces and electrically connecting main surfaces, and spacer unit arranged in recess to space main surface from another main surface
12/27/2007DE102007024413A1 Wireless bond power module assembly for several semiconductor packages, has common support which is connected to top and bottom metallic side surfaces of packages in parallel and exposed for heat transfer to coolant chamber
12/27/2007DE102007021986A1 Integrated metallic cooling body for e.g. silicon carbide base light emitting diode, has contact surfaces applied on surface of metal layer around device, connected with each of electrodes and connectable to external circuit
12/27/2007DE102007019523A1 Halbleiterleistungsmodul The semiconductor power module
12/27/2007DE102006045696B3 Electronic power module for soft-starting of motor, has conductive copper bus bars with two slots, which are arranged in parallel such that remaining parts of bus bars form partition wall between slots
12/27/2007DE102006040960A1 Flip-chip-component for multichip-module, has contact recess and elevation provided at position of interlayer connection to upper surfaces of substrate so that connection is electrically or externally contactable by recess and elevation
12/27/2007DE102006032074B3 Connecting lead for use in e.g. semiconductor component, has connecting regions for connecting two work pieces respectively, where nickel-phosphorus layer on nickel layer is formed in one of connecting regions
12/27/2007DE102006029250A1 Verfahren zur Herstellung eines Transponders A process for producing a transponder
12/27/2007DE102006028811A1 Method for applying solder on interconnecting lines, involves applying covering material on solder pad, where covering material prevents passivation of interconnecting line, which is carried by formation of solder resistance of surface
12/27/2007DE102006027481A1 Leistungshalbleitermodul mit gegeneinander elektrisch isolierten Anschlusselementen Power semiconductor module with mutually electrically insulated connecting elements
12/27/2007DE102005023670B4 Verfahren zum Ausbilden von Metall-Nitrid-Schichten in Kontaktöffnungen und integrierte Schaltung mit derart ausgebildeten Schichten A method of forming metal nitride layers in the contact openings and integrated circuit thus formed layers
12/27/2007DE102005010513B4 Herstellungsverfahren für eine Koaxialleiteranordnung Manufacturing method of a coaxial conductor arrangement
12/27/2007DE102004024923B4 Überspannungsschutz-Vorrichtung Surge protection device
12/26/2007EP1871153A2 Wiring substrate and manufacturing method thereof, and semiconductor apparatus
12/26/2007EP1870934A1 Converter module
12/26/2007EP1870933A2 Thermal improvement for hotspots on dies in integrated circuit packages
12/26/2007EP1870932A1 Stackable integrated circuit package and stacked package formed therefrom
12/26/2007EP1869724A1 Circuitry module
12/26/2007EP1869705A1 Method for the production of enclosed electronic components, and enclosed electronic component
12/26/2007EP1869704A1 Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging
12/26/2007EP1869703A1 Microfluidic cooling of integrated circuits
12/26/2007EP1869699A1 Leadframe, coining tool, and method
12/26/2007EP1869682A1 Magnetically differential inductors and associated methods
12/26/2007EP1639628A4 Heat transfer device and method of making same
12/26/2007EP1245045B1 A method of fabricating a semiconductor device having a reduced signal processing time
12/26/2007CN200997754Y Buckle of radiating fan
12/26/2007CN200997753Y Condenser of cooler for electronic equipment
12/26/2007CN200997752Y Radiater of electronic solid device
12/26/2007CN200997750Y Water-cooling tap
12/26/2007CN200997748Y Structure for combining electronic device with fan
12/26/2007CN200997747Y Radiating module and radiater
12/26/2007CN200997745Y Fan-shaped radiater
12/26/2007CN200997744Y Heat-transfer soaker
12/26/2007CN200997743Y Heat-transferring radiater
12/26/2007CN200997742Y Radiating system
12/26/2007CN200997741Y Radiater
12/26/2007CN200997737Y Radiating base fixer
12/26/2007CN200997399Y Electronic power-supply module
12/26/2007CN200997398Y Large-power LED stand
12/26/2007CN200997397Y CPU fan speed adjuster
12/26/2007CN200997396Y Structure for fixing radiator onto CPU
12/26/2007CN101095239A High temperature memory device
12/26/2007CN101095231A 半导体装置 Semiconductor device
12/26/2007CN101095230A Carbon nanotube-based conductive connections for integrated circuit devices
12/26/2007CN101095229A Structured lead frame
12/26/2007CN101095228A Cooling device for cooling a semiconductor component, in particular, an optoelectronic semiconductor component
12/26/2007CN101095227A Nanotube-based fluid interface material and approach
12/26/2007CN101095226A Integrated circuit nanotube-based substrate
12/26/2007CN101095225A Semiconductor device with embedded heat spreader
12/26/2007CN101095221A Process for fabricating semiconductor integrated circuit device
12/26/2007CN101095219A Carbon nanotube-based filler for integrated circuits
12/26/2007CN101095027A Systems for low cost liquid cooling
12/26/2007CN101094582A Integrated heat sink and light pipe mounting assembly
12/26/2007CN101094580A Device of water cooling head, and manufacturing method
12/26/2007CN101094579A Heat sink for heat pipe
12/26/2007CN101094577A Heat radiation mechanism of soft starter for large current
12/26/2007CN101093878A Organic electroluminescence device
12/26/2007CN101093868A Structure for packaging LED
12/26/2007CN101093861A Mim capacitor and method of making same
12/26/2007CN101093860A Method and structure for operating memory devices on fringes of control gate
12/26/2007CN101093859A Charge monitoring devices and methods for semiconductor manufacturing
12/26/2007CN101093853A Organic light emitting diode display and method for manufacturing the same
12/26/2007CN101093852A Organic electroluminescence display device
12/26/2007CN101093849A Light emitting device having multiple light emitting elements
12/26/2007CN101093846A Wiring structure and display device
12/26/2007CN101093845A Baseplate structure of thin film transistor device array, and preparation method
12/26/2007CN101093844A Baseplate structure of thin film transistor device array, and preparation method
12/26/2007CN101093843A Electrode structure in flat panel display, and fabricating method
12/26/2007CN101093842A Structure of pixel electrode of preventing DGS, and fabricating method
12/26/2007CN101093834A Layout structure of non-volatile memory
12/26/2007CN101093833A Forward body bias-controlled semiconductor integrated circuit
12/26/2007CN101093831A Radio frequency metal-oxide semiconductor device, and manufacturing method
12/26/2007CN101093830A Semiconductor device having symbol pattern utilized as identification sign and its manufacture method
12/26/2007CN101093829A Structure for packaging integration type power model light emitting diode
12/26/2007CN101093828A Structure for packaging compact type large power light emitting diode
12/26/2007CN101093826A RF integrated circuit with ESD protection and esd protection apparatus thereof
12/26/2007CN101093825A Electronic structures utilizing etch resistant boron and phosphorus materials and methods to form same
12/26/2007CN101093824A Interconnected lines structure and wafer
12/26/2007CN101093823A Semiconductor device and electronic device
12/26/2007CN101093822A Structure of material of conducting wire rack for photocell
12/26/2007CN101093821A Mounting structure of electronic component
12/26/2007CN101093820A Connected pad structure
12/26/2007CN101093819A Structure of wafer
12/26/2007CN101093818A Modular capillary pumped loop cooling system
12/26/2007CN101093817A Structure for packaging semiconductor, fabricating method
12/26/2007CN101093808A Resin molding semiconductor device, device and method for manufacturing resin molding semiconductor device
12/26/2007CN101093411A Self-cooling set for computer CPU
12/26/2007CN101093073A Section bar
12/26/2007CN100358154C Bipolar power transistors and mfg. method
12/26/2007CN100358151C Optical component and manufacture method of the same
12/26/2007CN100358148C Optical module
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