| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/01/2008 | US7315443 Notebook computer locking base |
| 01/01/2008 | US7315421 Method of laser marking, laser marking apparatus and method and apparatus for detecting a mark |
| 01/01/2008 | US7315342 Liquid crystal display device with protection to metal wires outside active area |
| 01/01/2008 | US7315226 Strip line device, printed wiring board mounting member, circuit board, semiconductor package, and method of forming same |
| 01/01/2008 | US7315087 Angled elongated features for improved alignment process integration |
| 01/01/2008 | US7315086 Chip-on-board package having flip chip assembly structure and manufacturing method thereof |
| 01/01/2008 | US7315085 Ball grid array package and method thereof |
| 01/01/2008 | US7315084 Copper interconnection and the method for fabricating the same |
| 01/01/2008 | US7315083 Circuit device and manufacturing method thereof |
| 01/01/2008 | US7315082 Semiconductor device having integrated circuit contact |
| 01/01/2008 | US7315081 Semiconductor device package utilizing proud interconnect material |
| 01/01/2008 | US7315080 Ball grid array package that includes a collapsible spacer for separating die adapter from a heat spreader |
| 01/01/2008 | US7315079 Thermally-enhanced ball grid array package structure and method |
| 01/01/2008 | US7315078 Chip-stacked semiconductor package and method for fabricating the same |
| 01/01/2008 | US7315077 Molded leadless package having a partially exposed lead frame pad |
| 01/01/2008 | US7315076 Display device and manufacturing method of the same |
| 01/01/2008 | US7315074 Use of DAR coating to modulate the efficiency of laser fuse blows |
| 01/01/2008 | US7315072 Semiconductor device capable of suppressing current concentration in pad and its manufacture method |
| 01/01/2008 | US7315070 Fingerprint sensor package |
| 01/01/2008 | US7315066 Protect diodes for hybrid-orientation substrate structures |
| 01/01/2008 | US7315000 Electronic module with dual connectivity |
| 01/01/2008 | US7314830 Method of fabricating semiconductor integrated circuit device with 99.99 wt% cobalt |
| 01/01/2008 | US7314822 Method of fabricating stacked local interconnect structure |
| 01/01/2008 | US7314821 Method for fabricating a semiconductor interconnect having conductive spring contacts |
| 01/01/2008 | US7314820 Carrier-free semiconductor package and fabrication method thereof |
| 01/01/2008 | US7314818 Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment |
| 01/01/2008 | US7314817 Microelectronic device interconnects |
| 01/01/2008 | US7314816 Masking layer in substrate cavity |
| 01/01/2008 | US7314780 Semiconductor package, method of production of same, and semiconductor device |
| 01/01/2008 | US7314779 Semiconductor device, manufacturing method for semiconductor device and mounting method for the same |
| 01/01/2008 | US7314777 Chip packaging systems and methods |
| 01/01/2008 | US7314651 Film forming method and film forming device |
| 12/27/2007 | WO2007150032A2 Solderability improvement method for leaded semiconductor package |
| 12/27/2007 | WO2007149901A2 Novel reworkable underfills for ceramic mcm c4 protection |
| 12/27/2007 | WO2007149819A2 Three-dimensional wafer-level integrated circuit assembly |
| 12/27/2007 | WO2007149492A2 Improved packaging of hybrid integrated circuits |
| 12/27/2007 | WO2007149046A1 Quasi-planar circuits with air cavities |
| 12/27/2007 | WO2007149023A1 Cooling and shielding of a high voltage converter |
| 12/27/2007 | WO2007149022A1 An arrangement and a method for cooling |
| 12/27/2007 | WO2007149015A1 High voltage valve group with increased breakdown strength |
| 12/27/2007 | WO2007148795A1 Method for producing metal nitride film, metal oxide film, metal carbide film or composite film of them, and production apparatus therefor |
| 12/27/2007 | WO2007148782A1 Resin-sealed semiconductor device, method for manufacturing the same, base for semiconductor device, and multilayer resin-sealed semiconductor device |
| 12/27/2007 | WO2007148600A1 Semiconductor device and method for manufacturing same |
| 12/27/2007 | WO2007148535A1 Semiconductor device and semiconductor device manufacturing method |
| 12/27/2007 | WO2007148398A1 Resin-sealed module, optical module and method of resin sealing |
| 12/27/2007 | WO2007148154A1 Stackable ic package with top and bottom interconnect |
| 12/27/2007 | WO2007147470A1 Method for producing an injection-moulded part comprising an integrated flexible printed circuit board |
| 12/27/2007 | WO2007147366A1 Ic packages with internal heat dissipation structures |
| 12/27/2007 | WO2007106658A3 Periphery design for charge balance power devices |
| 12/27/2007 | WO2007087249A3 Wafer level packaging to lidded chips |
| 12/27/2007 | WO2007053479A3 Contact pad structure for flip chip semiconductor die |
| 12/27/2007 | WO2007051101A3 Closed loop thermally enhanced flip chip bga |
| 12/27/2007 | WO2007040563A3 Nanostructured friction enhancement using fabricated microstructure |
| 12/27/2007 | WO2005060370A3 Cooling of high power density devices by electrically conducting fluids |
| 12/27/2007 | US20070299172 Circuit-connecting material and circuit terminal connected structure and connecting method |
| 12/27/2007 | US20070298730 Methods of Operating Electronic Devices, and Methods of Providing Electronic Devices |
| 12/27/2007 | US20070298608 Forming a copper diffusion barrier |
| 12/27/2007 | US20070298580 Dual damascene interconnection with metal-insulator-metal capacitor and method of fabricating |
| 12/27/2007 | US20070298545 Method of manufacturing a semiconductor device |
| 12/27/2007 | US20070298543 Method for Manufacturing Heat Sink of Semiconductor Device |
| 12/27/2007 | US20070298542 Multiple internal seal ring micro-electro-mechanical system vacuum packaging method |
| 12/27/2007 | US20070298537 Diamond composite heat spreader and associated methods |
| 12/27/2007 | US20070298526 Programmable semiconductor device |
| 12/27/2007 | US20070298520 Method of Producing an Element Comprising an Electrical Conductor Encircled By Magnetic Material |
| 12/27/2007 | US20070297131 Method And Apparatus For Attaching A Processor And Corresponding Heat Sink To A Circuit Board |
| 12/27/2007 | US20070297108 Ceramic Substrate for Light Emitting Diode Where the Substrate Incorporates ESD Protection |
| 12/27/2007 | US20070296885 Contact for semiconductor and display devices |
| 12/27/2007 | US20070296441 Method and Apparatus for Die Testing on Wafer |
| 12/27/2007 | US20070296091 Semiconductor device having symbol pattern utilized as indentification sign and its manufacture method |
| 12/27/2007 | US20070296090 Die package and probe card structures and fabrication methods |
| 12/27/2007 | US20070296089 Use of a die-attach composition for high power semiconductors, method for attaching same to a printed circuit board and semiconductor device manufactured thereby |
| 12/27/2007 | US20070296088 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
| 12/27/2007 | US20070296087 Semiconductor device and method for manufacturing semiconductor device |
| 12/27/2007 | US20070296086 Integrated circuit package system with offset stack |
| 12/27/2007 | US20070296085 Mim capacitor and method of making same |
| 12/27/2007 | US20070296084 Small grain size, conformal aluminum interconnects and method for their formation |
| 12/27/2007 | US20070296083 Low dielectric constant integrated circuit insulators and methods |
| 12/27/2007 | US20070296082 Semiconductor device having conductive adhesive layer and method of fabricating the same |
| 12/27/2007 | US20070296081 Semiconductor package and method of manufacturing the same |
| 12/27/2007 | US20070296080 Semiconductor devices and method of manufacturing them |
| 12/27/2007 | US20070296079 Heat dissipating structure and method for fabricating the same |
| 12/27/2007 | US20070296078 Semiconductor Module Having Low Thermal Load |
| 12/27/2007 | US20070296077 Semiconductor component and method of manufacture |
| 12/27/2007 | US20070296076 Semiconductor device and apparatus and method for manufacturing the same |
| 12/27/2007 | US20070296075 Package Using Selectively Anodized Metal and Manufacturing Method Thereof |
| 12/27/2007 | US20070296074 Embedded Metal Heat Sink for Semiconductor Device and Method for Manufacturing the Same |
| 12/27/2007 | US20070296073 Three dimensional integrated circuit and method of making the same |
| 12/27/2007 | US20070296072 Compliant integrated circuit package substrate |
| 12/27/2007 | US20070296071 Microelectronic package including temperature sensor connected to the package substrate and method of forming same |
| 12/27/2007 | US20070296070 Semiconductor package having functional and auxiliary leads, and process for fabricating it |
| 12/27/2007 | US20070296069 Semiconductor apparatus with decoupling capacitor |
| 12/27/2007 | US20070296068 In-situ monitoring and method to determine accumulated printed wiring board thermal and/or vibration stress fatigue using a mirrored monitor chip and continuity circuit |
| 12/27/2007 | US20070296067 Bga semiconductor package and method of fabricating the same |
| 12/27/2007 | US20070296066 Electrical connector with elongated ground contacts |
| 12/27/2007 | US20070296065 3D electronic packaging structure having a conductive support substrate |
| 12/27/2007 | US20070296064 Electronic structures utilizing etch resistant boron and phosphorus materials and methods to form same |
| 12/27/2007 | US20070296063 Spin coating apparatus and coating method of composition for antireflection layer |
| 12/27/2007 | US20070296059 Semiconductor device |
| 12/27/2007 | US20070296040 Semiconductor device, and life prediction circuit and life prediction method for semiconductor device |
| 12/27/2007 | US20070296039 Semiconductor Device Structures Incorporating Voids and Methods of Fabricating Such Structures |